Resin composition, semiconductor sealing material, one-part adhesive and adhesive film

Patent metadata

Field	Value
Publication number	US-11518867-B2
Application number	US-201816764646-A
Country	US
Kind code	B2
Filing date	Dec 12, 2018
Priority date	Dec 21, 2017
Publication date	Dec 6, 2022
Grant date	Dec 6, 2022

Abstract

To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

First claim

The invention claimed is:

1. A resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) a silica filler, and (D) a silane coupling agent, wherein the silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more and an acidic silanol group existing on a surface of the silica filler is neutralized with the basic substance,
the basic substance having a pKa of 9.4 or more is at least one selected from the group consisting of benzylamine, 2-methoxyethylamine, 3-amino-1-propanol, 3-aminopentane, 3-methoxypropylamine (3MOPA), cyclohexylamine, n-butylamine, dimethylamine, diisopropylamine, piperidine, pyrrolidine and 1,8-diazabicyclo[5.4.0]-7-undecene (DBU), and
the content of the silica filler of component (C), relative to 100 parts by mass in total of the resin composition, is 30 to 60 parts by mass.

2. The resin composition according to claim 1 , wherein the basic substance having a pKa of 9.4 or more is at least one selected from the group consisting of 3-methoxypropylamine (3MOPA) and 1,8-diazabicyclo[5.4.0]-7-undecene (DBU).

3. The resin composition according to claim 1 , wherein the silane coupling agent is at least one selected from the group consisting of an epoxy-based silane coupling agent and a methacryl-based silane coupling agent.

4. The resin composition according to claim 1 , wherein an increase rate of viscosity when left to stand at room temperature for 24 hours is less than 100% from initial viscosity.

5. The resin composition according to claim 1 , wherein the epoxy resin of component (A) is at least one selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, and aminophenol type epoxy resin.

6. The resin composition according to claim 1 , wherein the curing agent of component (B) is at least one selected from the group consisting of an amine-based curing agent and an imidazole-based curing agent.

7. A semiconductor sealing material containing the resin composition according to claim 1 .

8. A one-component adhesive agent containing the resin composition according to claim 1 .

9. An adhesive film containing the resin composition according to claim 1 .

10. The resin composition according to claim 1 , wherein a sphericity of the silica filler of component (C) is 0.8 or more.

11. The resin composition according to claim 1 , wherein an average particle diameter of the silica filler of component (C) is 0.05 to 80 μm.

Assignees

• Namics Corp

Inventors

• Kajita Masashi
• Sato Ayako

Classifications

• H10W74/473 Primary

  containing a filler · CPC title

• C08K9/06 Primary

  with silicon-containing compounds · CPC title

• C09J7/30

  characterised by the adhesive composition · CPC title

• C09J2463/00

  Presence of epoxy resin · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title