Display apparatus, method for manufacturing display apparatus, and electronic device

Patent metadata

Field	Value
Publication number	US-11515367-B2
Application number	US-201816979601-A
Country	US
Kind code	B2
Filing date	Mar 31, 2018
Priority date	Mar 31, 2018
Publication date	Nov 29, 2022
Grant date	Nov 29, 2022

Abstract

An electronic device and a method for manufacturing the display apparatus. The electronic device includes a display apparatus and a processor, wherein the display apparatus includes an active-matrix organic light emitting diode (AMOLED) panel, a touch panel, a chip IC, and a printed circuit board. The touch panel is disposed on an upper surface of the AMOLED panel, and the touch panel and the AMOLED panel each has an outgoing line. The outgoing line of the touch panel and the outgoing line of the AMOLED panel are separately extended to form an outgoing line extension end of the touch panel and an outgoing line extension end of the AMOLED panel. The outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are electrically connected to the printed circuit board PCB by using the chip IC.

First claim

What is claimed is:

1. An electronic device, comprising:
a display apparatus and a processor, wherein the display apparatus comprises an active-matrix organic light emitting diode (AMOLED) panel, a touch panel, a chip IC, and a printed circuit board, wherein the touch panel is disposed on an upper surface of the AMOLED panel, the touch panel and the AMOLED panel each has an outgoing line, the outgoing line of the touch panel and the outgoing line of the AMOLED panel are separately extended to form an outgoing line extension end of the touch panel and an outgoing line extension end of the AMOLED panel, the outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are electrically connected to the printed circuit board by using the chip IC, wherein the chip IC is configured to drive the display apparatus to display a picture,
wherein the outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are electrically connected to the printed circuit board by using the chip IC,
wherein the outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are respectively connected to a first surface and a second surface of the chip IC, and the outgoing line extension end of the AMOLED panel or the outgoing line extension end of the touch panel is connected to the printed circuit board.

2. The electronic device according to claim 1 , wherein the chip IC comprises a first chip IC and a second chip IC;
wherein the outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are electrically connected to the printed circuit board by using the chip IC,
wherein the outgoing line extension end of the AMOLED panel is connected to the first chip IC and the printed circuit board, and after the outgoing line extension end of the touch panel is connected to the second chip IC and the outgoing line extension end of the AMOLED panel, the outgoing line extension end of the touch panel is electrically connected to the printed circuit board by using the outgoing line extension end of the AMOLED panel; or
the outgoing line extension end of the touch panel is connected to the second chip IC and the PCB, and after the outgoing line extension end of the AMOLED panel is connected to the first chip IC and the outgoing line extension end of the touch panel, the outgoing line extension end of the AMOLED panel is electrically connected to the printed circuit board by using the outgoing line extension end of the touch panel.

3. An electronic device, comprising a display apparatus and a processor, wherein the display apparatus comprises an active-matrix organic light emitting diode (AMOLED) panel, a touch panel, a chip IC, and a printed circuit board, wherein the touch panel is integrated on an upper surface of the AMOLED panel, and the chip IC is separately connected to an outgoing line extension end of the AMOLED panel and the printed circuit board, wherein the chip IC is configured to drive the display apparatus to display a picture,
wherein that the chip IC is separately connected to the outgoing line extension end of the AMOLED panel and the printed circuit board,
wherein the outgoing line extension end of the AMOLED panel and the printed circuit board are respectively connected to a first surface and a second surface of the chip IC.

4. The electronic device according to claim 3 , wherein at least one via is disposed on an upper surface of the AMOLED panel and on which the touch panel is integrated,
wherein the chip IC is separately connected to the outgoing line extension end of the AMOLED panel and the printed circuit board,
wherein the chip IC is connected to a lower surface of the AMOLED panel that is provided with the at least one via, and the chip IC is connected to the printed circuit board.

5. The electronic device according to claim 4 , wherein the display apparatus further comprises a flexible printed circuit board,
wherein the chip IC is separately connected to the outgoing line extension end of the AMOLED panel and the printed circuit board,
wherein the chip IC is connected to the lower surface of the AMOLED panel that is provided with the at least one via, and the chip IC is connected to the printed circuit board by using the flexible printed circuit board.

6. The electronic device according to claim 3 , wherein the chip IC is disposed in the printed circuit board,
wherein the chip IC is separately connected to the outgoing line extension end of the AMOLED panel and the printed circuit board,
wherein the printed circuit board is connected to the outgoing line extension end of the AMOLED panel at a position at which the chip IC is disposed.

7. The electronic device according to claim 3 , wherein the display apparatus further comprises a copper foil, the copper foil is disposed on a lower surface of the AMOLED panel, and the copper foil is connected to the printed circuit board.

8. A method for manufacturing a display apparatus, comprising:
manufacturing an AMOLED panel and a touch panel, and separately extending an outgoing line of the AMOLED panel and an outgoing line of the touch panel;
fully fitting an AMOLED area of the AMOLED panel to a touch area of the touch panel;
fully fitting cover glass to an upper surface of the touch panel;
fitting a protective layer to a rear side of the AMOLED panel;
performing a thermo compression process on fanout routing on a sector area of the AMOLED panel and fanout routing on the touch panel, bonding an upper surface of a chip IC to the AMOLED panel, and bonding a lower surface of the chip IC to the touch panel;
bending the outgoing line of the AMOLED panel and the outgoing line of the touch panel that are separately bonded with the chip IC to a rear side of a screen, and attaching the outgoing line of the AMOLED panel and the outgoing line of the touch panel to the rear side of the screen by using an adhesive, wherein a bending axis is parallel to a long side of a reserved bending area, to form an integrated display and touch control screen; and
connecting an outgoing line extension end of the integrated display and touch control screen to a printed circuit board, to form the display apparatus.

9. The method according to claim 8 , wherein a distance from a lower edge of the touch area of the touch panel to the reserved bending area on which the chip IC is bonded to the touch panel is greater than a fanout length of the AMOLED panel.

10. The method according to claim 8 , wherein the protective layer comprises foam and a copper foil.

11. The method according to claim 8 , wherein before performing the thermo compression process on fanout routing on the sector area of the AMOLED panel, and bonding the upper surface of the chip IC to the AMOLED panel, the method further comprises:
performing a reinforcement process on fanout of the AMOLED panel.

12. The method according to claim 8 , wherein before performing the thermo compression process on fanout routing on the touch panel, and bonding the lower surface of the chip IC to the touch panel, the method further comprises:
performing a reinforcement process on fanout of the touch panel.

Assignees

• Huawei Tech Co Ltd

Inventors

• Wei Shanshan
• Liang Yanfeng
• Long Haohui
• Li Jianhui
• Qu Lin

Classifications

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• H04M1/0266 Primary

  for a display module assembly · CPC title

• G06F3/041

  Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

• H05K1/147

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title