Sensor system, including a plurality of individual and separate sensor elements

Patent metadata

Field	Value
Publication number	US-11531041-B2
Application number	US-202117221362-A
Country	US
Kind code	B2
Filing date	Apr 2, 2021
Priority date	Apr 15, 2020
Publication date	Dec 20, 2022
Grant date	Dec 20, 2022

Abstract

A sensor system including a plurality of individual and separate sensor elements. Each of the individual sensor elements is independently functional. The individual sensor elements of the sensor system being formed in one piece from parts of a wafer or a vertically integrated wafer stack. The sensor system including at least one separation structure, in particular a scribe line, between the individual and separate sensor elements.

First claim

What is claimed is:

1. A sensor system, comprising:
a plurality of individual and separate sensor elements, wherein each of the individual sensor elements is independently functional and the individual sensor elements of the sensor system are each formed in one piece from parts of a wafer or a vertically integrated wafer stack; and
at least one separation structure between the individual and separate sensor elements,
wherein the sensor system is configured, with respect to an evaluation of the individual and separate sensor elements, in such a way that an arithmetic averaging of measured values of the individual and separate sensor elements is carried out, and/or that a weighted averaging of the measured values of the individual and separate sensor elements is carried out,
wherein the individual and separate sensor elements of the sensor system, with the exception of a connection via a substrate potential, are exclusively mechanically connected to one another or are only electrically connected to one another via a redistribution level.

2. The sensor system as recited in claim 1 , wherein the separation structure is a scribe line.

3. The sensor system as recited in claim 1 , wherein each of the individual sensor elements includes a first substrate having a micromechanical sensor structure and a second substrate having an associated evaluation circuit, the first and second substrates including main extension planes which are situated in parallel to one another, the first substrate and the second substrate being mechanically and electrically connected to one another and the first substrate and the second substrate at least partially overlap in a direction perpendicular to the main extension planes or form an at least partially sealed cavity within which in each case the micromechanical sensor structure of the individual sensor elements is situated.

4. The sensor system as recited in claim 3 , wherein each of the individual and separate sensor elements includes a vertically integrated wafer stack made up of a first chip arrangement including the micromechanical sensor structure and the first substrate, and a second chip arrangement including the associated evaluation circuit and the second substrate.

5. The sensor system as recited in claim 4 , wherein the first and second substrates and/or the first and second chip arrangements are electrically connected to one another using vias and/or the first or second substrate are electrically connected using vias to an outer side of the first or second substrate facing away from the first or second substrate.

6. The sensor system as recited in claim 3 , wherein the sensor system includes an electrical carrier, which extends in parallel to the main extension planes of the first and second substrates, the individual and separate sensor elements being mechanically connected to the electrical carrier.

7. The sensor system as recited in claim 6 , wherein the electrical carrier includes electrical strip conductors and/or a further redistribution level.

8. The sensor system as recited in claim 7 , wherein the redistribution level is situated on a side of the second substrate facing away from the first substrate and includes bond pads.

9. The sensor system as recited in claim 1 , wherein the individual and separate sensor elements are individually addressable via a bus system.

10. The sensor system as recited in claim 1 , wherein at least a part of the individual and separate sensor elements are similar sensor elements.

11. The sensor system as recited in claim 10 , wherein the similar sensor elements include inertial sensor elements or temperature sensor elements or pressure sensor elements or actuator elements.

Assignees

• Bosch Gmbh Robert

Inventors

• Jemili Amin
• Braeuer Joerg
• Classen Johannes

Classifications

• B81B2201/0242

  Gyroscopes · CPC title

• B81B7/02

  containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title

• B81B2201/0235

  Accelerometers · CPC title

• G01P15/03

  by using non-electrical means · CPC title

• B81B2207/012

  the micromechanical device and the control or processing electronics being separate parts in the same package · CPC title