Reactive hot melt adhesive composition and use thereof

Patent metadata

Field	Value
Publication number	US-11530344-B2
Application number	US-201916405179-A
Country	US
Kind code	B2
Filing date	May 7, 2019
Priority date	Nov 10, 2016
Publication date	Dec 20, 2022
Grant date	Dec 20, 2022

Abstract

The present invention relates to a reactive hot melt adhesive composition, a polyurethane prepolymer composition, and cured reaction product thereof having a high mechanical strength and an excellent bonding strength as well as a better reworkability. In particular, the present invention relates to a reactive hot melt adhesive composition comprising: 10% to 24% by weight of a polyisocyanate, 40% to 73% by weight of a first polyol having a number average molecular weight larger than 1,500 g/mol, 1% to 25% by weight of a (meth)acrylate polymer having a number average molecular weight of 20,000 to 80,000 g/mol, and 1% to 15% by weight of a diluent, in which the weight percentages are based on the total weight of all components of the composition.

First claim

What is claimed is:

1. A reactive hot melt adhesive composition prepared from a mixture comprising:
10% to 24% by weight of a polyisocyanate,
40% to 73% by weight of a first polyol having a number average molecular weight of 1,500 to 10,000 g/mol,
1% to 25% by weight of a (meth)acrylate polymer having a hydroxyl group and having a number average molecular weight of 20,000 to 80,000 g/mol, and
1% to 15% by weight of a diluent, which is a liquid (meth)acrylate oligomer having a number average molecular weight of 1,000 to 15,000 g/mol,
in which the weight percentages are based on the total weight of all components of the composition.

2. The reactive hot melt adhesive composition according to claim 1 , wherein the polyisocyanate is selected from the group consisting of diphenyl methane-4,4′-diisocyanate, isophorone diisocyanate, 1,6-hexamethylene diisocyanate, toluene diisocyanate and combinations thereof.

3. The reactive hot melt adhesive composition according to claim 1 , wherein the polyisocyanate is present in an amount of 12% to 20% by weight based on the total weight of all components of the composition.

4. The reactive hot melt adhesive composition according to claim 1 , wherein the first polyol is selected from the group consisting of a polyester polyol, a polyether polyol and mixtures thereof.

5. The reactive hot melt adhesive composition according to claim 1 , wherein the first polyol has a number average molecular weight larger than 2,000 g/mol.

6. The reactive hot melt adhesive composition according to claim 1 , wherein the first polyol is present in an amount of 50% to 70% by weight based on the total weight of all components of the composition.

7. The reactive hot melt adhesive composition according to claim 1 , wherein the (meth)acrylate polymer is a reaction product of a monomer selected from the group consisting of methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, iso-propyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, n-hexyl(meth)acrylate, n-octyl(meth)acrylate 2-ethylhexyl (meth)acrylate, dodecyl (meth)acrylate, cyclohexyl (meth)acrylate, norbornyl(meth)acrylate and combinations thereof.

8. The reactive hot melt adhesive composition according to claim 1 , wherein the (meth)acrylate polymer has a number average molecular weight of from 25,000 g/mol to 60,000 g/mol.

9. The reactive hot melt adhesive composition according to claim 1 , wherein the (meth)acrylate polymer is present in an amount of 2% to 20% by weight based on the total weight of all components of the composition.

10. The reactive hot melt adhesive composition according to claim 1 , wherein the diluent further comprises a second polyol having a number average molecular weight of no larger than 1,200 g/mol.

11. The reactive hot melt adhesive composition according to claim 1 , wherein the (meth)acrylate oligomer diluent has a glass transition temperature of no greater than 0° C.

12. The reactive hot melt adhesive composition according to claim 1 , wherein the (meth)acrylate oligomer diluent has number average molecular weight of from 1,500 to 10,000 g/mol.

13. The reactive hot melt adhesive composition according to claim 1 , wherein:
the diluent further comprises a second polyol having a number average molecular weight of no larger than 1,200 g/mol and
the second polyol is a natural oil based polyol.

14. The reactive hot melt adhesive composition according to claim 13 , wherein the natural oil based polyol is selected from the group consisting of a castor oil based polyol, a dimer fatty acid based polyol, and a combination thereof.

15. The reactive hot melt adhesive composition according to claim 13 , wherein the second polyol has a number average molecular weight from 500 to 1,200 g/mol.

16. The reactive hot melt adhesive composition according to claim 13 , wherein the natural oil based polyol is a castor oil based polyol having a hydroxyl value of 50 to 400 mg KOH/g.

17. The reactive hot melt adhesive composition according to claim 13 , wherein the natural oil based polyol is a castor oil based polyol having a viscosity of 100 to 2,000 cPs at 25° C.

18. The reactive hot melt adhesive composition according to claim 13 , wherein the natural oil based polyol is a dimer fatty acid based polyol having a hydroxyl value of 20 to 200 mg KOH/g.

19. The reactive hot melt adhesive composition according to claim 1 , wherein the diluent is present in an amount of 2% to 12% by weight based on the total weight of all components of the composition.

20. The reactive hot melt adhesive composition according to claim 1 , optionally comprising an additive selected from the group consisting of thermoplastic polymer, plasticizer, filler, pigment, curing catalyst, dissociation catalyst, anti-oxidant, flow modifier, dyestuff, flame retardant, inhibitor, UV absorber, adhesion promoter, stabilizer, tackifier, wax and a combination thereof.

21. The reactive hot melt adhesive composition according to claim 1 , further comprising a thermoplastic polymer selected from the group consisting of polyurethane, homopolymer or random copolymer of (meth)acrylic acid, vinyl ester, vinyl ether, styrene, acrylamide, (meth)acrylamide, fumarate, maleate, acrylonitrile, ethylene, propylene and derivatives thereof.

22. A polyurethane prepolymer composition comprising the reaction product of the reactive hot melt adhesive composition according to claim 1 .

23. A method of bonding materials together which comprises:
providing the reactive hot melt adhesive composition of claim 1 in solid form;
heating the reactive hot melt adhesive composition to a liquid form;
applying the reactive hot melt adhesive composition in liquid form to a first substrate,
bringing a second substrate in contact with the reactive hot melt adhesive composition applied to the first substrate,
cooling the reactive hot melt adhesive composition disposed between the first and second substrates to a solid form, and
subjecting the cooled reactive hot melt adhesive composition to moisture which will allow the reactive hot melt adhesive composition to cure.

24. The method of claim 23 wherein the first and second substrates are independently comprised of wood, metal, polymer, plastic, glass, textile, footwear component, glazing component, door panel, architectural panel, handheld device component and display component.

25. Cured reaction products of the reactive hot melt adhesive composition according to claim 1 .

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Xie Dan
• Shen Dongmei
• Han Xiao
• Meckel-Jonas Claudia
• Qiu Xueyu

Classifications

• C08G18/7671

  containing only one alkylene bisphenyl group · CPC title

• C09J175/08 Primary

  from polyethers · CPC title

• C08G18/4063

  Mixtures of compounds of group C08G18/62 with other macromolecular compounds · CPC title

• C08G2170/20

  Compositions for hot melt adhesives · CPC title

• C08G18/2081

  containing at least two non-condensed heterocyclic rings · CPC title