Conductive laminated structure, a manufacturing method thereof, and a display panel

Patent metadata

Field	Value
Publication number	US-11510323-B2
Application number	US-201916718216-A
Country	US
Kind code	B2
Filing date	Dec 18, 2019
Priority date	Jun 30, 2018
Publication date	Nov 22, 2022
Grant date	Nov 22, 2022

Abstract

The present application discloses a conductive laminated structure, a manufacturing method thereof, and a display panel. The conductive laminated structure provided by the present application comprises a substrate; an adhesion enhancement layer disposed on the substrate; a metal nanowire layer disposed on the adhesion enhancement layer and having a first opening to expose the adhesion enhancement layer; a wiring layer disposed on the metal nanowire layer and having a second opening at least partially overlapping the first opening to expose the adhesion enhancement layer; and an optical adhesive layer disposed on the wiring layer, filled in the second opening and the first opening and connected to the adhesion enhancement layer. Because the metal nanowire layer is in direct contact with the wiring layer, the conducting capability is enhanced, and a reduced contacting area is needed, so that the wiring layer can be relatively narrow.

First claim

The invention claimed is:

1. A conductive laminated structure, comprising:
a substrate;
an adhesion enhancement layer, disposed on the substrate;
a metal nanowire layer, disposed on the adhesion enhancement layer and having at least one first opening to expose the adhesion enhancement layer;
a wiring layer, disposed on the metal nanowire layer and having at least one second opening at least partially overlapping the at least one first opening to expose the adhesion enhancement layer; and
an optical adhesive layer, disposed on the wiring layer, filled in the at least one second opening and the at least one first opening and connected to the adhesion enhancement layer.

2. The conductive laminated structure according to claim 1 , wherein, the at least one second opening has an area larger than that of the at least one first opening; the at least one first opening falls within the scope of the at least one second opening.

3. The conductive laminated structure according to claim 1 , wherein, the at least one second opening has an area smaller than that of the at least one first opening, and the at least one second opening falls within the scope of the at least one first opening.

4. The conductive laminated structure according to claim 1 , wherein, at least part of the at least one first opening is misaligned with at least part of the at least one second opening.

5. The conductive laminated structure according to claim 1 , wherein, the at least one first opening has an area equal to that of the at least one second opening, and the at least one first opening has a boundary in alignment with that of the at least one second opening.

6. The conductive laminated structure according to claim 1 , wherein, the substrate has a plurality of portions of the metal nanowire layer formed thereon, each of the portions of the metal nanowire layer has an annular shape from a top view of the substrate, and the annular shape has a central opening that forms each of the at least one first opening.

7. The conductive laminated structure according to claim 6 , wherein, the annular shape has an edge width of 0.5 μm-1.2 μm.

8. The conductive laminated structure according to claim 1 , wherein, the adhesion enhancement layer has a thickness of 10 nm-300 nm.

9. The conductive laminated structure according to claim 1 , wherein the at least one first opening comprises a plurality of first openings and the at least one second opening comprises a plurality of second openings.

10. The conductive laminated structure according to claim 1 , wherein, the adhesion enhancement layer is made of at least one material selected from high-molecular polymer, insulation material, resin, transparent optical adhesive, oxides, and photoresist analogues.

11. The conductive laminated structure according to claim 10 , wherein, the adhesion enhancement layer has a thickness of 10 nm-300 nm.

12. A method for manufacturing a conductive laminated structure, comprising:
providing a substrate;
forming an adhesion enhancement layer on the substrate;
forming a metal nanowire layer on the adhesion enhancement layer;
forming a wiring layer on the metal nanowire layer; and
forming an optical adhesive layer on the wiring layer;
wherein the metal nanowire layer has at least one first opening to expose the adhesion enhancement layer, the wiring layer has at least one second opening at least partially overlapping the at least one first opening to expose the adhesion enhancement layer, and the optical adhesive layer is filled in the at least one second opening and the at least one first opening and connected to the adhesion enhancement layer.

13. The method according to claim 12 , wherein, the step of forming the metal nanowire layer on the adhesion enhancement layer comprises:
coating a solution of metal nanowires;
drying to evaporate a solvent of the solution of metal nanowires, thereby obtaining a metal nanowire material layer;
etching the metal nanowire material layer to form the at least one first opening to expose the adhesion enhancement layer, so as to form the metal nanowire layer.

14. The method according to claim 13 , wherein, the solution of metal nanowires has a plurality of metal nanowires distributed in the solvent.

15. The method according to claim 13 , wherein, the solution of metal nanowires has a concentration of 0.01 mg/mL-10 mg/mL.

16. The method according to claim 14 , wherein, the solvent is any one of water, ionic solution, salt-containing solution, supercritical fluid, and oil.

17. The method according to claim 16 , wherein, the solvent contains at least one of a dispersing agent, a surfactant, a crosslinking agent, a wetting agent, and a thickening agent.

18. The method according to claim 13 , wherein, in the step of drying to evaporate the solvent of the solution of metal nanowires, the drying is performed by vacuum decompression, infrared heating or hot air heating, and the drying lasts for a duration of 50 s-100 s.

19. A display panel, comprising a conductive laminated structure according to claim 1 .

20. The display panel according to claim 19 , wherein, the display panel comprises a wiring region, a plurality of portions of the metal nanowire layer are disposed in the wiring region and aligned in an extending direction of the wiring region.

Assignees

• Yungu Guan Tech Co Ltd

Inventors

• Zhang Yu
• Li Suhua
• Wang Peng
• Ding Dong
• Liu Hailiang

Classifications

• G06F3/041

  Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

• H05K1/0274

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title

• H01B5/14 Primary

  comprising conductive layers or films on insulating-supports · CPC title

• H05K3/386 Primary

  by the use of an organic polymeric bonding layer, e.g. adhesive · CPC title