Protective film

US11512233B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11512233-B2
Application numberUS-201917040358-A
CountryUS
Kind codeB2
Filing dateMar 20, 2019
Priority dateMar 23, 2018
Publication dateNov 29, 2022
Grant dateNov 29, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125° C. The base material layer has a first layer which contains a polyolefin having a melting point of 150° C. or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145° C. for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25° C., and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.

First claim

Opening claim text (preview).

The invention claimed is: 1. A protective film for heat bending a resin substrate, comprising: a base material layer; and a pressure sensitive adhesive layer positioned on the base material layer and configured to be adhered to a resin substrate, wherein the pressure sensitive adhesive layer includes a polyolefin having a melting point of lower than 125° C. as a main material, the base material layer includes a laminate having a first layer positioned on a side opposite to the pressure sensitive adhesive layer and comprising a polyolefin having a melting point of 150° C. or higher as a main material, and a second layer positioned on a side facing the pressure sensitive adhesive layer and comprising an elastomer as an adhesive resin and a polyolefin having a melting point of 150° C. or higher as a non-adhesive resin, the elastomer in the second layer of the laminate in the base material layer includes a styrene-olefin-styrene block copolymer. and a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less when heating the protective film at 145° C. for 30 minutes in a state that the protective film is being interposed between two attaching substrates formed of polycarbonate and having a dimension of 30 cm in length×30 cm in width×2.0 mm in thickness, peeling off the attaching substrate on the side of the pressure sensitive adhesive layer under the conditions of a temperature of 25° C., a peeling angle of 90° and a pulling speed of 1,000 mm/min and viewing a surface of the attaching substrate in a plan view. 2. The protective film according to claim 1 , wherein a melt flow rate of the polyolefin in the pressure sensitive adhesive layer, which is measured under the conditions of a heating temperature of 230° C. and a load of 2.16 kgf in conformity with HS K7210, is in a range of 0.5 g/10 min to 10.0 g/10. 3. The protective film according to claim 1 , wherein the pressure sensitive adhesive layer includes an elastomer. 4. The protective film according to claim 3 , wherein the elastomer in the pressure sensitive adhesive layer includes a styrene-olefin-styrene block copolymer. 5. The protective film according to claim 1 , wherein the polyolefin in the second layer includes at least one of a polypropylene homopolymer and a propylene-ethylene copolymer. 6. The protective film according to claim 1 , wherein a pair of protective films each comprising the protective film are respectively attached to both surfaces of the resin substrate. 7. The protective film according to claim 1 , wherein a coating layer comprising a single layer or a laminate having at least one layer selected from the group consisting of a polycarbonate resin layer, a polyamide resin layer, and a cellulose resin layer is positioned on one surface or the other surface of the resin substrate, or a pair of coating layers each comprising the coating layer are respectively positioned on both surfaces of the resin substrate. 8. The protective film according to claim 1 , wherein the resin substrate is subjected to the heat bending by press molding or vacuum molding. 9. The protective film according to claim 2 , wherein the pressure sensitive adhesive layer includes an elastomer. 10. The protective film according to claim 9 , wherein the elastomer in the pressure sensitive adhesive layer includes a styrene-olefin-styrene block copolymer. 11. The protective film according to claim 1 , wherein the polyolefin in the second layer has the melting point in a range of 150° C. to 170° C. 12. The protective film according to claim 2 , wherein a pair of protective films each comprising the protective film are respectively attached to both surfaces of the resin substrate. 13. The protective film according to claim 2 , wherein a coating layer comprising a single layer or a laminate having at least one layer selected from the group consisting of a polycarbonate resin layer, a polyamide resin layer, and a cellulose resin layer is positioned on one surface or the other surface of the resin substrate, or a pair of coating layers each comprising the coating layer are respectively positioned on both surfaces of the resin substrate. 14. The protective film according to claim 2 , wherein the resin substrate is subjected to the heat bending by press molding or vacuum molding. 15. The protective film according to claim 1 , wherein the polyolefin in the second layer has the melting point in a range of 155° C. to 170° C. 16. The protective film according to claim 3 , wherein a pair of protective films each comprising the protective film are respectively attached to both surfaces of the resin substrate. 17. The protective film according to claim 3 , wherein a coating layer comprising a single layer or a laminate having at least one layer selected from the group consisting of a polycarbonate resin layer, a polyamide resin layer, and a cellulose resin layer is positioned on one surface or the other surface of the resin substrate, or a pair of coating layers each comprising the coating layer are respectively positioned on both surfaces of the resin substrate. 18. The protective film according to claim 3 , wherein the resin substrate is subjected to the heat bending by press molding or vacuum molding. 19. The protective film according to claim 4 , wherein a pair of protective films each comprising the protective film are respectively attached to both surfaces of the resin substrate. 20. The protective film according to claim 1 , wherein the laminate in the base material layer is formed such that a wt % ratio of the adhesive resin and the non-adhesive resin in the second layer is in a range of 20:80 to 50:50.

Assignees

Inventors

Classifications

  • Homopolymers or copolymers of methacrylic acid esters · CPC title

  • Laminated material (metallised plastics C09J7/22) · CPC title

  • C09J7/385Primary

    Acrylic polymers · CPC title

  • Presence of block copolymer · CPC title

  • for protecting painted surfaces, e.g. of cars · CPC title

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What does patent US11512233B2 cover?
A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125° C. The base material layer has a first layer which co…
Who is the assignee on this patent?
Sumitomo Bakelite Co
What technology area does this patent fall under?
Primary CPC classification C09J7/385. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 29 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).