EMI reduction in piezoelectric micromachined ultrasound transducer array

Patent metadata

Field	Value
Publication number	US-11515465-B2
Application number	US-201916281792-A
Country	US
Kind code	B2
Filing date	Feb 21, 2019
Priority date	Feb 26, 2018
Publication date	Nov 29, 2022
Grant date	Nov 29, 2022

Abstract

A piezoelectric micromachined ultrasound transducer (PMUT) array may comprise PMUT devices with respective piezoelectric layers and electrode layers. Parasitic capacitance can be reduced when an electrode layer is not shared across PMUT devices but may expose the devices to electromagnetic interference (EMI). A conductive layer located within the structural layer or on a shared plane with the electrode layers may reduce EMI affecting the PMUT array operation.

First claim

What is claimed is:

1. An array of piezoelectric micromachined ultrasound transducer (PMUT) devices, comprising:
an electrical component layer;
a plurality of PMUT transceivers, wherein each of the plurality of PMUT transceivers comprises:
a piezoelectric layer and a structural layer, wherein the piezoelectric layer is located between the electrical component layer and the structural layer;
a first electrode electrically connected to the electrical component layer and the piezoelectric layer, wherein the first electrode is located between the structural layer and the piezoelectric layer; and
a second electrode electrically connected to the electrical component layer and the piezoelectric layer, wherein the second electrode is located between the electrical component layer and the piezoelectric layer; and

a conductive layer located above the piezoelectric layer and within the structural layer.

2. The array of PMUT devices of claim 1 , wherein the conductive layer at least partially covers the structural layer.

3. The array of PMUT devices of claim 2 , wherein the conductive layer at least partially covers an upper surface of the structural layer.

4. The array of PMUT devices of claim 3 , wherein the conductive layer substantially covers all of the upper surface of the structural layer.

5. The array of PMUT devices of claim 3 , wherein the conductive layer comprises an electromagnetic interference (EMI) layer.

6. The array of PMUT devices of claim 5 , further comprising an oxide layer between the structural layer and the EMI layer.

7. The array of PMUT devices of claim 6 , further comprising a passivation layer covering the EMI layer.

8. The array of PMUT devices of claim 3 , wherein the conductive layer comprises a patterned layer.

9. The array of PMUT devices of claim 8 , wherein the patterned layer comprises a plurality of slots at least partially covering the upper surface of the structural layer.

10. The array of PMUT devices of claim 1 , wherein the conductive layer comprises a ground shield.

11. The array of PMUT devices of claim 1 , wherein the conductive layer comprises a ground mesh.

12. The array of PMUT devices of claim 1 , wherein the conductive layer is located between the piezoelectric layer and the structural layer.

13. The array of PMUT devices of claim 12 , wherein the conductive layer is located in a shared plane with the first electrodes.

14. The array of PMUT devices of claim 12 , wherein the conductive layer comprises a patterned layer.

15. The array of PMUT devices of claim 1 , wherein each of the plurality of PMUT transceivers is configured to operate in either a transmit mode or a receive mode.

16. The array of PMUT devices of claim 1 , wherein the electrical component layer comprises a CMOS layer.

17. An array of piezoelectric micromachined ultrasound transducer (PMUT) devices, comprising:
an electrical component layer;
a plurality of PMUT transceivers, wherein each of the plurality of PMUT transceivers comprises:
a piezoelectric layer and a structural layer, wherein the piezoelectric layer is located between the electrical component layer and the structural layer;
a first electrode electrically connected to the electrical component layer and the piezoelectric layer, wherein the first electrode is located between the structural layer and the piezoelectric layer;
a second electrode electrically connected to the electrical component layer and the piezoelectric layer, wherein the second electrode is located between the electrical component layer and the piezoelectric layer; and
a conductive layer located in a shared plane with the second electrode.

18. The array of PMUT devices of claim 17 , wherein the conductive layer comprises an electromagnetic interference layer.

19. The array of PMUT devices of claim 17 , wherein the conductive layer comprises a patterned layer.

20. The array of PMUT devices of claim 17 , wherein the conductive layer comprises a ground mesh.

Assignees

• Invensense Inc

Inventors

• Apte Nikhil
• Chang Chienliu
• Thakar Shreyas
• Chan Mei-Lin

Classifications

• B81B7/0064

  for protecting against electromagnetic or electrostatic interferences · CPC title

• B81B3/0021

  Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00) · CPC title

• B06B1/0688

  with foil-type piezoelectric elements, e.g. PVDF · CPC title

• B06B1/0622 Primary

  on one surface · CPC title

• G06V40/1306

  non-optical, e.g. ultrasonic or capacitive sensing · CPC title