Electrical connector assembly with shielding surrounding board-to-board connectors in connected state

US11539170B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11539170-B2
Application numberUS-202117199895-A
CountryUS
Kind codeB2
Filing dateMar 12, 2021
Priority dateMay 13, 2020
Publication dateDec 27, 2022
Grant dateDec 27, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In a connector assembly in which a first connector that includes a first insulator, first terminals, and a first shell and is mounted on a first board and a second connector that includes a second insulator, second terminals, and a second shell and is mounted on a second board are connected with each other, a first ground pattern that has a frame-like shape and is formed on the first board is soldered to the first shell with first solder, and a second ground pattern that has a frame-like shape and is formed on the second board is soldered to the second shell with second solder. An inner space in which the first terminals and the second terminals are positioned is completely shielded from the outside without any gap.

First claim

Opening claim text (preview).

What is claimed is: 1. A connector assembly having a first connector that includes a first insulator, a first terminal held by the first insulator, and a first shell having a frame-like shape, and is mounted on a first board; and a second connector that includes a second insulator, a second terminal held by the second insulator, and a second shell having a frame-like shape, and is mounted on a second board, wherein the first connector and the second connector are connected with each other in a state in which the first board and the second board are parallel to each other, the first terminal and the second terminal are connected with each other, and the first shell and the second shell are connected with each other, the connector assembly comprising: a first ground pattern having a frame-like shape and formed on the first board, the first ground pattern being soldered to the first shell with first solder provided along a whole circumference of the first ground pattern; and a second ground pattern having a frame-like shape and formed on the second board, the second ground pattern being soldered to the second shell with second solder provided along a whole circumference of the second ground pattern, wherein a space that is between the first board and the second board and that is surrounded by the first ground pattern and the second ground pattern when viewed from a direction perpendicular to the first board and the second board is completely shielded from an outside without any gap by at least one of the first shell, the first solder, the second shell, and the second solder when viewed from any direction parallel to the first board and the second board, and there is a cutout on a lower end of the first shell, the lower end of the first shell facing the first board, and the cutout is closed with the first solder. 2. A connector assembly having a first connector that includes a first insulator, a first terminal held by the first insulator, and a first shell having a frame-like shape, and is mounted on a first board; and a second connector that includes a second insulator, a second terminal held by the second insulator, and a second shell having a frame-like shape, and is mounted on a second board, wherein the first connector and the second connector are connected with each other in a state in which the first board and the second board are parallel to each other, the first terminal and the second terminal are connected with each other, and the first shell and the second shell are connected with each other, the connector assembly comprising: a first ground pattern having a frame-like shape and formed on the first board, the first ground pattern being soldered to the first shell with first solder provided along a whole circumference of the first ground pattern; and a second ground pattern having a frame-like shape and formed on the second board, the second ground pattern being soldered to the second shell with second solder provided along a whole circumference of the second ground pattern, wherein a space that is between the first board and the second board and that is surrounded by the first ground pattern and the second ground pattern when viewed from a direction perpendicular to the first board and the second board is completely shielded from an outside without any gap by at least one of the first shell, the first solder, the second shell, and the second solder when viewed from any direction parallel to the first board and the second board, and there is a cutout on a lower end of the second shell, the lower end of the second shell facing the second board, and the cutout is closed with the second solder.

Assignees

Inventors

Classifications

  • Patterned shielding planes, ground planes or power planes (H05K1/0253 takes precedence) · CPC title

  • the shield being mounted on a PCB and connected to conductive members · CPC title

  • High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse] {(coaxial coupling devices specially adapted for high frequency H01R24/40; for flat or ribbon cable connectors H01R12/774; for coaxial cable H01R9/05)} · CPC title

  • connecting to other rigid printed circuits or like structures · CPC title

  • Pins, blades, or sockets shaped, or provided with separate member, to retain co-operating parts together · CPC title

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Frequently asked questions

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What does patent US11539170B2 cover?
In a connector assembly in which a first connector that includes a first insulator, first terminals, and a first shell and is mounted on a first board and a second connector that includes a second insulator, second terminals, and a second shell and is mounted on a second board are connected with each other, a first ground pattern that has a frame-like shape and is formed on the first board is s…
Who is the assignee on this patent?
Japan Aviation Electronics Ind Ltd
What technology area does this patent fall under?
Primary CPC classification H01R12/716. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 27 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).