Preconnected analyte sensors

Patent metadata

Field	Value
Publication number	US-11510596-B2
Application number	US-202016854664-A
Country	US
Kind code	B2
Filing date	Apr 21, 2020
Priority date	Apr 22, 2019
Publication date	Nov 29, 2022
Grant date	Nov 29, 2022

Abstract

Various analyte sensing apparatuses and associated housings are provided. Some apparatuses comprise one or more caps. Some apparatuses comprise a two-part adhesive patch. Some apparatuses comprise one or more sensor bends configured to locate and/or hold a sensor in place during mounting. Some apparatuses utilize one or more dams and/or wells to retain epoxy for securing a sensor. Some apparatuses utilize a pocket and one or more adjacent areas and various transitions for preventing epoxy from wicking to undesired areas of the apparatus. Some apparatuses include heat-sealable thermoplastic elastomers for welding a cap to the apparatus. Related methods of fabricating such apparatuses and/or housings are also provided.

First claim

What is claimed is:

1. An analyte sensing apparatus, comprising:
a housing;
an electronics assembly substrate disposed within the housing;
an analyte sensor comprising an elongated body having at least a first bend and a first portion of the elongated body proximal of the first bend extending substantially parallel to a plane of the electronics assembly substrate and a second portion of the elongated body distal of the first bend, the second portion configured to be positioned in vivo, the first bend angling the second portion away from the first portion at an angle greater than 90 degrees and less than 180 degrees; and
a second bend oriented such that the first portion of the elongated body is distal of the second bend and a portion of the elongated body proximal to the second bend extends substantially perpendicular to the plane of the electronics assembly substrate.

2. The apparatus of claim 1 , wherein the second bend extends at least partially into the electronics assembly substrate.

3. The apparatus of claim 2 , wherein the housing comprises a recess and at least some of the portion of the elongated body proximal to the second bend extends through the electronics assembly substrate and into the recess.

4. The apparatus of claim 1 , wherein the portion of the elongated body proximal to the second bend contacts a portion of the electronics assembly substrate to exert a biasing force against the portion of the electronics assembly substrate, thereby securing the analyte sensor in a desired orientation with respect to the electronics assembly substrate.

5. The apparatus of claim 1 , wherein the second bend extends away from the electronics assembly substrate.

6. The apparatus of claim 5 , wherein the housing further comprises a recess in a sidewall of the housing, at least some of the portion of the elongated body proximal to the second bend extends within the recess and thereby restrains the analyte sensor in a desired orientation with respect to the electronics assembly substrate.

7. The apparatus of claim 5 , wherein the portion of the elongated body proximal to the second bend contacts a portion of the housing to exert a biasing force against the portion of the housing, thereby securing the analyte sensor in a desired orientation with respect to the electronics assembly substrate.

8. The apparatus of claim 7 , wherein the housing further comprises a recess in the housing, and wherein the elongated body of the analyte sensor comprises at least one additional bend proximal to the second bend, the at least one additional bend causing:
at least a first part of the elongated body proximal to the second bend and distal to the at least one additional bend to extend in a first direction within the recess and to contact a first location along the recess to exert a first biasing force at the first location along the recess, and
at least a second part of the elongated body proximal to the second bend and proximal to the at least one additional bend to extend in a second direction within the recess and to contact a second location along the recess to exert a second biasing force at the second location along the recess,
thereby securing the analyte sensor in a desired orientation with respect to the electronics assembly substrate.

9. An analyte sensing apparatus, comprising:
a housing having a top and a bottom;
an electronics assembly substrate disposed within the housing;
an analyte sensor comprising an elongated body having at least a first bend and a first portion of the elongated body proximal of the first bend extending substantially parallel to a plane of the electronics assembly substrate and a second portion of the elongated body distal of the first bend, the second portion configured to be positioned in vivo, the first bend angling the second portion away from the first portion at an angle greater than 90 degrees and less than 180 degrees; and
a second bend, and wherein the second bend is oriented such that a portion of the elongated body distal of the second bend extends in a first direction substantially parallel to a plane of the electronics assembly substrate and a portion of the elongated body proximal to the second bend extends in a second direction that is different from the first direction but also substantially parallel to the plane of the electronics assembly substrate and substantially parallel to a plane of a portion of the bottom of the housing.

10. The apparatus of claim 9 , wherein the elongated body of the analyte sensor comprises at least one additional bend proximal to the second bend, the at least one additional bend causing:
at least a first part of the elongated body proximal to the second bend and distal to the at least one additional bend to extend in the second direction and to contact a first location along one of the housing and the electronics assembly substrate to exert a first biasing force at the first location along one of the housing and the electronics assembly substrate, and
at least a second part of the elongated body proximal to the second bend and proximal to the at least one additional bend to extend in a third direction substantially parallel to the plane of the electronics assembly substrate and to contact a second location along one of the housing and the electronics assembly substrate to exert a second biasing force at the second location along one of the housing and the electronics assembly substrate,
thereby securing the analyte sensor in a desired orientation with respect to the electronics assembly substrate.

11. An analyte sensing apparatus, comprising:
a housing;
an electronics assembly substrate disposed within the housing;
an analyte sensor comprising an elongated body having at least a first bend and a first portion of the elongated body proximal of the first bend extending substantially parallel to a plane of the electronics assembly substrate and a second portion of the elongated body distal of the first bend, the second portion configured to be positioned in vivo, the first bend angling the second portion away from the first portion at an angle greater than 90 degrees and less than 180 degrees; and
a second bend, and wherein the electronics assembly substrate comprises a post and the second bend is oriented such that a portion of the elongated body distal of the second bend extends in a first direction substantially parallel to the plane of the electronics assembly substrate and a portion of the elongated body proximal to the second bend extends substantially along a perimeter of the post, thereby securing the analyte sensor in a desired orientation with respect to the electronics assembly substrate.

12. The apparatus of claim 11 , wherein the portion of the elongated body distal of the second bend contacts a first location along one of the housing and the electronics assembly substrate to exert a first biasing force at the first location along one of the housing and the electronics assembly substrate, thereby securing the analyte sensor in a desired orientation with respect to the electronics assembly substrate.

13. The apparatus of claim 12 , wherein the second bend contacts a second location along one of the housing and the electronics assembly substrate to exert a second biasing force at the second location along one of the housing and the electronics assembly substrate, thereby further securing the analyte sensor in the desired orientation.

14. The apparatus of claim 13 , wherein the portion of the elongated body proximal of the second bend contacts a third location along one of the housing and the electronics assembly substrate to exert a third biasing force at the th

Assignees

• Dexcom Inc

Inventors

• Barry John Charles
• Castagna Patrick John

Classifications

• A61B2562/14

  Coupling media or elements to improve sensor contact with skin or tissue · CPC title

• A61B2560/0406

  specially shaped apparatus housings · CPC title

• A61B5/1468

  using chemical or electrochemical methods, e.g. by polarographic means · CPC title

• A61B5/14546

  for measuring analytes not otherwise provided for, e.g. ions, cytochromes · CPC title

• A61B5/0024

  for multiple sensor units attached to the patient, e.g. using a body or personal area network · CPC title