Electronic component with expansion member for preventing overcurrent

Patent metadata

Field	Value
Publication number	US-11527361-B2
Application number	US-202017130552-A
Country	US
Kind code	B2
Filing date	Dec 22, 2020
Priority date	Dec 27, 2019
Publication date	Dec 13, 2022
Grant date	Dec 13, 2022

Abstract

An electronic component device includes an electronic component, a pair of metal terminals, a bonding member, and an expansion member having thermal expansibility. The electronic component includes an element body and a pair of external electrodes. The element body has a pair of end faces opposed to each other. The pair of external electrodes is disposed on the pair of end faces. The pair of metal terminals is electrically connected to the pair of external electrodes. The bonding member bonds one of the pair of external electrodes to one of the pair of metal terminals. The bonding member electrically connects the one of the pair of external electrodes to the one of the pair of metal terminals. The one of the pair of metal terminals includes an opposing face. The opposing face is a flat face.

First claim

What is claimed is:

1. An electronic component device comprising:
an electronic component including an element body having a pair of end faces opposed to each other and a pair of external electrodes disposed on the pair of end faces;
a pair of metal terminals electrically connected to the pair of external electrodes;
a bonding member bonding and electrically connecting one of the pair of external electrodes to one of the pair of metal terminals; and
an expansion member having thermal expansibility, the expansion member being configured to irreversibly increase in volume by a factor of at least 1.2 in response to the expansion member reaching a predetermined temperature, wherein
the one of the pair of metal terminals includes an opposing face opposed to one of the pair of end faces in an opposing direction of the pair of end faces and bonded to the one of the pair of external electrodes by the bonding member,
the expansion member is disposed between the opposing face and the one of the pair of external electrodes, and
the opposing face is a flat face.

2. The electronic component device according to claim 1 , wherein
the expansion member is, when viewed from the opposing direction, disposed around the bonding member.

3. The electronic component device according to claim 1 , wherein
the expansion member is, when viewed from the opposing direction, disposed line-symmetrically with respect to a straight line passing through a center of the bonding member.

4. The electronic component device according to claim 1 , wherein
the expansion member is, when viewed from the opposing direction, disposed point-symmetrically with respect to a center of the bonding member.

5. The electronic component device according to claim 1 , wherein
the bonding member is, when viewed from the opposing direction, disposed around the expansion member.

6. The electronic component device according to claim 5 , wherein
the bonding member is, when viewed from the opposing direction, disposed line-symmetrically with respect to a straight line passing through a center of the expansion member.

7. The electronic component device according to claim 5 , wherein
the bonding member is, when viewed from the opposing direction, disposed point-symmetrically with respect to a center of the expansion member.

8. The electronic component device according to claim 1 , wherein
the expansion member is configured to increase in volume by a factor of at least 10 in response to the expansion member reaching the predetermined temperature.

9. The electronic component device according to claim 1 , wherein the predetermined temperature at which the expansion member increases in volume is set higher than (i) a melting point of solder in the bonding member or (ii) a curing temperature of resin in the bonding member.

10. The electronic component device according to claim 1 , wherein the opposing face includes a first region bonded to the one of the pair of external electrodes by the bonding member and a second region on which the expansion member is disposed.

11. The electronic component device according to claim 1 , wherein the expansion member is constituted by a resin material.

12. The electronic component device according to claim 11 , wherein the resin material is epoxy resin or butyl rubber.

13. An electronic component device comprising:
an electronic component including an element body having a pair of end faces opposed to each other and a pair of external electrodes disposed on the pair of end faces;
a pair of metal terminals electrically connected to the pair of external electrodes;
a bonding member bonding and electrically connecting one of the pair of external electrodes to one of the pair of metal terminals; and
an expansion member having thermal expansibility, the expansion member being configured to increase in volume by a factor of at least 1.2 in response to the expansion member reaching a predetermined temperature, wherein
the one of the pair of metal terminals includes an opposing face opposed to one of the pair of end faces in an opposing direction of the pair of end faces and bonded to the one of the pair of external electrodes by the bonding member,
the expansion member is disposed between the opposing face and the one of the pair of external electrodes,
the opposing face is a flat face, and
the expansion member has an annular shape and surrounds the bonding member when viewed from the opposing direction.

14. An electronic component device comprising:
an electronic component including an element body having a pair of end faces opposed to each other and a pair of external electrodes disposed on the pair of end faces;
a pair of metal terminals electrically connected to the pair of external electrodes;
a bonding member bonding and electrically connecting one of the pair of external electrodes to one of the pair of metal terminals; and
an expansion member having thermal expansibility, the expansion member being configured to increase in volume by a factor of at least 1.2 in response to the expansion member reaching a predetermined temperature, wherein
the one of the pair of metal terminals includes an opposing face opposed to one of the pair of end faces in an opposing direction of the pair of end faces and bonded to the one of the pair of external electrodes by the bonding member,
the expansion member is disposed between the opposing face and the one of the pair of external electrodes,
the opposing face is a flat face, and
the bonding member has an annular shape and surrounds the expansion member when viewed from the opposing direction.

15. An electronic component device comprising:
an electronic component including an element body having a pair of end faces opposed to each other and a pair of external electrodes disposed on the pair of end faces;
a pair of metal terminals electrically connected to the pair of external electrodes;
a bonding member bonding and electrically connecting one of the pair of external electrodes to one of the pair of metal terminals; and
an expansion member having thermal expansibility, the expansion member being configured to increase in volume by a factor of at least 1.2 in response to the expansion member reaching a predetermined temperature, wherein
the one of the pair of metal terminals includes an opposing face opposed to one of the pair of end faces in an opposing direction of the pair of end faces and bonded to the one of the pair of external electrodes by the bonding member,
the expansion member is disposed between the opposing face and the one of the pair of external electrodes,
the opposing face is a flat face, and
the expansion member irreversibly thermally expands and has electrical insulation at least in a thermally expanding state.

Assignees

• Tdk Corp

Inventors

• YAZAWA Kosuke

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/40

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• H01G4/228 Primary

  Terminals · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title