Polyimide-based binder for power storage device, electrode mixture paste, negative electrode active material layer, negative electrode sheet for power storage device, and power storage device
US-12176543-B2 · Dec 24, 2024 · US
US11518852B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11518852-B2 |
| Application number | US-201716489401-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 1, 2017 |
| Priority date | Mar 1, 2017 |
| Publication date | Dec 6, 2022 |
| Grant date | Dec 6, 2022 |
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A polyamideimide resin having an isocyanate group blocked with a compound selected from the group consisting of alcohols, oximes and lactams, and having a carboxyl group blocked with a vinyl ether group-containing compound.
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The invention claimed is: 1. A method for producing a polyamideimide resin comprising: reacting a polyvalent isocyanate and a tribasic acid anhydride and/or tribasic acid halide in an N-formyl group-containing solvent at a temperature of 70 to 80° C. to obtain a polyamideimide resin having an isocyanate group and a carboxyl group, blocking the isocyanate group of the polyamideimide resin with a compound selected from the group consisting of alcohols, oximes and lactams, and blocking the carboxyl group with a vinyl ether group-containing compound, wherein the reaction between the polyvalent isocyanate and the tribasic acid anhydride and/or tribasic acid halide is performed by using at least one catalyst selected from the group consisting of tertiary amines, and the reaction temperature does not exceed 80° C. 2. A method for producing a polyamideimide resin comprising: reacting a polyvalent isocyanate having an isocyanate group that has been blocked with a compound selected from the group consisting of alcohols, oximes and lactams, with a tribasic acid anhydride and/or tribasic acid halide having a carboxyl group that has been blocked with a vinyl ether group-containing compound, in an N-formyl group-containing solvent at a temperature of 70 to 80° C. to obtain a polyamideimide resin, wherein the reaction between the polyvalent isocyanate and the tribasic acid anhydride and/or tribasic acid halide is performed by using at least one catalyst selected from the group consisting of tertiary amines, and the reaction temperature does not exceed 80° C. 3. The method for producing a polyamideimide resin according to claim 1 , wherein the compound for blocking the isocyanate group comprises a ketoxime represented by: CRR′═N—OH, (Formula 1) wherein each of R and R′ independently represents an alkyl group of 1 to 6 carbon atoms. 4. The method for producing a polyamideimide resin according to claim 1 , wherein the vinyl ether group-containing compound comprises an alkyl vinyl ether represented by: CH 2 ═CH—O—R, (Formula 2) wherein R represents an alkyl group of 1 to 10 carbon atoms. 5. The method for producing a polyamideimide resin according to claim 2 , wherein the compound for blocking the isocyanate group comprises a ketoxime represented by: CRR′═N—OH, (Formula 1) wherein each of R and R′ independently represents an alkyl group of 1 to 6 carbon atoms. 6. The method for producing a polyamideimide resin according to claim 2 , wherein the vinyl ether group-containing compound comprises an alkyl vinyl ether represented by: CH 2 ═CH—O—R, (Formula 2) wherein R represents an alkyl group of 1 to 10 carbon atoms.
from tetracarboxylic acids or derivatives and diisocyanates · CPC title
Masked polyisocyanates · CPC title
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title
Polyamide-imides · CPC title
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