Method of forming multi-layer sintering object support structure

US11511347B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11511347-B2
Application numberUS-201916436271-A
CountryUS
Kind codeB2
Filing dateJun 10, 2019
Priority dateJun 11, 2018
Publication dateNov 29, 2022
Grant dateNov 29, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Support substrates are used in certain additive fabrication processes to permit processing of an object. For additive fabrication processes with materials that are sintered into a final part, a multi-layer support substrate of interleaved support and interface layers is fabricated to support an object while reducing an impact of friction on shrinkage of the part during the sintering process.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for additive manufacturing, the method comprising: forming a raft by: depositing a first amount of a first metal build material having a first sintering temperature; depositing a first amount of interface material on a surface of the first amount of the first metal build material, the interface material having a second sintering temperature greater than the first sintering temperature, depositing a second amount of the first metal build material on a surface of the first amount of interface material, depositing a second amount of interface material on a surface of the second amount of the first metal build material, wherein the first amount of interface material physically separates the first amount of the first metal build material from the second amount of the first metal build material; forming an object by depositing a first amount of a second metal build material on the raft and separated from the raft by the second amount of interface material; and wherein the first amount of metal build material is configured to change shape independently of the second amount of metal build material during a heating process such that the first amount of metal build material reduces an amount of friction imparted on the object in a horizontal direction. 2. The method according to claim 1 , wherein the depositing the first amount of metal build material, the first amount of interface material, the second amount of metal build material, and the second amount of interface material includes forming a network of open passages. 3. The method according to claim 1 , wherein the second metal build material is the same as the first metal build material. 4. The method according to claim 1 , wherein the first metal build material includes a binder, and wherein the method further comprises: de-binding a first portion of the binder; and heating the first amount of the first metal build material, the second amount of the first metal build material, and the object, wherein a second portion of the binder is vaporized during the heating step. 5. The method according to claim 1 , further comprising heating the first amount of the first metal build material, the second amount of the first metal build material, the first amount of the second metal build material, the first amount of interface material, the second amount of interface material, and the object to the first sintering temperature, wherein a volume of each of the first amount of the first metal build material, the second amount of the first metal build material, and the object decreases during the heating. 6. The method according to claim 1 , wherein the first metal build material has a first physical property and the second metal build material also has the first physical property. 7. The method according to claim 1 , further comprising depositing an initial amount of interface material before depositing the first amount of the first metal build material. 8. The method according to claim 1 , wherein the interface material is sinter-resistant to the first metal build material when heated to the first sintering temperature. 9. The method according to claim 1 , further comprising depositing amounts of a support material to form one or more supports, wherein the support material forming the one or more supports has a different shrink ratio than a shrink ratio of the first metal build material. 10. The method according to claim 1 , wherein one or more of the first amount of the first metal build material or the second amount of the first metal build material are formed of a plurality of layers of the first metal build material, and one or more of the first amount of interface material or the second amount of interface material are formed of a plurality of layers of the interface material. 11. The method according to claim 1 , wherein the method further comprises depositing the first amount of the first metal build material on a printing surface and controlling a temperature of the printing surface. 12. The method according to claim 1 , wherein the first amount of the first metal build material is deposited on a printing surface, and wherein the method further comprises moving the printing surface. 13. The method according to claim 1 , wherein the interface material includes a ceramic material.

Assignees

Inventors

Classifications

  • Means for process control, e.g. cameras or sensors · CPC title

  • Parallel processing within single device · CPC title

  • Platforms or substrates · CPC title

  • Auxiliary heating means · CPC title

  • by mechanical means · CPC title

Patent family

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Frequently asked questions

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What does patent US11511347B2 cover?
Support substrates are used in certain additive fabrication processes to permit processing of an object. For additive fabrication processes with materials that are sintered into a final part, a multi-layer support substrate of interleaved support and interface layers is fabricated to support an object while reducing an impact of friction on shrinkage of the part during the sintering process.
Who is the assignee on this patent?
Desktop Metal Inc
What technology area does this patent fall under?
Primary CPC classification B33Y10/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 29 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).