Electronic device having heat dissipation function

Patent metadata

Field	Value
Publication number	US-11510336-B2
Application number	US-202016934373-A
Country	US
Kind code	B2
Filing date	Jul 21, 2020
Priority date	Sep 10, 2019
Publication date	Nov 22, 2022
Grant date	Nov 22, 2022

Abstract

An electronic device having heat dissipation function is proposed. The electronic device includes: a heating element (60) installed in a casing (C); a heat dissipation means (70) causing an ionic wind to flow into an inner space (S) of the casing (C); and a heat dissipation bridge (95). The heat dissipation bridge (95) exchanges heat with the ionic wind flowing in the inner space (S) by protruding in a direction of the heating element (60) and at least a portion of the heat dissipation bridge is connected to a heat sink and transfers heat received from the heating element (60) to the heat sink. Accordingly, two means of the heat dissipation means (70) and the heat dissipation bridge (95) simultaneously cool the heating element (60), so cooling efficiency is improved.

First claim

What is claimed is:

1. An electronic device having a heat dissipation function, the electronic device comprising:
a heating element provided in an inner space of a casing;
a heat dissipation means provided in the casing to be adjacent to the heating element and causing an ionic wind to flow to the inner space; and
a heat dissipation bridge protruding in a direction of the heating element to exchange heat with the ionic wind flowing through the inner space, at least a portion of the heat dissipation bridge being connected to a heat sink to transfer heat received from the heating element to the heat sink,
wherein the heat dissipation bridge is located on a flow path through which the ionic wind flows, and is erected above the heating element so as to cross the flow path of the ionic wind and,
wherein the heat sink is provided in the casing such that at least a portion of an outer surface of the heat sink is exposed to an outside of the casing and the heat dissipation bridge is connected to an opposing inner surface of the heat sink.

2. The electronic device of claim 1 , wherein a first end of the heat dissipation bridge protrudes in the direction of the heating element and a second end of the heat dissipation bridge at an opposite side of the first end is directly connected to the heat sink.

3. The electronic device of claim 2 , wherein the first end of the heat dissipation bridge is in direct contact with a surface of the heating element or with a surface of a shield covering the heating element.

4. The electronic device of claim 3 , wherein the heat sink is installed at a heat dissipation window open to the casing.

5. The electronic device of claim 1 , wherein the heat dissipation means comprises:
a power module;
a wire electrode connected to the power module and configured to receive power from the power module to become an emitter electrode; and
a counter electrode spaced apart from the wire electrode in a direction closer to the heat dissipation bridge and grounded at a same time of being connected to the power module to become a collector electrode.

6. The electronic device of claim 5 , wherein the heat dissipation means comprises a module housing provided in the casing, the module housing having an installation space which is open to opposite sides of the module housing,
wherein the wire electrode is installed at an entrance of the installation space and the counter electrode is installed at an exit of the installation space.

7. The electronic device of claim 5 , wherein the power module and one side of the wire electrode are electrically connected to each other, and the counter electrode is installed to be spaced apart from the wire electrode and is configured to be a metal mesh or a metal plate.

8. The electronic device of claim 1 , wherein the heat dissipation means is installed at a position adjacent to an inlet open to one side of the inner space, and an outlet is open at a position corresponding to an opposite side of the inlet relative to the heating element in the casing.

9. The electronic device of claim 1 , wherein the heat dissipation means is installed in an inlet open to one side of the casing.

10. The electronic device of claim 1 , wherein a heat exchange part is provided on a surface of the heat dissipation bridge and increases a surface area of the heat dissipation bridge.

11. The electronic device of claim 10 , wherein the heat exchange part has a shape of a ring surrounding the surface of the heat dissipation bridge and protruding therefrom, or has a shape of a protrusion protruding from the surface of the heat dissipation bridge.

12. The electronic device of claim 10 , wherein the heat dissipation bridge has a cylindrical shape or a polygonal column shape, and the heat exchange part is a heat dissipation plate structure surrounding the surface of the heat dissipation bridge and protruding therefrom,
wherein the heat exchange part is multiply laminated in upward and downward directions of the heat dissipation bridge and protrudes in a direction orthogonal to a longitudinal direction of the heat dissipation bridge.

13. The electronic device of claim 1 , wherein a heat exchange part is provided on a surface of the heat dissipation bridge to have a recessed shape and increases a surface area of the heat dissipation bridge.

14. The electronic device of claim 1 , wherein the heat dissipation bridge is made of a porous metal foam material, or the heat dissipation bridge is provided with a heat dissipation block having a cross-sectional area larger than a cross-sectional area of the heat dissipation bridge, wherein the heat dissipation block is made of a porous metal foam material.

Assignees

• Lg Electronics Inc

Inventors

• Jeong Minwoo
• Ryu Chun Hyuk
• SHIN Jongkil
• Kim Bongjun
• Park Minjae

Classifications

• H10W40/257

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/43 Primary

  by flowing gases, e.g. forced air cooling · CPC title

• H05K7/20154

  Heat dissipaters coupled to components · CPC title

• H05K7/20136 Primary

  Forced ventilation, e.g. by fans (H05K7/202 takes precedence) · CPC title