Electronic device and method for manufacturing same
US-2019237378-A1 · Aug 1, 2019 · US
Electronic device and method for manufacturing the same
US11517982B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11517982-B2 |
| Application number | US-202016902310-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 16, 2020 |
| Priority date | Dec 20, 2017 |
| Publication date | Dec 6, 2022 |
| Grant date | Dec 6, 2022 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
An electronic device includes a support member and a mount member mounting on the support member. The support member and the mount member are sealed by a resin member. The support member includes a surface having a laser irradiation mark. The mount member includes a surface having a rough portion with an accumulation of material of the support member.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing an electronic device including a support member and a mount member mounting on the support member, the support member and the mount member sealed by a resin member, the method comprising: mounting the mount member on a surface of the support member; forming a rough portion at a surface of the mount member by irradiating a target material with laser to scatter material of the target material and accumulate the scattered material at the surface of the mount member, after the mounting of the mount member on the surface of the support member; and sealing the support member and the mount member with the resin member, after the forming of the rough portion, wherein a surface layer portion of the target material includes a metal. 2. The method according to claim 1 , wherein the target material is included in the support member. 3. The method according to claim 2 , wherein the surface layer portion of the target material includes nickel. 4. The method according to claim 2 , wherein the support member is a plate member, and wherein, in the forming of the rough portion, the laser irradiates in a direction tilted to a normal direction of an upper surface of the support member. 5. The method according to claim 1 , wherein the target material is a member different from the support member. 6. The method according to claim 1 , wherein the mount member includes a bonding layer having solder to bond the support member and other members. 7. A method for manufacturing an electronic device including a support member and a mount member mounting on the support member, the support member and mount member sealed by a resin member, the method comprising: mounting the mount member on a surface of the support member; irradiating a target material with laser to scatter material of the target material and accumulate the scattered material at the surface of the mount member; forming a rough portion at a surface of the mount member; and sealing the support member and the mount member with the resin member, wherein a surface layer portion of the target material includes a metal.
Assignees
Inventors
Classifications
comprising aluminium [Al] · CPC title
comprising gold [Au] · CPC title
Encapsulations, e.g. protective coatings · CPC title
Die-attach connectors and bond wires · CPC title
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
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Frequently asked questions
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- What does patent US11517982B2 cover?
- An electronic device includes a support member and a mount member mounting on the support member. The support member and the mount member are sealed by a resin member. The support member includes a surface having a laser irradiation mark. The mount member includes a surface having a rough portion with an accumulation of material of the support member.
- Who is the assignee on this patent?
- Denso Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W70/424. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 06 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).