Integral features providing improved flexible printed circuit folding and connection capability

Patent metadata

Field	Value
Publication number	US-11533807-B2
Application number	US-202017120416-A
Country	US
Kind code	B2
Filing date	Dec 14, 2020
Priority date	Jan 3, 2020
Publication date	Dec 20, 2022
Grant date	Dec 20, 2022

Abstract

A flexible circuit (FC) and a method of forming the FC each include providing a first dielectric layer, applying a plurality of conductive circuit traces that are substantially parallel to each other to the first dielectric layer, providing a second dielectric layer atop the first dielectric layer and the plurality of conductive circuit traces to form a third dielectric layer having the plurality of conductive traces disposed therein and being configured to support and insulate the plurality of conductive traces, and forming a plurality of channels extending at least partially through a thickness of the third dielectric layer, wherein the plurality of channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC.

First claim

What is claimed is:

1. A flexible circuit (FC), comprising:
a plurality of conductive circuit traces that are substantially parallel to each other; and
an opaque dielectric layer:
having the plurality of conductive circuit traces disposed therein;
being configured to support and insulate the plurality of conductive circuit traces;
having been laser-processed to such that the opaque dielectric layer:
defines a plurality of laser-etched channels extending at least partially through a thickness of the opaque dielectric layer, wherein the plurality of laser-etched channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC; and
defines a plurality of laser-etched identifiers defining at least (i) a type of the FC and (ii) an installation location for electrically connecting the FC to another electrical connector.

2. The FC of claim 1 , wherein at least some of the plurality of laser-etched channels extend fully through the thickness of the opaque dielectric layer.

3. The FC of claim 2 , wherein all of the plurality of laser-etched channels extend fully through the thickness of the opaque dielectric layer.

4. The FC of claim 1 , wherein at least some of the plurality of laser-etched channels are discontinuous.

5. The FC of claim 4 , wherein a discontinuity of the at least some of the plurality of laser-etched channels corresponds to a perforation pattern to provide for improved folding of the FC.

6. The FC of claim 4 , wherein a discontinuity of the at least some of the plurality of laser-etched channels provides increased support or strength of the FC.

7. The FC of claim 1 , wherein at least some of the plurality of conductive circuit traces are formed of copper or aluminum.

8. The FC of claim 1 , wherein each of the plurality of laser-etched identifiers is a barcode or a quick response (QR) code that is scannable by a robot installer.

9. The FC of claim 1 , wherein each of the plurality of laser-etched identifiers is a numerical code, an alphabetical code, or an alphanumerical code that is interpretable by at least one of a robotic installer a human installer.

10. The FC of claim 1 , wherein the laser-etched identifier defining the installation location of the FC specifies its desired electrical connection to one or more other electrical connectors of an electrical system of a vehicle.

11. A method of forming a flexible circuit (FC), the method comprising:
providing a first opaque dielectric layer;
applying a plurality of conductive circuit traces that are substantially parallel to each other to the first opaque dielectric layer;
providing a second opaque dielectric layer atop the first opaque dielectric layer and the plurality of conductive circuit traces to form a third opaque dielectric layer having the plurality of conductive traces disposed therein and being configured to support and insulate the plurality of conductive traces; and
laser-processing the third opaque dielectric layer such that the third opaque dielectric layer defines:
a plurality of laser-etched channels extending at least partially through a thickness of the third opaque dielectric layer, wherein the plurality of laser-etched channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC; and
a plurality of laser-etched identifiers defining at least (i) a type of the FC and (ii) an installation location for electrically connecting the FC to another electrical connector.

12. The method of claim 11 , wherein at least some of the plurality of laser-etched channels extend fully through the thickness of the third opaque dielectric layer.

13. The method of claim 12 , wherein all of the plurality of laser-etched channels extend fully through the thickness of the third opaque dielectric layer.

14. The method of claim 11 , wherein at least some of the plurality of laser-etched channels are discontinuous.

15. The method of claim 14 , wherein a discontinuity of the at least some of the plurality of laser-etched channels corresponds to a perforation pattern to provide for improved folding of the FC.

16. The method of claim 14 , wherein a discontinuity of the at least some of the plurality of laser-etched channels provides increased support or strength of the FC.

17. The method of claim 11 , wherein each of the plurality of laser-etched identifiers is a barcode or a quick response (QR) code that is scannable by a robot installer.

18. The method of claim 11 , wherein each of the plurality of laser-etched identifiers is a numerical code, an alphabetical code, or an alphanumerical code that is interpretable by at least one of a robotic installer a human installer.

19. The method of claim 11 , wherein the laser-etched identifier defining the installation location of the FC specifies its desired electrical connection to one or more other electrical connectors of an electrical system of a vehicle.

20. A method of manufacturing and installing a flexible circuit (FC) within an electrical system of a vehicle, the method comprising:
providing an FC comprising a plurality of conductive circuit traces disposed within an opaque dielectric layer;
performing a single laser processing procedure on the FC to:
laser-etch a plurality of channels into and extending at least partially through a thickness of the opaque dielectric layer, wherein the plurality of laser-etched channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto; and
laser-etch a plurality of identifiers defining at least (i) a type of the FC and (ii) an installation location for electrically connecting the FC to other electrical connectors within the vehicle electrical system, wherein the plurality of laser-etched identifiers include at least a barcode or quick-response (QR) code; and

installing, by at least a robotic installer and a human installer, the FC within the vehicle electrical system in response to scanning of the barcode or QR code by the robotic installer.

Assignees

• Aptiv Tech Ltd

Inventors

• Peterson David R
• Sudik Jr Joseph
• Siegfried David G
• Bilas Jared

Classifications

• H05K3/0032

  of organic insulating material · CPC title

• H05K1/028 Primary

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K2201/09063

  Holes or slots in insulating substrate not used for electrical connections · CPC title

• H05K2201/052

  Branched · CPC title

• H05K2201/09036

  Recesses or grooves in insulating substrate · CPC title