Architecture and Operational Modes of Pump-Augmented Loop Heat Pipe with Multiple Evaporators
US-2021396477-A1 · Dec 23, 2021 · US
Method and system for stabilizing loop heat pipe operation with a controllable condenser bypass
US11525636B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11525636-B2 |
| Application number | US-202016826087-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 20, 2020 |
| Priority date | Mar 20, 2019 |
| Publication date | Dec 13, 2022 |
| Grant date | Dec 13, 2022 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A loop heat pipe includes a reservoir, an evaporator adjacent to the reservoir, and a condenser including a condenser inlet and a condenser outlet. The loop heat pipe further includes a vapor transport line connecting the evaporator to the condenser inlet, a liquid transport line connecting the condenser outlet to the evaporator, and a vapor bypass joining the vapor transport line near the condenser inlet and joining the liquid transport line near the condenser outlet. The vapor bypass includes a vapor bypass housing. The vapor bypass housing includes a temperature. The loop heat pipe also includes a thermally-controlled connection between the vapor bypass housing and the condenser, and a thermal controller connected to the thermally-controlled connection and regulating the temperature of the vapor bypass housing via the thermally-controlled connection.
First claim
Opening claim text (preview).
What is claimed is: 1. A loop heat pipe (LHP) comprising: a reservoir; an evaporator adjacent to the reservoir; a condenser comprising a condenser inlet and a condenser outlet; a vapor transport line connecting the evaporator to the condenser inlet; a liquid transport line connecting the condenser outlet to the evaporator; a vapor bypass joining the vapor transport line near the condenser inlet and joining the liquid transport line near the condenser outlet, the vapor bypass comprising a vapor bypass housing, the vapor bypass housing comprising a temperature; a thermally-controlled connection between the vapor bypass housing and the condenser; and a thermal controller connected to the thermally-controlled connection and regulating the temperature of the vapor bypass housing via the thermally-controlled connection. 2. The LHP of claim 1 , wherein the vapor bypass comprises a tubing comprising a vapor bypass inlet at the vapor transport line near the condenser inlet and comprising a vapor bypass outlet at the liquid return line near the condenser outlet, the tubing comprising a tubing diameter, the vapor transport line comprising a vapor transport line diameter, the tubing diameter being smaller than the vapor transport line diameter. 3. The LHP of claim 2 , wherein the vapor bypass tubing, comprises thermal insulation. 4. The LHP of claim 1 , wherein the thermally-controlled connection comprises thermal straps. 5. The LHP of claim 1 , wherein the thermal controller comprises at least one of: a heater; and a thermal electrical cooler. 6. The LHP of claim 1 , wherein the vapor bypass tubing comprises corrugated tubing. 7. The LHP of claim 1 , further comprising: a least one heater connected to the liquid transport line.
Assignees
Inventors
Classifications
Derivation channels, e.g. bypass · CPC title
- F28D15/06Primary
Control arrangements therefor · CPC title
with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title
- F28D15/043Primary
forming loops, e.g. capillary pumped loops · CPC title
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Frequently asked questions
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- What does patent US11525636B2 cover?
- A loop heat pipe includes a reservoir, an evaporator adjacent to the reservoir, and a condenser including a condenser inlet and a condenser outlet. The loop heat pipe further includes a vapor transport line connecting the evaporator to the condenser inlet, a liquid transport line connecting the condenser outlet to the evaporator, and a vapor bypass joining the vapor transport line near the cond…
- Who is the assignee on this patent?
- Us Gov Sec Navy
- What technology area does this patent fall under?
- Primary CPC classification F28D15/06. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue Dec 13 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).