Abrasive delivery polishing pads and manufacturing methods thereof

Patent metadata

Field	Value
Publication number	US-11524384-B2
Application number	US-201816048574-A
Country	US
Kind code	B2
Filing date	Jul 30, 2018
Priority date	Aug 7, 2017
Publication date	Dec 13, 2022
Grant date	Dec 13, 2022

Abstract

Embodiments of the present disclosure provide for abrasive delivery (AD) polishing pads and manufacturing methods thereof. In one embodiment, a method of forming a polishing article includes forming a sub-polishing element from a first curable resin precursor composition and forming a plurality of polishing elements extending from the sub-polishing element. Forming the plurality of polishing elements includes forming a continuous polymer phase from a second curable resin precursor composition and forming a plurality of discontinuous abrasive delivery features disposed within the continuous polymer phase. The sub-polishing element is formed by dispensing a first plurality of droplets of the first curable resin precursor composition. The plurality polishing elements are formed by dispensing a second plurality of droplets of the second curable resin precursor composition. In some embodiments, the discontinuous abrasive delivery features comprise a water soluble material having abrasive particles interspersed therein.

First claim

The invention claimed is:

1. A polishing article, comprising:
a sub-polishing element comprising a first continuous polymer phase; and
a plurality of polishing elements extending from the sub-polishing element, each of the plurality of polishing elements comprising:
a second continuous polymer phase; and
a plurality of abrasive particle delivery features disposed in the second continuous polymer phase, wherein each of the abrasive particle delivery features comprises a water soluble support material having a plurality of abrasive particles interspersed therein.

2. The polishing article of claim 1 , wherein the plurality of abrasive particle delivery features have an average width of between 1 μm and about 500 μm.

3. The polishing article of claim 2 , wherein the abrasive particles interspersed in the plurality of abrasive particle delivery features have a mean diameter of between about 30 nm and about 300 nm.

4. The polishing article of claim 1 , wherein the water soluble material is selected from the group consisting of water soluble polymers, water soluble inert materials, hydrophilic polymers, hydrophilic polymerizable monomers, and combinations thereof.

5. The polishing article of claim 4 , wherein the abrasive particles are selected from the group consisting of silica, aluminum oxide, aluminum silicate ceramic, cerium oxide, silicon carbide, titanium dioxide, alumina-zirconia, and combinations thereof.

6. The polishing article of claim 1 , wherein the plurality of polishing elements have a first storage modulus that is more than about 100 MPa at 30° C.

7. The polishing article of claim 6 , wherein the sub-polishing element has a second storage modulus that is less than about 500 MPa at 30° C., and wherein the second storage modulus is less than the first storage modulus.

8. The polishing article of claim 1 , wherein polymers in the subpolishing element and in the plurality of polishing elements are chemically bonded at interfaces thereof.

9. The polishing article of claim 8 , wherein portions of the plurality of polishing elements are disposed in the sub-polishing element.

10. The polishing article of claim 8 , wherein the first continuous polymer phase is formed from a first precursor composition and the second continuous polymer phase is formed from a second precursor composition and interfaces of one or more of the plurality of polishing elements and the sub-polishing element comprises a reaction product of the first precursor composition and the second precursor composition.

11. A polishing article, comprising:
a sub-polishing element comprising a first reaction product of a plurality of first droplets of a first precursor composition;
a plurality of polishing elements extending from the sub-polishing element comprising a second reaction product of a plurality of droplets of a second precursor composition;
a plurality of discontinuous abrasive delivery features disposed in each of one or more of the plurality of polishing elements, each of the abrasive delivery features comprising a water soluble support material having abrasive particles interspersed therein; and
a plurality of interfaces coupling the sub-polishing element to the plurality of polishing elements, wherein one or more of the plurality of interfaces comprises a third reaction product of the first precursor composition and the second precursor composition.

12. The polishing article of claim 11 , wherein portions of the plurality of polishing elements are disposed in the sub-polishing element.

13. The polishing article of claim 11 , wherein the plurality of abrasive particle delivery features each have an average width of between 1 μm and about 500 μm and the abrasive particles interspersed in the plurality of abrasive particle delivery features have a mean diameter of between about 30 nm and about 300 nm.

Assignees

• Applied Materials Inc

Inventors

• Chockalingam Ashwin
• Bajaj Rajeev
• Kumar Ashavani
• Redfield Daniel

Classifications

• B24B37/26 Primary

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title

• B24D11/001

  Manufacture of flexible abrasive materials · CPC title

• B24D3/346

  utilised during polishing, or grinding operation · CPC title

• B24B37/245

  Pads with fixed abrasives · CPC title

• B24D2203/00

  Tool surfaces formed with a pattern · CPC title