Flexible connection member and electronic device comprising same

Patent metadata

Field	Value
Publication number	US-11523507-B2
Application number	US-201917267651-A
Country	US
Kind code	B2
Filing date	Aug 9, 2019
Priority date	Aug 14, 2018
Publication date	Dec 6, 2022
Grant date	Dec 6, 2022

Abstract

Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent. According to one embodiment, a connection member may be provided, the connection member comprising, a first conductive layer including a first logic line, and a second conductive layer in contact with the first conductive layer and including a bonding sheet layer, wherein the second conductive layer includes, a second logic line formed on part of the second conductive layer, and an RF line formed on other part of the second conductive layer, the bonding sheet layer includes, the second conductive layer adhered over the second logic line and the RF line, a first insulating layer formed between the first conductive layer and the second conductive layer, and pins formed on one side of the first conductive layer and the second conductive layer and configured to be electrically connected to connection pins of an external module, and the second conductive layer includes at least one via formed between the second logic line and the RF line so as to energize between the layers included in the second conductive layer. Such a flexible connection member may vary according to embodiments, and an electronic device comprising the flexible connection member may be provided according to various other embodiments.

First claim

The invention claimed is:

1. A connection member comprising:
a first conductive layer including a first logic line;
a second conductive layer positioned adjacent to the first conductive layer and including a bonding sheet layer, the second conductive layer including a second logic line formed on a portion of the second conductive layer and an RF line formed on other portion of the second conductive layer, and the bonding sheet layer adhered onto the second logic line and the RF line;
a first insulating layer formed between the first conductive layer and the second conductive layer; and
pins formed on a side of the first conductive layer and the second conductive layer and configured to be electrically connected with a connection pin of an external module,
wherein the second conductive layer includes at least one via formed between the second logic line and the RF line for conduction between layers included in the second conductive layer,
wherein the connection member comprises a flexible printed circuit board (FPCB),
wherein the first conductive layer is disposed on the first insulating layer, and the first insulating layer is disposed on the second conductive layer, and
wherein the connection member has a first region and a second region separated in a width direction of the connection member, and wherein the second logic line is formed on the first region, and the RF line is formed on the second region.

2. The connection member of claim 1 , wherein the second logic line and the RF line are disposed on the same plane.

3. The connection member of claim 1 , comprising a second insulating layer formed under the second conductive layer and a third conductive layer formed under the second insulating layer.

4. The connection member of claim 3 , wherein the first conductive layer and the third conductive layer are electrically connected through the at least one via.

5. The connection member of claim 3 , further comprising at least one conductive layer disposed to be physically spaced apart from the third conductive layer and having a logic line formed thereon.

6. The connection member of claim 5 , wherein a coverlay or an insulating layer is formed between conductive layers including the third conductive layer and at least one conductive layer disposed under the third conductive layer.

7. The connection member of claim 1 , comprising at least one second via disposed on a side opposite to the at least one via, with respect to the RF line, and around the RF line.

8. The connection member of claim 1 , further comprising pins formed on an opposite side of the first conductive layer and the second conductive layer and configured to be electrically connected to a connection pin of an external module.

9. The connection member of claim 1 , wherein the connection member extends from a printed circuit board of an external module formed on an opposite side of the first conductive layer and the second conductive layer.

10. An electronic device comprising:
a connection member comprising:
a first conductive layer including a first logic line,
a second conductive layer positioned adjacent to the first conductive layer and including a bonding sheet layer, the second conductive layer including a second logic line formed on a portion of the second conductive layer and an RF line formed on other portion of the second conductive layer, and the bonding sheet layer adhered onto the second logic line and the RF line,
a first insulating layer formed between the first conductive layer and the second conductive layer, and
pins formed on a side of the first conductive layer and the second conductive layer and configured to be electrically connected with a connection pin of an external module,
wherein the second conductive layer includes at least one via formed between the second logic line and the RF line for conduction between layers included in the second conductive layer,
wherein the connection member comprises a flexible printed circuit board (FPCB),
wherein the first conductive layer is disposed on the first insulating layer, and the first insulating layer is disposed on the second conductive layer, and
wherein the connection member has a first region and a second region separated in a width direction of the connection member, and wherein the second logic line is formed on the first region, and the RF line is formed on the second region,

a housing;
a first circuit board contained in the housing and including a processor; and
a second circuit board contained in the housing, including a communication device, and electrically connected to the first circuit board,
wherein at least a portion of the connection member is electrically connected to the first circuit board and the second circuit board.

11. The electronic device of claim 10 , wherein the communication device is configured to transmit and receive a signal having a frequency between 6 GHz and 300 GHz.

12. The electronic device of claim 10 , wherein the connection member further includes pins configured to be electrically connected to a connection pin formed in at least one of the first circuit board or the second circuit board.

13. The electronic device of claim 10 , wherein the connection member extends from at least one of the first circuit board and the second circuit board.

Assignees

• Samsung Electronics Co Ltd
• Si Flex Co Ltd

Inventors

• Park Sungwon
• Kim Junghyub
• Jeong Hwanyoul
• Lee Seungyup
• Lee Youngsun
• Jung Hesuk
• Hong Eunseok

Classifications

• H04M1/02

  Constructional features of telephone sets · CPC title

• H05K1/028 Primary

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K1/147

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K1/0237

  High frequency adaptations (H05K1/0216 takes precedence) · CPC title