Cabled module for adding memory devices to a system

Patent metadata

Field	Value
Publication number	US-11510333-B2
Application number	US-202016839797-A
Country	US
Kind code	B2
Filing date	Apr 3, 2020
Priority date	Apr 3, 2020
Publication date	Nov 22, 2022
Grant date	Nov 22, 2022

Abstract

A module, comprising: a printed circuit board (PCB); a power and management connector disposed on the PCB to connect to a computing device via a first cable; a data connector disposed on the PCB to connect to the computing device via a second cable; and a memory slot, to accept a memory device, disposed on the PCB and connected to the power and management connector and the data connector.

First claim

What is claimed is:

1. A system comprising a plurality of modules inserted into a sled,
wherein the sled includes a power and management PCB to connect to power and management connectors of the plurality of modules and allow connection to a computing device via a first cable, and
wherein each respective module comprises:
a respective printed circuit board (PCB);
a respective power and management connector disposed on the PCB to connect to the power and management PCB;
a respective data connector disposed on the PCB to connect to the computing device via a second cable; and
a respective memory slot, to accept a memory device, disposed on the PCB and connected to the power and management connector and the data connector.

2. The system of claim 1 , wherein each respective module includes a plurality of memory slots.

3. The system of claim 1 , wherein the respective memory slot is a differential dual in-line memory module (DDIMM).

4. The system of claim 1 , wherein the respective PCB includes apertures to allow for physical connection to a chassis or the sled.

5. The system of claim 1 , wherein each respective module further comprises a power and management slot disposed on the respective PCB.

6. The system of claim 5 , wherein the power and management slot accepts a power and management connector of another module.

7. The system of claim 6 , wherein the power and management slot indicates a position of a respective module.

8. The system of claim 1 , wherein the each respective module is hot swappable.

9. The system of claim 1 , wherein the each respective module is hot pluggable.

10. The system of claim 1 , wherein the sled comprises:
a base;
physical connections, disposed on a top of the base, to allow for the plurality of modules to be attached to a top side of the base of the sled; and
connectors on a bottom side of the base to attach to the computing device.

11. The system of claim 10 , wherein the sled accepts the plurality of modules in a configuration in which memory devices of a first module are aligned on a different plane than memory devices of a second module, wherein the first module and the second module are adjacent and on a same side of the sled.

12. The system of claim 10 , wherein the sled includes a data PCB to connect to data connectors of the plurality of modules and allow connection to the computing device via a third cable, wherein the data PCB includes at least one of a switch, a controller, a memory controller, and a coherency controller.

13. The system of claim 10 , wherein the plurality of modules directly attach to the computing device via a fourth cable.

14. The system of claim 1 , wherein the respective module further comprises circuitry between the respective power and management connector and the respective memory slot, wherein the circuitry generates management signals to be sent to the computing device.

15. The system of claim 14 , wherein the management signals comprise:
a location of the respective module as its position in the sled with other modules of the plurality of modules;
a first number of a plurality of memory slots disposed on the PCB; and
a second number of the first number of the memory slots which are populated with a corresponding memory device.

16. The system of claim 14 , wherein the power and management PCB includes an interface, wherein the circuitry of the respective module drives the management signals, via the interface, to a controller or a BMC on the computing device.

17. The system of claim 16 , wherein the interface comprises at least one of an Inter-Integrated Circuit (I2C) interface and a System Management Bus (SMBus) interface.

18. The system of claim 1 , wherein the respective module further comprises a back-up power source between the respective power and management connector and the respective memory slot.

19. The system of claim 18 , wherein the back-up power source is to provide power to the respective memory slot in the event of a power failure for an amount of time sufficient for the memory device inserted in the respective memory slot to send data to a non-volatile memory device.

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Norton John
• Nguyen Vincent

Classifications

• H05K2201/10159

  Memory · CPC title

• G11C5/02

  Disposition of storage elements, e.g. in the form of a matrix array · CPC title

• H05K2201/10189

  Non-printed connector · CPC title

• H05K7/1487 Primary

  Blade assemblies, e.g. blade cases or inner arrangements within a blade · CPC title

• G06F1/26

  Power supply means, e.g. regulation thereof (for memories G11C) · CPC title