Camera module

Patent metadata

Field	Value
Publication number	US-11531210-B2
Application number	US-202016736031-A
Country	US
Kind code	B2
Filing date	Jan 7, 2020
Priority date	Sep 30, 2019
Publication date	Dec 20, 2022
Grant date	Dec 20, 2022

Abstract

A camera module includes a gyro sensor to generate shaking data; a first driver integrated circuit (IC) to generate a driving signal to move a first lens barrel in at least one direction perpendicular to an optical axis direction, according to the shaking data; and a second driver IC to generate a driving signal to move a second lens barrel in at least one direction perpendicular to the optical axis direction, according to the shaking data. The first driver IC includes a register unit to store the shaking data transferred from the gyro sensor, and the shaking data stored in the register unit is transferred to the second driver IC.

First claim

What is claimed is:

1. A camera module comprising:
a gyro sensor configured to generate shaking data;
a first driver integrated circuit IC configured to generate a driving signal to move a first lens barrel in at least one direction perpendicular to an optical axis direction, according to the shaking data; and
a second driver IC configured to generate a driving signal to move a second lens barrel in at least one direction perpendicular to the optical axis direction, according to the shaking data,
wherein the first driver IC comprises a register unit configured to store the shaking data transferred from the gyro sensor, and
the shaking data stored in the register unit is transferred to the second driver IC.

2. The camera module of claim 1 , wherein the first driver IC and the second driver IC are configured to perform serial peripheral interface bus (SPI) communication.

3. The camera module of claim 2 , wherein the first driver IC includes a slave port of the SPI communication, and the second driver IC includes a master port of the SPI communication.

4. The camera module of claim 3 , wherein the register unit comprises a first register configured to store raw data and a second register configured to store modified data, and
the raw data corresponds to an original copy of the shaking data transferred from the gyro sensor, and the modified data corresponds to a processed copy of the shaking data processed by the first driver IC.

5. The camera module of claim 4 , wherein one of the raw data and the modified data is transferred to the second driver IC.

6. The camera module of claim 5 , wherein data transferred to the second driver IC among the raw data and the modified data is determined according to a command information of a frame of the slave port.

7. The camera module of claim 3 , wherein the first driver IC comprises a state register unit configured to record a change in the shaking data stored in the register unit.

8. The camera module of claim 7 , wherein the first driver IC is configured to generate an interrupt signal in response to a state value of the register unit being changed.

9. The camera module of claim 8 , wherein the first driver IC is configured to provide the interrupt signal to the second driver IC through a master in slave out (MISO) pin of the slave port.

10. The camera module of claim 9 , wherein the second driver IC is configured to read the shaking data stored in the register unit, according to the interrupt signal.

11. A camera module comprising:
a first driver integrated circuit (IC) configured to generate a driving signal to move a first lens barrel in at least one of an optical axis direction and a direction perpendicular to the optical axis direction; and
a second driver IC configured to generate a driving signal to move a second lens barrel in at least one of the optical axis direction and a direction perpendicular to the optical axis direction,
wherein the first driver IC comprises a nonvolatile memory configured to store first firmware data for driving the first driver IC and second firmware data for driving the second driver IC,
the second firmware data is transferred to the second driver IC, and
the first driver IC and the second driver IC are configured to perform serial peripheral interface bus (SPI) communication.

12. The camera module of claim 11 , wherein the second driver IC comprises a volatile memory configured to store the second firmware data.

13. A camera module comprising:
an external memory;
a first driver integrated circuit (IC) configured to generate a driving signal to move a first lens barrel in at least one of an optical axis direction and a direction perpendicular to the optical axis direction; and
a second driver IC configured to generate a driving signal to move a second lens barrel in at least one of the optical axis direction and a direction perpendicular to the optical axis direction,
wherein the first driver IC comprises a nonvolatile memory configured to store first firmware data for driving the first driver IC,
second firmware data for driving the second driver IC is stored in one of the external memory and the nonvolatile memory, and
the second driver IC is configured to determine a memory storing the second firmware data among the external memory and the nonvolatile memory, according to a header information of the external memory and the nonvolatile memory.

14. The camera module of claim 13 , wherein the external memory includes a slave port of serial peripheral interface bus (SPI) communication,
the first driver IC includes a slave port of SPI communication, and
the second driver IC includes a master port of SPI communication.

15. The camera module of claim 13 , wherein the second driver IC is configured to change a structure of a frame of the master port in response to a memory storing the second firmware data among the external memory and the nonvolatile memory.

Assignees

• Samsung Electro Mech

Inventors

• Kim Gyu Won

Classifications

• H04N23/6812

  based on additional sensors, e.g. acceleration sensors · CPC title

• H04N23/687 Primary

  by shifting the lens or sensor position · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• G03B19/22 Primary

  Double cameras · CPC title