Immersion heat dissipation structure

US11510342B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-11510342-B1
Application numberUS-202117495780-A
CountryUS
Kind codeB1
Filing dateOct 6, 2021
Priority dateOct 6, 2021
Publication dateNov 22, 2022
Grant dateNov 22, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An immersion heat dissipation structure is provided. The immersion heat dissipation structure includes a porous metal heat dissipation material, an integrated heat spreader, and a thermal interface material. The porous metal heat dissipation material has a porosity greater than 8%. The porous metal heat dissipation material and the integrated heat spreader have the thermal interface material arranged therebetween so that a thermal connection is formed therebetween. A super-wetting layer is formed on a connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-wetting layer has a wetting angle of less than 10 degrees to water. Alternatively, a super-hydrophobic layer is formed on the connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-hydrophobic layer has a wetting angle of greater than 120 degrees to water.

First claim

Opening claim text (preview).

What is claimed is: 1. An immersion heat dissipation structure, comprising: a porous metal heat dissipation material having a porosity greater than 8%; an integrated heat spreader; and a thermal interface material; wherein the porous metal heat dissipation material and the integrated heat spreader have the thermal interface material arranged therebetween so that a thermal connection is formed therebetween, a super-wetting layer is formed on a connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-wetting layer has a wetting angle of less than 10 degrees to water. 2. The immersion heat dissipation structure according to claim 1 , wherein the porous metal heat dissipation material is a porous copper heat dissipation material formed by sintering copper powder. 3. The immersion heat dissipation structure according to claim 1 , wherein the thermal interface material is a hydrophilic thermal grease. 4. The immersion heat dissipation structure according to claim 1 , wherein the super-wetting layer is a film layer having a thickness less than 10 μm. 5. An immersion heat dissipation structure, comprising: a porous metal heat dissipation material having a porosity greater than 8%; an integrated heat spreader; and a thermal interface material; wherein the porous metal heat dissipation material and the integrated heat spreader have the thermal interface material arranged therebetween so that a thermal connection is formed therebetween, a super-hydrophobic layer is formed on a connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-hydrophobic layer has a wetting angle of greater than 120 degrees to water. 6. The immersion heat dissipation structure according to claim 5 , wherein the porous metal heat dissipation material is a porous copper heat dissipation material formed by sintering copper powder. 7. The immersion heat dissipation structure according to claim 5 , wherein the thermal interface material is a non-hydrophilic thermal grease. 8. The immersion heat dissipation structure according to claim 5 , wherein the super-hydrophobic layer is a film layer having a thickness less than 10 μm.

Assignees

Inventors

Classifications

  • especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites · CPC title

  • F28F13/003Primary

    by using permeable mass, perforated or porous materials (F28F13/18 takes precedence) · CPC title

  • Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

  • the means being integral with the element · CPC title

  • characterised by the material composition exhibiting specific thermal properties · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11510342B1 cover?
An immersion heat dissipation structure is provided. The immersion heat dissipation structure includes a porous metal heat dissipation material, an integrated heat spreader, and a thermal interface material. The porous metal heat dissipation material has a porosity greater than 8%. The porous metal heat dissipation material and the integrated heat spreader have the thermal interface material ar…
Who is the assignee on this patent?
Amulaire Thermal Tech Inc
What technology area does this patent fall under?
Primary CPC classification F28F13/003. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Nov 22 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).