Magnetic-sensor device and method for producing same

Patent metadata

Field	Value
Publication number	US-11536781-B2
Application number	US-202117301795-A
Country	US
Kind code	B2
Filing date	Apr 14, 2021
Priority date	Apr 29, 2020
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

The present disclosure relates to a magnetic-sensor device comprising a circuit board made of an electrically insulating material and having conductor tracks, and comprising a permanent magnet surface-mounted on the circuit board, and a magnetic-field sensor connected to the conductor tracks of the circuit board. An SMD component for populating a circuit board is also proposed, which SMD component comprises a permanent magnet and a magnetic-field sensor.

First claim

The invention claimed is:

1. A magnetic-sensor device comprising:
a circuit board made of an electrically insulating material and having conductor tracks;
a permanent magnet mounted on the circuit board,
wherein the permanent magnet is surface-mounted on the circuit board or surface-mounted on the circuit board via a conductive material; and

a magnetic-field sensor connected to the conductor tracks of the circuit board.

2. The magnetic-sensor device as claimed in claim 1 , wherein the permanent magnet is connected to the circuit board using at least one of an adhesive connection, soldered connection, or snap-action connection.

3. The magnetic-sensor device as claimed in claim 1 , wherein the permanent magnet is arranged between the circuit board and the magnetic-field sensor or beside the magnetic-field sensor on the circuit board.

4. The magnetic-sensor device as claimed in claim 1 , wherein the permanent magnet is embedded at least partially into an electrically conductive material, and soldered to the circuit board via the electrically conductive material.

5. The magnetic-sensor device as claimed in claim 4 , wherein an electrically insulating layer is provided between the permanent magnet and the electrically conductive material.

6. The magnetic-sensor device as claimed in claim 1 , wherein the permanent magnet is soldered to the circuit board by a bottom face, and to the magnetic-field sensor by an opposite top face.

7. The magnetic-sensor device as claimed in claim 1 , wherein the insulating material of the circuit board comprises a recess, in which the permanent magnet is accommodated.

8. The magnetic-sensor device as claimed in claim 7 , wherein the magnetic-field sensor is arranged on the circuit board above the permanent magnet located in the recess.

9. The magnetic-sensor device as claimed in claim 2 , wherein the permanent magnet comprises at least one elastic snap-action member, and the circuit board comprises a corresponding elastic receiving member.

10. The magnetic-sensor device as claimed in claim 1 , wherein the permanent magnet and the magnetic-field sensor form a single surface-mounted device (SMD) component mounted on the circuit board.

11. The magnetic-sensor device as claimed in claim 10 , wherein the permanent magnet and the magnetic-field sensor are enclosed by a shared SMD package.

12. The magnetic-sensor device as claimed in claim 10 , wherein the magnetic-field sensor is enclosed by an SMD package, and the permanent magnet is arranged on an external face of the SMD package.

13. A method for producing a magnetic-sensor device, comprising:
providing a circuit board made of an electrically insulating material and having conductor tracks;
mounting a permanent magnet on the circuit board,
wherein the permanent magnet is surface-mounted on the circuit board or surface-mounted on the circuit board via a conductive material; and

connecting a magnetic-field sensor to the conductor tracks of the circuit board.

14. The method as claimed in claim 13 , wherein the permanent magnet is surface-mounted between the circuit board and the magnetic-field sensor or beside the magnetic-field sensor on the circuit board.

15. The method as claimed in claim 13 , wherein during surface-mounting of the permanent magnet, the circuit board is placed on a soft-magnetic material.

16. The method as claimed in claim 13 , wherein the permanent magnet is surface-mounted on the circuit board by soldering or adhesive bonding.

17. The method as claimed in claim 13 , wherein once the permanent magnet has been fixed in place, the magnetic-field sensor and additional components are soldered onto the circuit board.

18. A surface-mounted device (SMD) component for populating a circuit board, wherein the SMD component comprises:
a permanent magnet configured to be surface-mounted on the circuit board,
wherein the circuit board is made of an electrically insulating material and includes conductor tracks; and

a magnetic-field sensor configured to be connected to the conductor tracks of the circuit board.

19. The SMD component as claimed in claim 18 , wherein the permanent magnet and the magnetic-field sensor are enclosed by a shared SMD package.

20. The SMD component as claimed in claim 18 , wherein the magnetic-field sensor is enclosed by an SMD package, and the permanent magnet is arranged on an external face of the SMD package.

Assignees

• Infineon Technologies Ag

Inventors

• Theuss Horst
• Elian Klaus
• Wietschorke Helmut

Classifications

• G01R33/038 Primary

  using permanent magnets, e.g. balances, torsion devices · CPC title

• G01R33/091

  Constructional adaptation of the sensor to specific applications · CPC title

• G01R33/0047

  Housings or packaging of magnetic sensors (packaging of semiconductor devices H10W99/00); Holders · CPC title

• G01R33/072

  Constructional adaptation of the sensor to specific applications · CPC title