Heat exchanger fin and manufacturing method of tHE same

Patent metadata

Field	Value
Publication number	US-11530879-B2
Application number	US-202117147182-A
Country	US
Kind code	B2
Filing date	Jan 12, 2021
Priority date	Jan 13, 2020
Publication date	Dec 20, 2022
Grant date	Dec 20, 2022

Abstract

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

First claim

What is claimed is:

1. A heat dissipation device, comprising:
a plurality of parallel fins, each fin including a longitudinally extending body including a first metal sheet and a second metal sheet contacting the first metal sheet, the body including a first edge, a second edge longitudinally opposite the first edge, a third edge extending longitudinally between the first edge and the second edge, and a fourth edge opposite the third edge and extending longitudinally between the first edge and the second edge, wherein a working fluid is located between the first metal sheet and the second metal sheet, and the first metal sheet and the second metal sheet each at least partially define:
a plurality of obstructers arranged in a first region of the fin that is located at or adjacent the first edge,
a plurality of channels at least partially defined by the plurality of obstructers;
an evaporator channel extending longitudinally along the fourth edge and fluidly coupled to the plurality of channels;
a condenser channel extending longitudinally along the third edge and fluidly coupled to the plurality of channels;
a connecting channel extending along the second edge and fluidly coupled to the evaporator channel and the condenser channel; and
a dividing obstructer disposed between the evaporator channel and the condenser channel and between the plurality of obstructers.

2. The heat dissipation device of claim 1 , wherein the dividing obstructer includes:
an evaporation side extending longitudinally between the first edge and the second edge;
a condensation side extending longitudinally between the first edge and the second edge and parallel to the evaporation side; and
a flow side connected to the evaporation side and the condensation side adjacent the first edge.

3. The heat dissipation device of claim 2 , wherein the condensation side is longer than the evaporation side.

4. The heat dissipation device of claim 2 , wherein the condensation side is shorter than the evaporation side.

5. The heat dissipation device of claim 1 , wherein the connecting channel is inclined with respect to the condensation channel and the evaporator channel.

6. The heat dissipation device of claim 1 , wherein a number of obstructers of the plurality of obstructers between the condensation side and the third edge is greater than a number of obstructers of the plurality of obstructers between the evaporation edge and the fourth edge.

7. The heat dissipation device of claim 1 , wherein the fourth edge is hemmed.

8. The heat dissipation device of claim 1 , wherein the first metal sheet and the second metal sheet are bonded to each other at least at the location of each obstructer of the plurality of obstructers.

9. The heat dissipation device of claim 1 , wherein the first metal sheet and the second metal sheet are spaced apart from each other to define the plurality of channels, the evaporator channel, the condenser channel, and the connecting channel.

10. A heat dissipation device, comprising:
a base plate; and
a plurality of fins arranged on the base plate, wherein each fin comprises:
a longitudinally extending fin body including a first metal sheet and a second metal sheet contacting the first metal sheet, the body including a first edge, a second edge longitudinally opposite the first edge, a third edge extending longitudinally between the first edge and the second edge, and a fourth edge opposite the third edge and extending longitudinally between the first edge and the second edge, wherein a working fluid is located between the first metal sheet and the second metal sheet, and the first metal sheet and the second metal sheet each at least partially define:
a plurality of obstructers arranged in a first region of the fin that is located at or adjacent the first edge,
a plurality of channels at least partially defined by the plurality of obstructers,
an evaporator channel extending longitudinally along the fourth edge and fluidly coupled to the plurality of channels,
a condenser channel extending longitudinally along the third edge and fluidly coupled to the plurality of channels,
a connecting channel extending along the second edge and fluidly coupled to the evaporator channel and the condenser channel, and
a dividing obstructer disposed between the evaporator channel and the condenser channel and between the plurality of obstructers.

11. The heat dissipation device of claim 10 , wherein the fins are arranged on the base plate in a longitudinally extending direction in which the fourth edge of each fin contacts the base plate.

12. The heat dissipation device of claim 10 , wherein the base plate includes a plurality of grooves and each groove includes a corresponding fin of the plurality of fins.

13. The heat dissipation device of claim 10 , wherein the base plate includes one or more heat dissipating device coupled thereto.

14. The heat dissipation device of claim 10 , wherein the dividing obstructer includes:
an evaporation side extending longitudinally between the first edge and the second edge;
a condensation side extending longitudinally between the first edge and the second edge and parallel to the evaporation side; and
a flow side connected to the evaporation side and the condensation side adjacent the first edge.

15. The heat dissipation device of claim 14 , wherein the condensation side is longer than the evaporation side.

16. The heat dissipation device of claim 14 , wherein the condensation side is shorter than the evaporation side.

Assignees

• Cooler Master Co Ltd

Inventors

• Lin Chia Yu
• Cheng Shan-Yin

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title