Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method

Patent metadata

Field	Value
Publication number	US-11525984-B2
Application number	US-202117511203-A
Country	US
Kind code	B2
Filing date	Oct 26, 2021
Priority date	Jul 31, 2015
Publication date	Dec 13, 2022
Grant date	Dec 13, 2022

Abstract

The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.

First claim

The invention claimed is:

1. A stacked lens structure, comprising:
a first, second, and third lens substrate with a lens formed inside a through-hole,
wherein the second lens substrate is above the first lens substrate,
wherein the third lens substrate is below the first lens substrate,
wherein a thickness of the second lens substrate is different from a thickness of the third lens substrate,
wherein the first and second lens substrates and the first and third lens substrates are bonded together by direct bonding,
wherein, each through-hole has a rectangular shape in a planar direction of each lens substrate, and
wherein an opening width of each through-hole is smaller at a second surface of each lens substrate than at a first surface of each lens substrate.

2. The stacked lens structure according to claim 1 , wherein the first surface of each lens substrate is a light incident surface.

3. The stacked lens structure according to claim 1 , wherein an aperture width on the first surface of each lens substrate is smaller than an aperture width on the second surface of each lens substrate.

4. The stacked lens structure according to claim 1 , wherein an aperture width on the first surface of each lens substrate is larger than an aperture width on the second surface of each lens substrate.

5. The stacked lens structure according to claim 1 , wherein one or more of the first, second, and third lens substrates have an aperture width comprising a downward narrowed shape, and wherein other of the first, second, and third lens substrate have an aperture width comprising a downward widened shape.

6. The stacked lens structure according to claim 1 , wherein in a cross-sectional view side walls of a through-hole are straight.

7. The stacked lens structure according to claim 1 , wherein in a cross-sectional view side walls of a through-hole are curved.

8. The stacked lens structure according to claim 1 , wherein in a cross-sectional view side walls of a through-hole have a step.

9. The stacked lens structure according to claim 1 , wherein in a cross-sectional view side walls of a through-hole have an angle of approximately 55° to at least one lens substrate surface.

10. The stacked lens structure according to claim 1 , wherein the direct bonding comprises covalent bonding between a surface layer of oxides or nitrides formed on one lens substrate surface and a surface layer of oxides or nitrides formed on another substrate surface.

11. A camera module including a stacked lens structure according to claim 1 .

12. The camera module according to claim 11 , further comprising:
an optical sensor.

13. An electronic apparatus including a stacked lens structure according to claim 1 .

14. The electronic apparatus according to claim 13 , further comprising:
an optical sensor.

Assignees

• Sony Semiconductor Solutions Corp

Inventors

• Moriya Yusuke
• Iwasaki Masanori
• Oinoue Takashi
• Hagimoto Yoshiya
• Matsugai Hiroyasu
• Itou Hiroyuki
• Saito Suguru
• Ohshima Keiji
• Fujii Nobutoshi
• Tazawa Hiroshi
• Shiraiwa Toshiaki
• Ishida Minoru

Classifications

• B29D11/00375

  by moulding lenses in holes through a substrate · CPC title

• G02B27/0018

  with means for preventing ghost images (anti-reflection coatings G02B1/11) · CPC title

• G02B5/003

  Light absorbing elements · CPC title

• B29D11/00298

  Producing lens arrays · CPC title

• G02B13/0085 Primary

  employing wafer level optics · CPC title