Method for producing fine structures in the volume of a substrate composed of hard brittle material

Patent metadata

Field	Value
Publication number	US-11534754-B2
Application number	US-201916395569-A
Country	US
Kind code	B2
Filing date	Apr 26, 2019
Priority date	Apr 27, 2018
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

A method for producing a cavity in a substrate composed of hard brittle material is provided. A laser beam of an ultrashort pulse laser is directed a side surface of the substrate and is concentrated by a focusing optical unit to form an elongated focus in the substrate. Incident energy of the laser beam produces a filament-shaped flaw in a volume of the substrate. The filament-shaped flaw extends into the volume to a predetermined depth and does not pass through the substrate. To produce the filament-shaped flaw, the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses. After at least two filament-shaped flaws are introduced, the substrate is exposed to an etching medium which removes material of the substrate and widens the at least two filament-shaped flaws to form filaments. At least two filaments are connected to form a cavity.

First claim

What is claimed is:

1. A substrate composed of hard brittle material, the substrate comprising a cavity on at least one side surface, the cavity including a side wall having formed therein a plurality of rounded, substantially hemispherical depressions adjoining one another, the cavity further including a bottom surface having a structure having a plurality of substantially hemispherical depressions.

2. The substrate of claim 1 , wherein the cavity on at least one side surface has a depth of up to 5 mm or extends into the substrate to a depth of at least 50 μm.

3. The substrate of claim 1 , wherein a taper angle of a wall of the cavity with respect to an adjoining side surface of the substrate lies in a range of 85° to 95°.

4. The substrate of claim 1 , wherein the cavity comprises at least two regions having different depths.

5. The substrate of claim 1 , further comprising at least one through-opening having a wall having substantially hemispherical depressions.

6. A microfluidic cell, comprising:
a substrate in the form of a glass element having at least one cavity, the cavity including a side wall having formed therein a plurality of rounded, substantially hemispherical depressions adjoining one another, the cavity further including a bottom surface having a structure having a plurality of substantially hemispherical depressions.

7. The microfluidic cell of claim 6 , further comprising a glass part connected to a side surface of the glass element to which the cavity is open, such that the cavity is closed by the glass part and forms a hollow space enclosed between the glass element having the cavity and the glass part and suitable for guiding liquids, the glass element having the cavity and the glass part being connected by an adhesive layer, the adhesive layer having an omitted region around an opening of the cavity such that a part of the wall of the hollow space which is formed by the glass part is omitted from the adhesive layer.

Assignees

• Schott Ag

Inventors

• Ortner Andreas
• Roters Andreas
• Esemann Hauke
• Heiss-Chouquet Markus
• Wagner Fabian
• Brueckbauer Laura
• Mangold Stephanie
• Hiller Vanessa

Classifications

• B23K26/364

  for making a groove or trench, e.g. for scribing a break initiation groove · CPC title

• G03F1/80

  Etching · CPC title

• B23K26/57

  the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming · CPC title

• G03F7/2053 Primary

  using a laser (ablative removal B41C) · CPC title

• B23K26/70

  Auxiliary operations or equipment · CPC title