Semiconductor processing apparatus and sealing device

Patent metadata

Field	Value
Publication number	US-11538696-B2
Application number	US-201916663385-A
Country	US
Kind code	B2
Filing date	Oct 25, 2019
Priority date	Oct 25, 2019
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

A chamber apparatus comprises a lower and an upper chamber body, and a gasket member. The lower chamber body defines a receiving region and a first receiving groove. The upper chamber body disposed above the lower chamber body and defines a second receiving groove projectively align to the first receiving groove. The second receiving groove is configured to establish sealing coupling with the lower chamber body so as to form a chamber enclosure region. The gasket member includes a conductive member and an elastomeric member. The conductive member configured to laterally surround the receiving region and respectively fit into the lower chamber body and the upper chamber body. The elastomeric member is protruded from the conductive member and extended toward the receiving region, configured to be compressed by the upper and the lower chamber body so as to seal the chamber enclosure region.

First claim

What is claimed is:

1. A semiconductor processing apparatus, comprising:
a lower chamber body defining a receiving region and a first receiving groove;
an upper chamber body disposed above the lower chamber body defining a second receiving groove projectively align to the first receiving groove, configured to establish sealing coupling with the lower chamber body so as to form a chamber enclosure region at the receiving region; and
a gasket member configured to be disposed between the lower chamber body and the upper chamber body, the gasket member including:
a conductive member configured to laterally surround the receiving region and respectively fit into the lower chamber body and the upper chamber body, and
an elastomeric member protruded from the conductive member and extended toward the receiving region, configured to be compressed by the upper chamber body and the lower chamber body so as to seal the chamber enclosure region.

2. The apparatus of claim 1 , wherein
in a cross section of the gasket member,
the conductive member defines a mortise at an inner sidewall surface thereof that is facing the receiving region of the lower chamber body; and
the elastomeric member includes a tenon configured to be detachably mated with the mortise.

3. The apparatus of claim 2 , wherein
in the cross section of the gasket member, a thickness of an engagement portion of the conductive member that defines the mortise is larger than 2 mm.

4. The apparatus of claim 2 , wherein
in the cross section of the gasket member, a ratio between the thickness of the engagement portion of the conductive member that defines the mortise and a depth of the mortise is in a range from about 0.8 to 1.4.

5. The apparatus of claim 2 , wherein
the engagement portion of the conductive member that defines the mortise is located at the middle of the conductive member.

6. The apparatus of claim 2 , wherein
in the cross section of the gasket member, the tenon comprises a dovetail profile.

7. The apparatus of claim 2 , wherein
in the cross section of the gasket member, a height of the conductive member is larger than a width of the conductive member.

8. The apparatus of claim 1 , wherein
in a cross section of the gasket member,
the elastomeric member defines a mortise at an outer sidewall surface thereof that is facing to the conductive member; and
the conductive member includes a tenon protruded towards the receiving region of the lower chamber body configured to detachably mated with the mortise.

9. The apparatus of claim 1 , wherein in a cross section of the apparatus,
the elastomeric member includes a profile defining an uncompressed height;
the lower chamber body further includes
a lower annular clamping surface extending from the first receiving groove towards the receiving region, configured to support the elastomeric member;
the upper chamber body further includes
an upper annular clamping surface aligning with the lower annular clamping surface, configured to compress the elastomeric member and be separated from the lower clamping surface by a predetermined distance when the upper chamber body is assembled with the lower chamber body;
wherein a ratio between the predetermined distance and the uncompressed height of the elastomeric member is in a range from about 0.5 to 1.

10. The apparatus of claim 1 , wherein in a cross section of the apparatus,
the first receiving groove of the lower chamber body and the second receiving groove of the upper chamber body having a minor symmetry with respect to a horizontal plane defined between the lower chamber body and the upper chamber body.

Assignees

• Xia Tai Xin Semiconductor Qing Dao Ltd

Inventors

• Koo Deog-Ja
• Kim Dea-Jin

Classifications

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H01J37/32513 Primary

  Sealing means, e.g. sealing between different parts of the vessel · CPC title

• H01J2237/3321

  CVD [Chemical Vapor Deposition] · CPC title

• H01J2237/334

  Etching · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title