Method for dismantling adhesive structure

Patent metadata

Field	Value
Publication number	US-11530338-B2
Application number	US-201816637200-A
Country	US
Kind code	B2
Filing date	Aug 6, 2018
Priority date	Aug 9, 2017
Publication date	Dec 20, 2022
Grant date	Dec 20, 2022

Abstract

The invention provides a method of dismantling an adhesion structure including a pair of adherends made of the same material or different materials and a dielectric adhesive sheet interposed between the pair of adherends and bonding the pair of adherends to each other. The method includes: a first step of heating the dielectric adhesive sheet by dielectric heating; and a second step of applying an external force to at least one of the pair of adherends or the dielectric adhesive sheet to separate the pair of adherends from the dielectric adhesive sheet.

First claim

The invention claimed is:

1. A method of dismantling an adhesion structure comprising a pair of adherends that are made of the same material or different materials and a dielectric adhesive sheet that is interposed between the pair of adherends and bonds the pair of adherends to each other, the dielectric adhesive sheet comprising: a thermoplastic resin; and a dielectric filler having a mean particle size, which is a median diameter represented by D50, in a range from 1 μm to 30 μm, the mean particle size being measured in accordance with JIS Z 8819-2 (2001), the dielectric filler being a single one of, or a combination of two or more of compounds selected from, zinc oxide, silicon carbide (SiC), anatase-type titanium oxide, and rutile-type titanium oxide,
the method comprising:
a first step of heating the dielectric adhesive sheet by dielectric heating; and
a second step of applying an external force to at least one of the pair of adherends or the dielectric adhesive sheet to separate the pair of adherends from the dielectric adhesive sheet.

2. The method of dismantling the adhesion structure according to claim 1 , wherein
a shear force is applied to the pair of adherends along adhesive surfaces of the pair of adherends in the second step.

3. The method of dismantling the adhesion structure according to claim 1 , wherein
an out-of-plane directional force is applied to the pair of adherends along adhesive surfaces of the pair of adherends in the second step.

4. The method of dismantling the adhesion structure according to claim 1 , wherein
a wire is inserted between the dielectric adhesive sheet and one of the pair of adherends and is moved along an adhesive surface of the one of the pair of adherends in the second step.

5. The method of dismantling the adhesion structure according to claim 1 , wherein
a peeling force is applied to one of the pair of adherends in the second step.

6. The method of dismantling the adhesion structure according to claim 1 , wherein
a suction force is applied to one of the pair of adherends in the second step.

7. The method of dismantling the adhesion structure according to claim 1 , wherein
a gap is formed in at least one of the pair of adherends, extending along an adhesive surface of the at least one of the pair of adherends, and
in the second step, an out-of-plane directional force is applied through the gap of the at least one of the pair of adherends.

8. The method of dismantling the adhesion structure according to claim 1 , wherein
in the first step, a one-side high-frequency dielectric heater, which comprises an electrode unit whose opposing electrodes are provided on one side of the one-side high-frequency dielectric heater, is disposed at one of the dielectric adhesive sheet and the pair of adherends, and a high-frequency voltage at a frequency in a range from 1 MHz to 200 MHz and at an output in a range from 0.05 kW to 50 kW is applied for 1 second to 180 seconds to perform dielectric heating.

9. The method of dismantling the adhesion structure according to claim 1 , wherein
a content of the dielectric filler is in range from 5 parts by mass to 800 parts by mass with respect to the thermoplastic resin of 100 parts by mass.

10. A method of dismantling an adhesion structure comprising a dielectric adhesive sheet, on a surface of which a sheet-shaped base material is laminated, and an adherend bonded to the dielectric adhesive sheet, the dielectric adhesive sheet comprising: a thermoplastic resin; and a dielectric filler having a mean particle size, which is a median diameter represented by D50, in a range from 1 μm to 30 μm, the mean particle size being measured in accordance with JIS Z 8819-2 (2001), the dielectric filler being a single one of, or a combination of two or more of compounds selected from, zinc oxide, silicon carbide (SiC), anatase-type titanium oxide, and rutile-type titanium oxide,
the method comprising:
a first step of heating the dielectric adhesive sheet by dielectric heating; and
a second step of applying an external force to the dielectric adhesive sheet to separate the dielectric adhesive sheet from the adherend.

Assignees

• Lintec Corp

Inventors

• Ishikawa Masakazu

Classifications

• C09J11/04

  inorganic · CPC title

• C09D187/00

  Coating compositions based on unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title

• Y02W30/56

  of vehicles · CPC title

• C09J2301/408

  additives as essential feature of the adhesive layer · CPC title