Electronic cooling systems

Patent metadata

Field	Value
Publication number	US-11533828-B2
Application number	US-202015930611-A
Country	US
Kind code	B2
Filing date	May 13, 2020
Priority date	May 13, 2020
Publication date	Dec 20, 2022
Grant date	Dec 20, 2022

Abstract

Disclosed herein are cooling systems, methods of making cooling systems, and methods of cooling using cooling systems. A cooling system includes a compression container with a coolant that includes a fluid. A valve is arranged on the compression container through which the coolant is released from the compression container. The cooling system further includes a component positioned to receive droplets of the coolant. The component has a surface with a three-dimensional topography that includes a plurality of pillars and a plurality of trenches. The component is an electronic component or a photoelectronic component.

First claim

What is claimed is:

1. A cooling system comprising:
a compression container comprising a coolant, the coolant comprising a fluid;
a valve arranged on the compression container through which the coolant is released from the compression container; and
a unitary component positioned to receive droplets from the coolant and comprising a surface with a three-dimensional topography that includes a mesh with a plurality of openings, and the unitary component being an electronic component, a photoelectronic component, or a combination thereof;
wherein the surface with the three-dimensional topography is a hot surface of the electronic component, a photoelectronic component, or a combination thereof, and a distance between trenches is about 0.1 micrometers to about 5 micrometers.

2. The cooling system of claim 1 , wherein the fluid comprises a fluid mixture.

3. The cooling system of claim 2 , wherein the fluid mixture comprises nitrogen (N 2 ).

4. The cooling system of claim 3 , wherein the fluid mixture further comprises argon, krypton, an engineered refrigerant, or a mixture thereof.

5. The cooling system of claim 1 , wherein the unitary component is the photoelectronic component.

6. The cooling system of claim 5 , wherein the photoelectronic component is an infrared (IR) detector.

7. The cooling system of claim 1 , wherein the surface of the unitary component has a temperature of about −40 to about 60° C.

8. A method of cooling a unitary component, the method comprising:
opening a valve of a compression container comprising a coolant, the coolant comprising a fluid; and
applying droplets of the coolant to a surface of the unitary component, the surface comprising a three-dimensional topography that includes a mesh with a plurality of openings, and the unitary component being an electronic component, a photoelectronic component, or a combination thereof;
wherein the surface with the three-dimensional topography is a hot surface of the electronic component, a photoelectronic component, or a combination thereof, and a distance between trenches is about 0.1 micrometers to about 5 micrometers.

9. The method of claim 8 , wherein the fluid comprises a fluid mixture.

10. The method of claim 9 , wherein the fluid mixture comprises nitrogen (N 2 ), argon, krypton, an engineered refrigerant, or a mixture thereof.

11. The method of claim 8 , wherein the three-dimensional topography comprises a plurality of pillars and a plurality of trenches.

Assignees

• Raytheon Co

Inventors

• Barker Delmar L
• Lyons Paul M

Classifications

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H05K7/20772 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/20272

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/20836

  Thermal management, e.g. server temperature control · CPC title