Irradiation unit comprising a pump radiation source and a conversion element

Patent metadata

Field	Value
Publication number	US-11525554-B2
Application number	US-201916979605-A
Country	US
Kind code	B2
Filing date	Mar 5, 2019
Priority date	Mar 12, 2018
Publication date	Dec 13, 2022
Grant date	Dec 13, 2022

Abstract

An irradiation unit is disclosed that includes a pump radiation source for emitting pump radiation in the form of a beam, a conversion element for at least partially converting the pump radiation into conversion radiation, and a support on which the conversion element is situated. The support accommodates a through-hole through which the beam including the pump radiation is incident on an incident surface of the conversion element, the though-hole being laterally delimited by an inner wall face of the support, at least one portion of the face tapering in the direction of the incident surface. During operation, the pump radiation conducted in the beam is at least intermittently at least in part, incident on the inner wall face of the support and is reflected thereby onto the incident surface.

First claim

The invention claimed is:

1. An irradiation unit, comprising
a pump radiation source in a form of a semiconductor chip for the emission of pump radiation in the form of a ray beam,
a conversion element for at least partial conversion of the pump radiation into conversion radiation, the conversion element comprising a monitoring structure having a conductive track or a conductive track structure, and
a carrier on which the conversion element is arranged,
wherein the carrier is configured with an opening through which the ray beam comprising the pump radiation strikes an incidence surface of the conversion element,
wherein the ray beam comprising the pump radiation travels without deviation and without refraction from an emission surface of the pump radiation source to the carrier,
wherein the opening is laterally bounded by an inner wall surface of the carrier, which tapers in the direction toward the incidence surface at least in a section,
and wherein, during operation, the pump radiation guided in the ray beam, at least part of the time, in any event partially, strikes the inner wall surface of the carrier and is reflected there onto the incidence surface,
wherein the pump radiation source and the conversion element are arranged in a hermetically sealed common housing, and
wherein the carrier is used for ray beam or spot shaping.

2. The irradiation unit as claimed in claim 1 , wherein a wavelength-dependent mirror is arranged on the incidence surface of the conversion element, specifically only in the region of the opening of the carrier.

3. The irradiation unit as claimed in claim 1 , wherein the pump radiation source is arranged on a heat sink, the heat sink and the carrier being connected to one another with a material fit.

4. The irradiation unit as claimed in claim 1 , wherein the conversion element and the carrier are connected to one another with a material fit.

5. The irradiation unit as claimed in claim 1 , wherein that inner wall surface of the carrier which bounds the opening of the carrier is mirrored.

6. The irradiation unit as claimed in claim 1 , wherein that inner wall surface of the carrier which bounds the opening of the carrier is rotationally symmetrical about a rotation axis.

7. The irradiation unit as claimed in claim 1 , wherein the tapering inner wall surface respectively has a rectilinear profile as seen in sectional planes that respectively contain a central axis of the ray beam.

8. The irradiation unit as claimed in claim 1 , wherein the tapering inner wall surface encloses, at its end proximal to the incidence surface, a surface which is at least 20% smaller than a surface enclosed by the tapering inner wall surface at its end distal to the incidence surface.

9. The irradiation unit as claimed in claim 1 , wherein the section in which the inner wall surface of the carrier tapers is followed in the direction toward the
incidence surface by a further section, in which the inner wall surface of the carrier widens in the direction toward the incidence surface.

10. The irradiation unit as claimed in claim 1 , wherein the inner wall surface respectively has a concavely curved profile in the further section in which it widens, as seen in sectional planes containing a central axis of the ray beam.

11. The irradiation unit as claimed in claim 1 , wherein the incidence surface of the conversion element is configured at least in regions with a surface structure in order to improve an input coupling efficiency and/or an emission surface of the conversion element is configured at least in regions with a surface structure in order to improve an output coupling efficiency.

12. The irradiation unit as claimed in claim 1 , wherein the incidence surface of the conversion element is coated at least in regions with nanoparticles in order to improve an input coupling efficiency and/or an emission surface of the conversion element is coated at least in regions with nanoparticles in order to improve an output coupling efficiency.

13. The irradiation unit as claimed in claim 1 , wherein the ray beam comprising the pump radiation has a greater extent along a first principal axis than along a second principal axis upstream of the carrier, as seen in a sectional plane perpendicular to a central axis of the ray beam.

14. The irradiation unit as claimed in claim 1 , wherein the pump radiation source is mounted so that it can be offset relative to the carrier, and it is arranged in
different offset positions in different operating modes, in at least one of the operating modes the pump radiation partially striking the inner wall surface ( 8 a ) of the carrier and being reflected there onto the incidence surface of the conversion element.

15. The irradiation unit as claimed in claim 1 , having a reflector which is assigned to an emission surface of the conversion element in such a way that at least a part of the conversion radiation emitted at the emission surface is reflected at a reflection surface of the reflector.

16. A method for producing an irradiation unit as claimed in claim 1 , wherein the conversion element is arranged on the carrier.

17. A use of an irradiation unit as claimed in claim 1 for illumination, in particular for exterior illumination of a motor vehicle, particularly in a front headlamp.

18. The irradiation unit as claimed in claim 1 , wherein the pump radiation travels through a gas mixture or a vacuum.

19. The irradiation unit as claimed in claim 3 , wherein the heat sink and the carrier are connected to one another by means of a solder, and the conversion element and the carrier are also connected to one another by means of a solder, at least one of the solders being a eutectic solder.

20. The irradiation unit as claimed in claim 3 , wherein the pump radiation source is arranged on a heat sink, the heat sink and the carrier being soldered to one another with a material fit.

21. The irradiation unit as claimed in claim 4 , wherein the conversion element and the carrier are soldered to one another with a material fit.

22. The irradiation unit as claimed in claim 13 , wherein a pump radiation spot produced by the pump radiation on the incidence surface of the conversion element respectively has an extent taken along two axes that are formed by imaging the first and second principal axes onto the incidence surface, any difference between the extents being at least less than in the sectional plane upstream of the carrier.

23. The irradiation unit as claimed in claim 14 , wherein the pump radiation source is mounted so that it can be offset at an angle to a central axis of the ray beam comprising the pump radiation.

24. The irradiation unit as claimed in claim 15 , wherein the reflection surface ( 80 a ) of the reflector is concavely curved at least in regions.

25. The irradiation unit as claimed in claim 15 , wherein the reflector is fastened at least indirectly on the carrier.

26. The method as claimed in claim 16 , wherein a heat sink and the carrier are connected to one another by a solder in a soldering step, and the conversion element
and the carrier are also connected to one another by a solder in a soldering step, the soldering steps being carried out sequentially and the solder soldered first having a higher melting point during the subsequent soldering step than the solder soldered in the subsequent soldering step.

27. The use as claimed in

Assignees

• Osram Oled Gmbh

Inventors

• Muster Jasmin
• Sprenger Dennis
• Sorg Joerg
• Kudaev Sergey
• Dobner Andreas
• Zumkley Melanie

Classifications

• H01S5/0237

  by soldering · CPC title

• F21V9/30 Primary

  Elements containing photoluminescent material distinct from or spaced from the light source (shades F21V1/17; globes, bowls or cover glasses F21V3/08, F21V3/12; refractors F21V5/10; reflectors F21V7/26, F21V7/30; elements with provision for controlling the spectral properties or intensity F21V9/40) · CPC title

• H01S5/02469

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title

• H01S5/0225

  Out-coupling of light · CPC title

• H01S5/32341

  blue laser based on GaN or GaP · CPC title