Substrate with electrical connection section, substrate for liquid ejection head and methods of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11518164-B2
Application number	US-202017005109-A
Country	US
Kind code	B2
Filing date	Aug 27, 2020
Priority date	Aug 30, 2019
Publication date	Dec 6, 2022
Grant date	Dec 6, 2022

Abstract

A substrate with an electrical connection section or a substrate for liquid ejection head comprises a wiring layer, a diffusion prevention layer laid on the wiring layer and a connection member laid on the diffusion prevention layer for establishing an electrical connection to an outside. An insulation layer having a wiring-layer-exposing opening is arranged on the wiring layer and the diffusion prevention layer is arranged in the opening, while the connection member is arranged on the diffusion prevention layer so as to cover an outer peripheral edge of the diffusion prevention layer.

First claim

What is claimed is:

1. A substrate with an electrical connection section comprising:
a wiring layer;
a diffusion prevention layer laid on the wiring layer;
a connection member laid on the diffusion prevention layer, the connection member establishing an electrical connection to an outside; and
an insulation layer having a wiring-layer-exposing opening arranged on the wiring layer;
the diffusion prevention layer being arranged in the opening; and
the connection member being arranged on the diffusion prevention layer so as to cover an outer peripheral edge of the diffusion prevention layer,
wherein the diffusion prevention layer is arranged in the opening with its outer peripheral edge running along an inner periphery of the opening and an upper surface of the outer peripheral edge of the diffusion prevention layer is flush with an upper surface of the insulation layer.

2. The substrate with an electric connection section according to claim 1 , wherein
the connection member is formed with Au.

3. The substrate with an electric connection section according to claim 1 , wherein
the diffusion prevention layer is a TiW layer.

4. A substrate for liquid ejection head equipped with an electric connection section, comprising:
a wiring layer;
a diffusion prevention layer laid on the wiring layer;
a connection member laid on the diffusion prevention layer, the connection member establishing an electrical connection to an outside; and
an insulation layer having a wiring-layer-exposing opening arranged on the wiring layer;
the diffusion prevention layer being arranged in the opening; and
the connection member being arranged on the diffusion prevention layer so as to cover an outer peripheral edge of the diffusion prevention layer,
wherein the diffusion prevention layer is arranged in the opening with its outer peripheral edge running along an inner periphery of the opening and an upper surface of the outer peripheral edge of the diffusion prevention layer is flush with an upper surface of the insulation layer.

5. The substrate for liquid ejection head according to claim 4 , wherein
the connection member is formed with Au.

6. The substrate for liquid ejection head according to claim 4 , wherein
the diffusion prevention layer is a TiW layer.

7. The substrate with an electric connection section according to claim 1 , wherein the upper surface of the outer peripheral edge of the diffusion prevention layer is coplanar with the upper surface of the insulation layer.

8. The substrate for liquid ejection head according to claim 4 , wherein the upper surface of the outer peripheral edge of the diffusion prevention layer is coplanar with the upper surface of the insulation layer.

Assignees

• Canon Kk

Inventors

• Ozaki Teruo

Classifications

• B41J2/1628 Primary

  dry etching · CPC title

• B41J2/1631

  photolithography · CPC title

• B41J2/1645

  thin film formation by spincoating · CPC title

• B41J2/1642

  thin film formation by CVD [chemical vapor deposition] · CPC title

• B41J2/1639

  sacrificial molding · CPC title