Display substrate, method for manufacturing the same, and display panel

Patent metadata

Field	Value
Publication number	US-11537165-B2
Application number	US-202016935147-A
Country	US
Kind code	B2
Filing date	Jul 21, 2020
Priority date	Sep 10, 2019
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

Embodiments of the present disclosure propose a display substrate, a method for manufacturing the same, and a display panel. In an embodiment, the display substrate includes a flexible substrate, the flexible substrate includes a bending region, the bending region has a first groove, wherein at least an inner wall of the first groove has a first flexible layer, at least one rib is provided on the first flexible layer at a bottom of the first groove, a wiring layer covers the rib on the first flexible layer, and the wiring layer has alternating protrusions and recessions, and an orthographic projection of the protrusions on the flexible substrate and an orthographic projection of the rib on the flexible substrate at least partially overlap.

First claim

What is claimed is:

1. A display substrate, comprising a flexible substrate, the flexible substrate comprising a bending region, the bending region having a first groove,
wherein at least an inner wall of the first groove has a first flexible layer, at least one rib is provided on the first flexible layer at a bottom of the first groove, a wiring layer covers the rib on the first flexible layer, and the wiring layer has alternating protrusions and recessions, and an orthographic projection of the protrusions on the flexible substrate and an orthographic projection of the rib on the flexible substrate at least partially overlap; and
wherein a planarization layer is provided on the wiring layer, at least one second groove is provided in the planarization layer at a side of the planarization layer away from the flexible substrate, and an orthographic projection of the second groove on the flexible substrate and the orthographic projection of the rib on the flexible substrate at least partially overlap.

2. The display substrate according to claim 1 , wherein an included angle between a side wall and the bottom of the first groove is less than about 50°.

3. The display substrate according to claim 1 , wherein the first flexible layer has a third groove in the first groove, the wiring layer has a fourth groove in the third groove, and the planarization layer has the second groove in the fourth groove.

4. The display substrate according to claim 1 , wherein the first flexible layer is made from a second polyimide photoresist.

5. The display substrate according to claim 1 , wherein:
the wiring layer is made from one or more of platinum, ruthenium, gold, silver, molybdenum, chromium, aluminum, tantalum, titanium, or tungsten; and
the wiring layer has a single-layer, double-layer or multi-layer structure.

6. The display substrate according to claim 1 , wherein the rib and the first flexible layer are integrally formed from a same material.

7. The display substrate according to claim 1 , wherein:
the rib and the first flexible layer are formed separately from different materials, and
the rib is made from SiNx and/or SiOx.

8. The display substrate according to claim 1 , wherein, in the first groove,
the first flexible layer is made from a second polyimide photoresist;
the wiring layer is made from one or more of platinum, ruthenium, gold, silver, molybdenum, chromium, aluminum, tantalum, titanium, or tungsten; and
the planarization layer is made from polyimide (PI).

9. A method for manufacturing a display substrate, comprising:
providing a flexible substrate, the flexible substrate comprising a bending region;
forming a first groove in the bending region;
forming a first flexible layer on at least an inner wall of the first groove;
forming at least one rib on the first flexible layer at a bottom of the first groove;
forming a wiring layer that covers the rib on the first flexible layer, so that the wiring layer is formed with alternating protrusions and recessions, and an orthographic projection of the protrusions on the flexible substrate and an orthographic projection of the rib on the flexible substrate at least partially overlap; and
forming a planarization layer having at least one second groove on the wiring layer,
wherein the second groove is formed in the planarization layer at a side of the planarization layer away from the flexible substrate, and an orthographic projection of the second groove on the flexible substrate and the orthographic projection of the rib on the flexible substrate at least partially overlap.

10. The method according to claim 9 , wherein the steps of forming a first groove in the bending region, forming a first flexible layer on at least an inner wall of the first groove, and forming at least one rib on the first flexible layer at a bottom of the first groove, further comprise:
forming a buffer layer, a first insulating layer, a second insulating layer and an interlayer insulating layer in sequence on the flexible substrate;
forming the first groove in the bending region, the first groove exposing the flexible substrate; and
coating a second polyimide photoresist so that the second polyimide photoresist covers the interlayer insulating layer and the flexible substrate exposed by the first groove, exposing and developing the second polyimide photoresist to form the first flexible layer with a third groove in the first groove, the at least one rib being formed on the first flexible layer at the bottom of the first groove.

11. The method according to claim 10 , further comprising:
coating a first polyimide photoresist on the wiring layer, exposing and developing the first polyimide photoresist to form a planarization layer having at least one second groove,
wherein the second groove is formed in the planarization layer at a side of the planarization layer away from the flexible substrate.

12. The method according to claim 11 , wherein the step of forming a wiring layer that covers the rib on the first flexible layer, so that the wiring layer is formed with alternating protrusions and recessions, and an orthographic projection of the protrusions on the flexible substrate and an orthographic projection of the rib on the flexible substrate at least partially overlap, further comprises:
depositing the wiring layer, the wiring layer covering the first flexible layer, and a fourth groove being formed on the wiring layer in the third groove; and
etching the wiring layer between adjacent ribs by a part of a thickness of the wiring layer through a patterning process, so that the wiring layer is formed with alternating protrusions and recessions, and the orthographic projection of the protrusions on the flexible substrate and the orthographic projection of the rib on the flexible substrate at least partially overlap.

13. The method according to claim 9 , wherein the steps of forming a first groove in the bending region, forming a first flexible layer on at least an inner wall of the first groove, and forming at least one rib on the first flexible layer at a bottom of the first groove, further comprise:
forming a buffer layer, a first insulating layer, a second insulating layer and an interlayer insulating layer in sequence on the flexible substrate;
forming the first groove in the bending region, the first groove exposing the flexible substrate;
coating a second polyimide photoresist so that the second polyimide photoresist covers the interlayer insulating layer and the flexible substrate exposed by the first groove, exposing and developing the second polyimide photoresist to form the first flexible layer with a third groove in the first groove; and
forming an inorganic material layer on the first flexible layer through a patterning process, the inorganic material layer comprising the at least one rib.

14. The method according to claim 13 , wherein the step of forming a wiring layer that covers the rib on the first flexible layer, so that the wiring layer is formed with alternating protrusions and recessions, and an orthographic projection of the protrusions on the flexible substrate and an orthographic projection of the rib on the flexible substrate at least partially overlap, further comprises:
depositing the wiring layer, the wiring layer covering the interlayer insulating layer and the first flexible layer, and a fourth groove being formed on the wiring layer in the third groove; and
etching the wiring layer between adjacent ribs by a part of a thickness of the wiring layer through a patterning process, so that the wiring layer is formed with alternating protrusions and recessions, and the or

Assignees

• Mianyang Boe Optoelectronics Tech Co Ltd
• Boe Technology Group Co Ltd

Inventors

• He Haizhou
• Shi Ming
• Hu Guoren
• Sun Wen
• Zhao Zhangrui

Classifications

• G06F1/189

  Power distribution · CPC title

• G06F1/1652 Primary

  the display being flexible, e.g. mimicking a sheet of paper, or rollable · CPC title

• Y02E10/549

  Organic PV cells · CPC title

• G09F9/301

  flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title