Device and method for manufacturing a compound component and motor vehicle

US11517974B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11517974-B2
Application numberUS-201816000027-A
CountryUS
Kind codeB2
Filing dateJun 5, 2018
Priority dateJun 6, 2017
Publication dateDec 6, 2022
Grant dateDec 6, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Device (10) for manufacturing a component compound by resistance welding, comprises a welding electrode (12) for transmitting an electric current to a joining element (17) and for exerting a joining force onto the joining element (17) along a joining direction (22) in order to establish a connection of the joining element (17) with a structural element by resistance welding; as well as a positioning device (20) for positioning at least one joining element (17) on the axis of the joining direction (22) in order to contact and particularly apply a force to the joining element (17) by means of the welding electrode (12). The positioning device (20) comprises a retention device (30) for exerting a retention force onto the joining element (17), wherein the retention device (30) is movably arranged.

First claim

Opening claim text (preview).

We claim: 1. A device for manufacturing a compound component by resistance element welding, comprising a welding electrode for transmitting an electric current to a joining element that is to be connected with a structural element, and the welding electrode provided for exerting a joining force onto the joining element along an axis of a joining direction in order to establish a connection of the joining element with the structural element by resistance welding, and a positioning device for positioning the joining element on the axis of the joining direction so that the welding electrode is able to contact and exert the joining force onto the joining element, wherein the positioning device comprises a retention device for exerting a retention force, oriented perpendicular to the joining direction, onto the joining element, wherein the retention device is movably arranged on the device in order to realize a movement of the joining element, such that the retention device is movable, with respect to the welding electrode, in a direction that is perpendicular to the joining direction, wherein the retention device is provided with at least two gripping arms for gripping the joining element, wherein at least a first one of the at least two gripping arms is movable in a direction towards and away from at least a second one of the at least two gripping arms to grip the joining element therebetween, and wherein the device comprises a first drive equipment for moving the at least first one of the at least two gripping arms, such that the retention device is able to grip the joining element by the at least two gripping arms while also moving, with respect to the welding element, in the direction that is perpendicular to the joining direction. 2. The device for manufacturing a compound component according to claim 1 , wherein the device comprises a feeding device for feeding the joining element to the retention device of the positioning device in a defined orientation. 3. The device for manufacturing a compound component according to claim 2 , wherein the positioning device comprises a transfer device for delivering the joining element from the feeding device to the at least two gripping arms of the retention device, wherein the transfer device is movable relative to the retention device. 4. The device for manufacturing a compound component according to claim 3 , wherein the transfer device comprises at least two gripping arms for gripping the joining element, wherein at least a first one of the at least two gripping arms is movable in a direction towards and away from at least a second one of the at least two gripping arms to grip the joining element therebetween, and wherein the device comprises a second drive equipment for moving the at least first one of the at least two gripping arms of the transfer device. 5. The device for manufacturing a compound component according to claim 1 , wherein the retention device of the positioning device is movable, with respect to the welding electrode, perpendicular to the joining direction, such that the retention device is movable onto the axis of the joining direction or away from the axis of the joining direction. 6. The device for manufacturing a compound component according to claim 5 , wherein the retention device of the positioning device is also movable, with respect to the welding electrode, in the joining direction, such that a relative movement between the retention device and the welding electrode is realized along the axis of the joining direction. 7. The device for manufacturing a compound component according to claim 1 , wherein the retention device is movable in the direction that is perpendicular to the joining direction while the welding electrode remains stationary.

Assignees

Inventors

Classifications

  • B23K11/11Primary

    Spot welding · CPC title

  • Devices for inserting or holding rivets in position with or without feeding arrangements · CPC title

  • Riveting · CPC title

  • B23K11/315Primary

    with one electrode moving on a linear path · CPC title

  • Electrode holders {and actuating devices therefor} · CPC title

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Frequently asked questions

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What does patent US11517974B2 cover?
Device (10) for manufacturing a component compound by resistance welding, comprises a welding electrode (12) for transmitting an electric current to a joining element (17) and for exerting a joining force onto the joining element (17) along a joining direction (22) in order to establish a connection of the joining element (17) with a structural element by resistance welding; as well as a positi…
Who is the assignee on this patent?
Volkswagen Ag, Arnold Umformtechnik Gmbh & Co Kg
What technology area does this patent fall under?
Primary CPC classification B23K11/11. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 06 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).