Using woven fibers to increase tensile strength and for securing attachment mechanisms

US11518138B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11518138-B2
Application numberUS-201414578319-A
CountryUS
Kind codeB2
Filing dateDec 19, 2014
Priority dateDec 20, 2013
Publication dateDec 6, 2022
Grant dateDec 6, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments disclosed are directed to a woven fabric band that is capable of being secured to another object using threads or the band itself. The woven fabric band may include an inner layer having a first temperature melting point and an outer layer having a second temperature melting point that is higher than the first temperature melting point. When heat having the first temperature is applied to the woven fabric band, the inner layer of the woven fabric band melts while the outer layer remains in its original state. When the inner layer melts, the inner layer conforms to a first shape. As a result of the inner layer conforming to the first shape, the outer layer also conforms to the same shape.

First claim

Opening claim text (preview).

We claim: 1. A band assembly comprising: a woven band comprising: an inner layer of first woven fabric threads having a first temperature melting point; an outer layer of second woven fabric threads having a second temperature melting point that is higher than the first temperature melting point, wherein the outer layer forms a sheath that surrounds the inner layer on opposing sides of the inner layer; and first holes extending through the inner layer and the outer layer of the woven band; wherein when heat having a first temperature is applied to the woven band, the inner layer conforms to a first shape; wherein when the inner layer conforms to the first shape, the outer layer is configured to conform to a second shape, wherein the second shape is a shape of the inner layer; an attachment mechanism having an end of the woven band within the attachment mechanism and having second holes that are overlapping the first holes; and interlock mechanisms each extending through both of a corresponding one of the first holes and a corresponding one of the second holes to secure the attachment mechanism to the woven band, the interlock mechanisms each comprising a first portion extending from a first side of the attachment mechanism and a second portion extending from a second side of the attachment mechanism, opposite the first side, the first portion being received by the second portion. 2. The band assembly of claim 1 , wherein when heat is applied to the woven band, the outer layer is not damaged. 3. The band assembly of claim 1 , wherein the first temperature melting point is about 110 degrees Celsius. 4. The band assembly of claim 1 , wherein the second temperature melting point is about 220 degrees Celsius. 5. The band assembly of claim 1 , wherein a first portion of the woven band is heated to cause the inner layer at the first portion to conform to the first shape without heating a second portion of the woven band. 6. The band assembly of claim 1 , wherein the first shape is a logo. 7. The band assembly of claim 1 , wherein the first shape is selected from a group comprising a hole, a protrusion, a nub, a ridge, a link and a boss. 8. The band assembly of claim 1 , wherein the first shape is associated with a mold. 9. A band for a device that tells time, the band comprising: a woven portion comprising: an inner layer of first woven fabric threads having a first temperature melting point; an outer layer of second woven fabric threads having a second temperature melting point that is higher than the first temperature melting point, wherein the outer layer extends about a periphery of the inner layer; and first holes extending through the inner layer and the outer layer of the woven portion; an attachment mechanism having an end of the woven portion within the attachment mechanism and having second holes that are overlapping the first holes; and interlock mechanisms each extending through both of a corresponding one of the first holes and a corresponding one of the second holes to secure the attachment mechanism to the woven portion, the interlock mechanisms each comprising a first portion extending from a first side of the attachment mechanism and a second portion extending from a second side of the attachment mechanism, opposite the first side, the first portion being received by the second portion. 10. The band of claim 1 , wherein the first temperature melting point is about 110 degrees Celsius. 11. The band of claim 1 , wherein the second temperature melting point is about 220 degrees Celsius. 12. The band of claim 1 , wherein a first portion of the woven portion is heated to cause the inner layer at the first portion to conform to a shape without heating a second portion of the woven portion. 13. The band of claim 12 , wherein the shape is selected from a group comprising a hole, a protrusion, a nub, a ridge, a link and a boss. 14. The band of claim 12 , wherein the shape is associated with a mold.

Assignees

Inventors

Classifications

  • Optical properties · CPC title

  • Yield strength; Tensile strength · CPC title

  • Thermal properties · CPC title

  • characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12 · CPC title

  • another layer {next to it} also being fibrous or filamentary {(relative arrangement of fibres or filaments of different layers B32B5/12)} · CPC title

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What does patent US11518138B2 cover?
Embodiments disclosed are directed to a woven fabric band that is capable of being secured to another object using threads or the band itself. The woven fabric band may include an inner layer having a first temperature melting point and an outer layer having a second temperature melting point that is higher than the first temperature melting point. When heat having the first temperature is appl…
Who is the assignee on this patent?
Apple Inc
What technology area does this patent fall under?
Primary CPC classification B32B5/024. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 06 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).