Embedded radial fired laser igniter

Patent metadata

Field	Value
Publication number	US-11536551-B1
Application number	US-202117458789-A
Country	US
Kind code	B1
Filing date	Aug 27, 2021
Priority date	Aug 27, 2020
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

A laser ignition assembly comprises first and second mounting surfaces opposed to each other. A central cavity is formed through the surfaces and sized to receive energetic material therein. A vertical solder bridge is formed between the surfaces and an edge emitting laser diode disposed between the surfaces. The laser diode is oriented such that a light fluence therefrom is directed in a radial direction into the central cavity. The surfaces can be circuit boards, e.g., copper clad, rigid circuit boards, and have an annular shape. The central cavity can be further defined by an interboard gap between the surfaces. The ignition assembly can fit within a primer cup of a munition.

First claim

What is claimed is:

1. A laser ignition assembly comprising:
a first mounting surface and a second mounting surface, said first and second mounting surface opposed to each other;
a central cavity formed in the first mounting surface and second mounting surface, said central cavity sized and dimensioned to receive energetic material;
a vertical solder bridge formed between the first mounting surface and second mounting surface; and
an edge emitting laser diode disposed between the first mounting surface and the second mounting surface and oriented such that a light fluence from said edge emitting laser diode is directed in a radial direction into the central cavity.

2. The laser ignition assembly of claim 1 wherein the first mounting surface and second mounting surface are circuit boards.

3. The laser ignition assembly of claim 2 wherein the first mounting surface and second mounting surface are copper clad rigid circuit boards.

4. The laser ignition assembly of claim 1 wherein the first mounting surface and second mounting surface are annular shaped.

5. The laser ignition assembly of claim 4 wherein the central cavity is further defined by an interboard gap between said first mounting surface and second mounting surface.

6. The laser ignition assembly of claim 4 wherein the first mounting surface and second mounting surface are sized and dimensioned to fit within a primer volume of a munition.

7. The laser ignition assembly of claim 6 wherein the primer volume is a primer cup.

8. The laser ignition assembly of claim 1 wherein the edge emitting laser diode is a surface mount laser diode chip.

9. A laser ignition assembly comprising:
a first circuit board having a bottom surface and a second circuit board having a top surface, said top surface and bottom surface being opposed to each other and wherein the first circuit board and the second circuit board are annular-shaped;
a central cavity defined by a hole in each of the first circuit board and the second circuit board, said central cavity sized and dimensioned to receive energetic material;
a vertical solder bridge formed between the first circuit board and second circuit board; and
an edge emitting laser diode surface mounted to the bottom surface and the top surface and oriented such that a light fluence from said edge emitting laser diode is directed in a radial direction into the central cavity.

10. The laser ignition assembly of claim 9 wherein the first circuit board and second circuit board are copper clad rigid circuit boards.

11. The laser ignition assembly of claim 9 wherein the first circuit board and the second circuit board are sized and dimensioned to fit within a primer volume of a munition.

12. The laser ignition assembly of claim 11 wherein the primer volume is a primer cup.

Assignees

• Us Gov Sec Army
• Us Army

Inventors

• Redington Stephen
• Hirlinger John
• Burke Gregory

Classifications

• F42C19/12 Primary

  electric · CPC title

• H01S5/0233

  Mounting configuration of laser chips · CPC title

• H05K2201/1053

  Mounted components directly electrically connected to each other, i.e. not via the PCB · CPC title

• H05K2201/10174

  Diode · CPC title

• H05K3/368

  parallel to each other (H05K3/361 takes precedence) · CPC title