Coil electronic component

Patent metadata

Field	Value
Publication number	US-11538616-B2
Application number	US-201916399534-A
Country	US
Kind code	B2
Filing date	Apr 30, 2019
Priority date	Aug 22, 2018
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

A coil electronic component includes a body, in which a coil portion is embedded, including a plurality of magnetic particles, and an external electrode connected to the coil portion. Among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, and a second layer disposed on a surface of the first layer. The first layer is an inorganic coating layer containing a phosphorus (P) component, and the second layer is an atomic layer deposition layer.

First claim

What is claimed is:

1. A coil electronic component comprising:
a body, in which a coil portion is embedded, including a plurality of magnetic particles;
an external electrode connected to the coil portion,
wherein among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, a second layer disposed on a surface of the first layer, and a third layer disposed on a surface of the second layer,
the first and third layers are inorganic coating layers containing a phosphorus (P) component, and
the second layer includes an oxide having at least one of Al, Si, Ti, Zn, Hf, Ta, Nb, Sc, Y, Mg, B, or Ge.

2. The coil electronic component of claim 1 , wherein the first layer has a thickness of 10 to 15 nanometers.

3. The coil electronic component of claim 1 , wherein the second layer has a thickness of 10 to 15 nanometers.

4. The coil electronic component of claim 1 , wherein a sum of thicknesses of the first and second layers is 20 to 30 nanometers.

5. The coil electronic component of claim 1 , wherein the first and second layers are formed of different materials to each other.

6. The coil electronic component of claim 1 , wherein the third layer is formed of a same material as the first layer.

7. The coil electronic component of claim 1 , wherein the plurality of magnetic particles include a plurality of first particles and a plurality of second particles having sizes smaller than those of the first particles.

8. The coil electronic component of claim 7 , wherein the first particle is formed of an iron-based (Fe-based) alloy.

9. The coil electronic component of claim 7 , wherein the first particle has a diameter of 10 to 25 micrometers.

10. The coil electronic component of claim 7 , wherein the second particle is formed of pure iron.

11. The coil electronic component of claim 7 , wherein the second particle has a diameter of 5 micrometers or less.

12. The coil electronic component of claim 1 , wherein the second layer is an atomic layer deposition layer.

13. The coil electronic component of claim 1 , wherein the second layer includes a ceramic.

14. The coil electronic component of claim 1 , wherein the second layer does not contain the phosphorus (P) component.

Assignees

• Samsung Electro Mech

Inventors

• Kim Kyung Lock
• Moon Byeong Cheol
• Choi Chang Hak
• Yeo Jeong Gu
• Lee Young Il

Classifications

• H01F27/2804

  Printed windings · CPC title

• H01F27/29

  Terminals; Tapping arrangements {for signal inductances} · CPC title

• H01F2027/2809

  on stacked layers · CPC title

• H01F27/32

  Insulating of coils, windings, or parts thereof · CPC title

• H01F27/255 Primary

  made from particles (H01F27/26 takes precedence) · CPC title