Shielding tape with features for mitigating micro-fractures and the effects thereof

US11538605B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11538605-B2
Application numberUS-202117240031-A
CountryUS
Kind codeB2
Filing dateApr 26, 2021
Priority dateJan 25, 2018
Publication dateDec 27, 2022
Grant dateDec 27, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In an electronic cable, a shielding tape prevents and mitigates the creation and propagation of micro-fractures and the deleterious effects thereof. In some embodiments, the shielding tape has layers which are oriented in a non-zero transverse relation with respect to each other, or have been treated to have non-zero orientations. Other embodiments include micro-fracture propagation mitigation means, such as perforations, ridges, waffling, and dimpling. In some embodiments, the layers of the shielding tape are bonded to each other with an electrically-conductive elastomeric adhesive. In other embodiments, the shielding tape is wrapped around a cable's dielectric and form an overlap gap, which is filled by an electrically-conductive elastomeric adhesive.

First claim

Opening claim text (preview).

The invention claimed is: 1. Shielding tape in an electronic cable, the shielding tape comprising: a first metallic layer having a first orientation along which micro-fractures are predisposed to form; a second metallic layer having a second orientation along which micro-fractures are predisposed to form; and the first and second orientations have a non-zero transverse relation with respect to each other. 2. The shielding tape of claim 1 , wherein the first and second orientations in the first and second metallic layers are formed by burnishing the first and second metallic layers. 3. The shielding tape of claim 1 , wherein the first metallic layer is arranged with a non-zero transverse orientation with respect to the second metallic layer.

Assignees

Inventors

Classifications

  • Features relating to screening tape per se · CPC title

  • Internal space filling-up means · CPC title

  • H01B7/22Primary

    Metal wires or tapes, e.g. made of steel · CPC title

  • H05K9/0098Primary

    for shielding electrical cables · CPC title

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Frequently asked questions

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What does patent US11538605B2 cover?
In an electronic cable, a shielding tape prevents and mitigates the creation and propagation of micro-fractures and the deleterious effects thereof. In some embodiments, the shielding tape has layers which are oriented in a non-zero transverse relation with respect to each other, or have been treated to have non-zero orientations. Other embodiments include micro-fracture propagation mitigation …
Who is the assignee on this patent?
Pct int inc
What technology area does this patent fall under?
Primary CPC classification H01B7/22. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 27 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).