Molded product, metal-clad laminate, printed wiring board, and methods for their production

Patent metadata

Field	Value
Publication number	US-11535015-B2
Application number	US-202016808502-A
Country	US
Kind code	B2
Filing date	Mar 4, 2020
Priority date	Oct 31, 2017
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

To provide a molded product, a metal-clad laminate and a printed wiring board, each of which contains a tetrafluoroethylene type polymer, whereby an decrease in electrical characteristics is inhibited and a hole can be easily bored with UV-YAG laser; and methods for their production. A molded product containing a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength range where the extinction coefficient becomes to be from 1.2 to 4.5 at from 200 to 380 nm; and a method for its production. A metal-clad laminate having a conductive metal layer and a layer of the molded product; and a method for its production. A printed wiring board provided with the metal-clad laminate and having through-holes in the thickness direction of the polymer layer.

First claim

What is claimed is:

1. A method for producing a film, comprising:
heat-molding a material which comprises a melt-moldable tetrafluoroethylene type polymer comprising at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group, an amide group, an amino group, and an isocyanate group, and in which the content of components other than the melt-moldable tetrafluoroethylene type polymer is at most 0.9 mass %, at a temperature of from (Tm−15) to (Tm+100)° C. wherein Tm is a melting point of the melt-moldable tetrafluoroethylene type polymer and is from 100 to 325° C., in an atmosphere consisting of nitrogen and optionally less than 10,000 ppm of oxygen, to produce a film in which the content of said-components other than the melt-moldable tetrafluoroethylene type polymer is at most 0.9 mass % and which has a wavelength region where the extinction coefficient becomes to be from 1.2 to 4.5, at from 200 to 380 nm.

2. The method according to claim 1 , wherein the heat-molding is conducted in an atmosphere having an oxygen concentration of at most 1,000 ppm.

3. The method according to claim 1 , wherein the film has an extinction coefficient of from 1.2 to 2.0 at a wavelength of 355 nm, or an extinction coefficient of from 2.0 to 4.5 at a wavelength of 266 nm.

4. A method for producing a metal-clad laminate, comprising:
producing a film by the method of claim 1 ; and
thermocompression bonding a conductive metal foil and the film, to produce a metal-clad laminate having a conductive metal layer and a layer of the film.

5. A method for producing a metal-clad laminate, comprising:
applying, on the surface of a conductive metal foil, a liquid composition comprising a liquid medium and a material which comprises a melt-moldable tetrafluoroethylene type polymer comprising at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group, an amide group, an amino group, and an isocyanate group, and in which the content of components other than the melt-moldable tetrafluoroethylene type polymer is at most 0.9 mass %; and
removing the liquid medium and, at the same time, heating in an atmosphere consisting of nitrogen and optionally less than 10,000 ppm of oxygen and having a temperature of from Tm to (Tm+100)° C. wherein Tm is a melting point of the melt-moldable tetrafluoroethylene type polymer and is from 100 to 325° C., to let the melt-moldable tetrafluoroethylene type polymer be fusion-bonded to the conductive metal foil, to produce a metal-clad laminate having a conductive metal layer and a layer of a film in which the content of components other than the melt-moldable tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength region where the extinction coefficient becomes to be from 1.2 to 4.5, at from 200 to 380 nm.

6. A method for producing a printed wiring board, comprising:
producing a metal-clad laminate by the method of claim 5 ; and
irradiating the metal-clad laminate with UV-YAG laser to form through holes in a thickness direction of the metal-clad laminate.

7. The method according to claim 1 , wherein the atmosphere in which the heat-molding is conducted consists of nitrogen and optionally at most 5,000 ppm of oxygen.

8. The method according to claim 1 , wherein the atmosphere in which the heat-molding is conducted consists of nitrogen and optionally at most 1,000 ppm of oxygen.

9. The method according to claim 5 , wherein the atmosphere in which the heating is conducted consists of nitrogen and optionally at most 5,000 ppm of oxygen.

10. The method according to claim 5 , wherein the atmosphere in which the heating is conducted consists of nitrogen and optionally at most 1,000 ppm of oxygen.

11. The method according to claim 1 , wherein the film has a thickness of from 1 to 50 μm.

12. The method according to claim 1 , wherein the film has a thickness of from 2 to 25 μm.

13. The method according to claim 5 , wherein the film has a thickness of from 1 to 50 μm.

14. The method according to claim 5 , wherein the film has a thickness of from 2 to 25 μm.

Assignees

• Agc Inc

Inventors

• Kasai Wataru
• Hosoda Tomoya

Classifications

• B32B27/288

  comprising polyketones · CPC title

• B32B2250/05

  5 or more layers · CPC title

• B32B27/322

  comprising halogenated polyolefins, e.g. PTFE · CPC title

• B32B5/02

  characterised by structural features of a {fibrous or filamentary} layer {(layer formed of metallic wires B32B15/02; layer formed of natural mineral fibres B32B19/02; layer formed of wood fibres B32B21/02)} · CPC title

• B32B2307/306

  Resistant to heat · CPC title