Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices

Patent metadata

Field	Value
Publication number	US-11527697-B2
Application number	US-202017110836-A
Country	US
Kind code	B2
Filing date	Dec 3, 2020
Priority date	Apr 19, 2019
Publication date	Dec 13, 2022
Grant date	Dec 13, 2022

Abstract

A quantum computing device includes a first chip having a first substrate and one or more qubits disposed on the first substrate. Each of the one or more qubits has an associated resonance frequency. The quantum computing device further includes a second chip having a second substrate and at least one conductive surface disposed on the second substrate opposite the one or more qubits. The at least one conductive surface has at least one dimension configured to adjust the resonance frequency associated with at least one of the one or more qubits to a determined frequency adjustment value.

First claim

What is claimed is:

1. A quantum computing device, comprising:
a first chip having one or more qubits, each of the one or more qubits having a corresponding associated resonance frequency; and
a second chip having at least one conductive surface, the second chip having a recess formed therein that extends through an opening in the at least one conductive surface at least to the second substrate, wherein the at least one conductive surface has at least one dimension configured to adjust the resonance frequency associated with at least one of the one or more qubits.

2. The quantum computing device of claim 1 , wherein the at least one dimension of the conductive surface is based upon a measurement of a parameter associated with each of the one or more qubits.

3. The quantum computing device of claim 2 , wherein the resonance frequency associated with a particular qubit is a predicted resonance frequency calculated based upon the measured parameter.

4. The quantum computing device of claim 2 , wherein the parameter includes a resistance associated with the one or more qubits.

5. The quantum computing device of claim 4 , wherein the resistance is a normal-state resistance of a junction of the qubit.

6. The quantum computing device of claim 5 , wherein the junction is a Josephson junction of the qubit.

7. The quantum computing device of claim 1 , wherein the at least one dimension is determined based upon a capacitance change to achieve the frequency adjustment value.

8. The quantum computing device of claim 1 , wherein the at least one dimension includes at least one of a shape or an area of the at least one conducting surface.

9. The quantum computing device of claim 1 , wherein the frequency adjustment value is determined such that the frequency adjustment value mitigates a frequency collision between the resonance frequencies associated with the one or more qubits.

10. The quantum computing device of claim 1 , wherein the at least one conductive surface includes a ground plane.

11. The quantum computing device of claim 1 , wherein the at least one conductive surface is formed of at least one of (i) a superconductive material or (ii) a metal material.

12. The quantum computing device of claim 1 , wherein the first chip and the second chip are disposed in a flip chip arrangement.

13. The quantum computing device of claim 1 , wherein the first chip and the second chip are coupled together at a predetermined distance based upon at least one of a frequency tuning range or a tuning sensitivity.

14. The quantum computing device of claim 1 , wherein the conductive surface is of at least one member selected from a set comprising Aluminum, Niobium, Titanium, Titanium Nitride, Palladium, Silver, Copper, Platinum, and Gold.

15. The quantum computing device of claim 1 , wherein a first substrate in the first chip is of at least one member selected from a set comprising sapphire, silicon, quartz, gallium arsenide, fused silica, amorphous silicon, and diamond.

16. The quantum computing device of claim 1 , wherein a second substrate in the second chip is of at least one member selected from a set comprising sapphire, silicon, quartz, gallium arsenide, fused silica, amorphous silicon, and diamond.

17. The quantum computing device of claim 1 , wherein the at least one conductive surface is a superconducting material.

18. The quantum computing device of claim 1 , wherein the at least one dimension includes a depth of a recess formed in a second substrate of the second chip.

19. A quantum computing device, comprising:
a first chip having one or more qubits, each of the one or more qubits having a corresponding associated resonance frequency; and
a second chip having at least one conductive surface, the at least one conductive surface defining an opening through the at least one conductive surface exposing a recess, wherein a depth of the recess corresponds to a resonance frequency associated with at least one of the one or more qubits.

20. A quantum computing system, comprising:
a quantum computing device, the quantum computing device comprising:
a first chip having one or more qubits, each of the one or more qubits having a corresponding associated resonance frequency; and
a second chip having at least one conductive surface, the second chip having a recess formed therein that extends through an opening in the at least one conductive surface at least to the second substrate, wherein the at least one conductive surface has at least one dimension configured to adjust the resonance frequency associated with at least one of the one or more qubits.

Assignees

• IBM

Inventors

• Shao Dongbing
• Brink Markus
• Solgun Firat
• Hertzberg Jared Barney

Classifications

• H01L39/2406

  Electricity · mapped topic

• G06N10/00

  Quantum computing, i.e. information processing based on quantum-mechanical phenomena · CPC title

• H01L39/223 Primary

  Electricity · mapped topic

• H01L39/2416

  Electricity · mapped topic

• H10N60/805 Primary

  for Josephson-effect devices · CPC title