Dielectric composition, dielectric thin film, dielectric element, and electronic circuit board
US-2021276868-A1 · Sep 9, 2021 · US
US11524897B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11524897-B2 |
| Application number | US-202117190045-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 2, 2021 |
| Priority date | Mar 9, 2020 |
| Publication date | Dec 13, 2022 |
| Grant date | Dec 13, 2022 |
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To provide a dielectric composition having excellent reliability. The dielectric composition contains a main component represented by a composition formula (Sr 1-x Ca x ) m (Ti 1-y Hf y )O 3-δ N δ , in which 0.15<x≤0.90, 0<y≤0.15, 0.90≤m≤1.15, 0<δ≤0.05 are satisfied.
Opening claim text (preview).
What is claimed is: 1. A dielectric composition comprising: a main component represented by a composition formula (Sr 1-x Ca x ) m (Ti 1-y Hf y )O 3-δ N δ , wherein 0.15<x≤0.90, 0<y≤0.15, 0.90≤m≤1.15, and 0<δ≤0.05 are satisfied. 2. A dielectric thin film comprising: the dielectric composition according to claim 1 . 3. A dielectric element comprising: the dielectric thin film according to claim 2 ; and an electrode. 4. The dielectric element according to claim 3 , wherein the electrode comprises a Ni foil, and the dielectric thin film is formed on the Ni foil. 5. An electronic circuit board comprising: the dielectric element according to claim 3 . 6. An electronic circuit board comprising: the dielectric element according to claim 4 .
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