Means of retaining a product in a receptacle

US11511496B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11511496-B2
Application numberUS-201816628764-A
CountryUS
Kind codeB2
Filing dateJul 6, 2018
Priority dateJul 6, 2017
Publication dateNov 29, 2022
Grant dateNov 29, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of adhering a cosmetic pressed powder product or a stick type applicative product (e.g. a lipstick) inside a receptacle therefor is disclosed. The receptacle comprises a casing having a top end and a base end with a receiving base member disposed at the base end, and the receiving base member has an inner surface. The base member may be designed or adapted to be moveable inside the casing to advance and retract the product. The method comprises applying a silicone hot melt adhesive composition in liquid form to at least part of the inner surface of the receiving base member; inserting the product into the receiving base member on or in the silicone hot melt adhesive composition while still in liquid form; and cooling, and optionally curing, the silicone hot melt adhesive to adhere the product inside the receptacle. Retained-products formed via the method are also disclosed.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of adhering a product inside a receptacle for the product, wherein the product is a cosmetic pressed powder product or a stick type applicative product, the receptacle comprises a casing having a top end and a base end with a receiving base member disposed at the base end, and the receiving base member has an inner surface, wherein the base member is adapted to be moveable inside the casing to advance and retract the product outside and inside the top end of the casing, said method comprising: (i) applying a silicone hot melt adhesive composition in liquid form to at least part of the inner surface of the receiving base member of the receptacle; (ii) inserting the product into the receiving base member on or in the silicone hot melt adhesive composition while still in liquid form; and (iii) allowing the silicone hot melt adhesive composition to cool, and optionally cure, to adhere the product inside the receptacle. 2. The method of claim 1 , wherein the silicone hot melt composition is applied in step (i) by heating the silicone hot melt adhesive composition to a temperature of from about 80° C. to about 165° C. 3. The method of claim 1 , wherein the silicone hot melt adhesive composition is introduced into the receiving base member in step (ii) in an amount of from about 0.5 to about 100 grams per square meter (g/m 2 ). 4. The method of claim 1 , wherein the receiving base member is formed from a material selected from the group consisting of styrene butadiene (SB), styrene-acrylonitrile (SAN), acrylobutadiene-styrene (ABS), polyvinyl chlorides and derivatives thereof, polyacrylics, polyamides (PA), saturated thermoplastic polyesters, polyoxymethylene (POM), and combinations thereof. 5. The method of claim 1 , wherein the silicone hot melt adhesive is applied in step (i) by extruding beads or dots of the silicone hot melt adhesive composition onto at least part of the inner surface of the receiving base member. 6. The method of claim 1 , wherein the silicone hot melt adhesive composition is applied in step (i) using an automated, robotic dispenser to dispense the silicone hot melt adhesive composition in liquid form to at least part of the inner surface of the receiving base member. 7. The method of claim 1 , wherein the silicone hot melt adhesive composition comprises: a silicone resin having a silanol content of less than 2 wt. %, and comprised of monofunctional units represented by R 1 3 SiO 1/2 and tetrafunctional units represented by SiO 4/2 where R 1 is a monovalent substituted or unsubstituted hydrocarbon radical; an organopolysiloxane comprised of difunctional units of the formula R 2 R 3 SiO and terminal units of the formula R 4 a X′ 3−a SiG- where R 2 is an alkoxy group or a monovalent unsubstituted or substituted hydrocarbon radical, R 3 is a monovalent unsubstituted or substituted hydrocarbon radical, R 4 is an aminoalkyl or R 1 group, X′ is a hydrolyzable group, G is a divalent group linking the silicon atom of the terminal unit with another silicon atom, and subscript a is 0 or 1; a silane moisture scavenger; and a catalyst. 8. The method of claim 7 , wherein the silicone hot melt adhesive composition comprises: about 55 to about 62 wt. % of the silicone resin; about 38 to about 45 wt. % of the organopolysiloxane; about 0.1 to about 5 wt. %, optionally about 0.9 to about 1.1 wt. %, of the silane moisture scavenger; and about 0.02 to about 2 wt. %, optionally about 0.1 to about 0.5 wt. %, of the catalyst. 9. The method of claim 1 , wherein step (iii) further includes curing the silicone hot melt adhesive composition by exposing the silicone hot melt adhesive composition to moisture. 10. The method of claim 1 , wherein the silicone hot melt adhesive composition is not chemically reactive towards the product. 11. The method of claim 1 , wherein the product is the stick type applicative product and the stick type applicative product is selected from a lipstick, a deodorant, a lip balm, a make-up foundation, a clear cosmetic stick, an anti-acne stick, an antiperspirant, a solid perfume, a concealer, an eye shadow, a blush, a sunscreen, or an adhesive stick. 12. The method of claim 1 , wherein the product is the compressed powder product and in step (ii) a bottom of the compressed powder product is either placed in or on the silicone hot melt adhesive composition in the receiving base member or is first retained in a pan and the pan is either placed in or on the silicone hot melt adhesive composition in the receiving base member. 13. The method of claim 1 , wherein the product is the stick type applicative product and in step (ii) a bottom of the stick type applicative product is either placed directly in or on the silicone hot melt adhesive composition in the receiving base member. 14. A retained-product comprising a cosmetic pressed powder product or a stick type applicative product inside a receiving base member of a receptacle, wherein the product is adhered inside the receptacle according to the method of claim 1 . 15. The retained-product of claim 14 , wherein the stick type applicative product is adhered inside the receiving base member and wherein the stick type applicative product is a lipstick, a deodorant, a lip balm, a make-up foundation, a clear cosmetic stick, an anti-acne stick, an antiperspirant, a solid perfume, a concealer, an eye shadow, a blush, a sunscreen, or an adhesive stick. 16. The method of claim 1 , wherein the silicone hot melt adhesive cures to adhere the product inside the receptacle. 17. The method of claim 8 , wherein the silicone hot melt adhesive composition comprises: i) about 0.9 to about 1.1 wt. % of the silane moisture scavenger; ii) about 0.1 to about 0.5 wt. % of the catalyst; or iii) both i) and ii). 18. A method of adhering a product inside a receptacle for the product, wherein the product is a cosmetic pressed powder product or a stick type applicative product, the receptacle comprises a casing having a top end and a base end with a receiving base member disposed at the base end, and the receiving base member has an inner surface, optionally wherein the base member is adapted to be moveable inside the casing to advance and retract the product outside and inside the top end of the casing, said method comprising: (i) applying a silicone hot melt adhesive composition in liquid form to at least part of the inner surface of the receiving base member of the receptacle; (ii) inserting the product into the receiving base member on or in the silicone hot melt adhesive composition while still in liquid form; and (iii) allowing the silicone hot melt adhesive composition to cool, and optionally cure, to adhere the product inside the receptacle; wherein the silicone hot melt adhesive composition is introduced into the receiving base member in step (ii) in an amount of from about 0.5 to about 100 grams per square meter (g/m 2 ). 19. The method of claim 18 , wherein the silicone hot melt adhesive composition comprises: a silicone resin having a silanol content of less than 2 wt. %, and comprised of monofunctional units represented by R 1 3 SiO 1/2 and tetrafunctional units represented by SiO 4/2 where R 1 is a monovalent substituted or unsubstituted hydrocarbon radical; an organopolysiloxane comprised of difunctional units of the formula R 2 R 3 SiO and terminal units of the formula R 4 a X′ 3−a SiG- where R 2 is an alkoxy group or a monovalent unsubstituted or substituted hydrocarbo

Assignees

Inventors

Classifications

  • A45D40/00Primary

    Casings or accessories specially adapted for storing or handling solid or pasty toiletry or cosmetic substances, e.g. shaving soaps or lipsticks (features common to containers for handling powdery or liquid toiletry or cosmetic substances A45D33/00-A45D37/00; cosmetic or like preparations A61K8/00, A61Q; sample tables or the like G09F5/00) · CPC title

  • Polysiloxanes · CPC title

  • Refill sticks; Moulding devices for producing sticks · CPC title

  • Powder boxes · CPC title

  • Containers or accessories specially adapted for handling powdery toiletry or cosmetic substances · CPC title

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What does patent US11511496B2 cover?
A method of adhering a cosmetic pressed powder product or a stick type applicative product (e.g. a lipstick) inside a receptacle therefor is disclosed. The receptacle comprises a casing having a top end and a base end with a receiving base member disposed at the base end, and the receiving base member has an inner surface. The base member may be designed or adapted to be moveable inside the cas…
Who is the assignee on this patent?
Dow Silicones Corp
What technology area does this patent fall under?
Primary CPC classification A45D40/00. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Nov 29 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).