Cutting elements, and related earth-boring tools and methods

Patent metadata

Field	Value
Publication number	US-11536091-B2
Application number	US-201815993362-A
Country	US
Kind code	B2
Filing date	May 30, 2018
Priority date	May 30, 2018
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A 3 XZ n-1 , where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.

First claim

What is claimed is:

1. A cutting element, comprising:
a cutting table comprising:
inter-bonded diamond particles; and
a thermally stable material within interstitial spaces between the inter-bonded diamond particles, the thermally stable material comprising:
a carbide precipitate having the general chemical formula:
A 3 XZ 1-n ,
where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U;
X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P;
Z comprises C; and
n is greater than or equal to 0 and less than or equal to 0.75; and

one or more of an FCC L1 2 phase precipitate, an FCC DO 22 phase precipitate, a D8 5 phase precipitate, a DO 19 phase precipitate, a BCC/B2 phase precipitate, and an FCC L1 0 phase precipitate.

2. The cutting element of claim 1 , further comprising a supporting substrate directly attached to an end of the cutting table.

3. The cutting element of claim 2 , wherein the supporting substrate comprises:
a homogenized binder comprising C, W, one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U, and one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; and
WC particles dispersed in the homogenized binder.

4. The cutting element of claim 3 , wherein the homogenized binder has a melting temperature greater than or equal to about 750° C.

5. A cutting element, comprising:
a cutting table comprising:
inter-bonded diamond particles; and
a thermally stable material within interstitial spaces between the inter-bonded diamond particles, the thermally stable material comprising a carbide precipitate having the general chemical formula:
A 3 XZ 1-n ,
where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U;
X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P;
Z comprises C; and
n is greater than or equal to 0 and less than or equal to 0.75; and

a supporting substrate directly attached to an end of the cutting table, the supporting substrate comprising:
a homogenized binder comprising a substantially homogeneous peritectic alloy comprising C, W, one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U, and one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; and
WC particles dispersed in the homogenized binder.

6. A cutting element, comprising:
a cutting table comprising:
inter-bonded diamond particles; and
a thermally stable material within interstitial spaces between the inter-bonded diamond particles, the thermally stable material comprising a carbide precipitate having the general chemical formula:
A 3 XZ 1-n ,
where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U;
X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P;
Z comprises C; and
n is greater than or equal to 0 and less than or equal to 0.75; and

a supporting substrate directly attached to an end of the cutting table, the supporting substrate comprising:
a homogenized binder substantially free of Co, the homogenized binder comprising C, W, one or more of Sc, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U, and one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; and
WC particles dispersed in the homogenized binder.

7. The cutting element of claim 2 , wherein:
a ratio of a combined height of the supporting substrate and the cutting table to a maximum outer diameter of the cutting table is within a range of from about 0.1 to about 50; and
the cutting table exhibits a maximum thickness within a range of from about 0.3 mm to about 5 mm.

8. The cutting element of claim 2 , wherein the cutting table comprises:
an apex; and
at least one side surface extending from at least one location at or proximate an interface between the supporting substrate and the cutting table toward the apex, the at least one side surface extending at one or more angles within a range of from about 5 degrees to about 85 degrees relative to a side surface of the supporting substrate.

9. The cutting element of claim 8 , wherein the at least one side surface of the cutting table comprises:
at least one conical side surface extending upwardly and inwardly from at least one location at or proximate an interface between the supporting substrate and the cutting table toward the apex; and
at least one flat side surface adjacent the at least one conical side surface and extending upwardly and inwardly from at least one additional location at or proximate the interface between the supporting substrate and the cutting table toward the apex.

Assignees

• Baker Hughes Holdings Llc
• Baker Hughes Holding LLC

Inventors

• Cao Wanjun
• Bird Marc W

Classifications

• C04B2235/404

  Refractory metals · CPC title

• C22C29/08

  based on tungsten carbide · CPC title

• C22C2026/006

  with additional metal compounds being carbides · CPC title

• E21B10/5735 Primary

  Interface between the substrate and the cutting element · CPC title

• C04B35/56

  based on carbides {or oxycarbides (containing free metal binder C22C29/00)} · CPC title