Micro light emitting diode transfer device and transfer method

Patent metadata

Field	Value
Publication number	US-11508604-B2
Application number	US-201916627790-A
Country	US
Kind code	B2
Filing date	Dec 16, 2019
Priority date	Dec 2, 2019
Publication date	Nov 22, 2022
Grant date	Nov 22, 2022

Abstract

The present disclosure provides a micro light emitting diode transfer device and a micro light emitting diode transfer method. The micro light emitting diode transfer device includes a holding member, a light source, and a liquid crystals light valve. The liquid crystals light valve is disposed on a transmission path of planar light and includes a plurality of sub light valves. The micro light emitting diodes of irradiated part can be separated from the transfer substrate and adhere to a target substrate, and thereby the micro light emitting diodes can be selectively transferred.

First claim

What is claimed is:

1. A micro light emitting diode transfer device, comprising:
a holding member for holding a transfer substrate;
a light source for providing planar light; and
a liquid crystals light valve disposed on a transmission path of the planar light; and
wherein the liquid crystals light valve comprises a plurality of sub light valves, and the sub light valves are corresponding to micro light emitting diodes on the transfer substrate, and
wherein the liquid crystals light valve comprises: a first substrate: a second substrate opposite to the first substrate; and light blocking walls disposed in crisscross manner between the first substrate and the second substrate; and wherein the adjacent light blocking, walls, the first substrate, and the second substrate form the sub light valves, and the sub light valves are filled with liquid crystals.

2. The micro light emitting diode transfer device as claimed in claim 1 , wherein the micro light emitting diode transfer device further comprises an adsorption member, and
the adsorption member is configured tier adsorbing and transferring substandard micro light emitting diodes on a target substrate.

3. The micro light emitting diode transfer device as claimed in claim 1 , wherein a first driving electrode is provided on a side of the first substrate close to the second substrate, a second driving electrode is provided on a side of the second substrate close to the first substrate, and both of the first driving electrode and the second driving electrode are made of transparent conductive materials.

4. The micro light emitting diode transfer device as claimed in claim 3 , wherein a driving method of the second driving electrode is an active matrix driving method or a passive matrix driving method.

5. The micro light emitting diode transfer device as claimed in claim 3 , wherein a first polarizer is provided on a side of the first substrate away from the second substrate, a second polarizer is provided on a side of the second substrate away from the first substrate, and both of the first polarizer and the second polarizer are metal wire grid polarizers.

6. The micro light emitting diode transfer device as claimed in claim 1 , wherein the light source is an ultraviolet light source or an infrared light source.

7. A micro light emitting diode transfer method of using the micro light emitting diode transfer device as claimed in 1 , comprising:
providing the transfer substrate, wherein a photosensitive adhesive layer is provided on a side of the transfer substrate, and a plurality of micro light emitting diodes are arranged on the transfer substrate in array through the photosensitive adhesive layer; and
irradiating the photosensitive adhesive layer in target areas on the transfer substrate by light emitted by the light source passing through the liquid crystals light valve to reduce adhesion of the photosensitive adhesive layer, so that the micro light emitting diodes are detached and adhere to a target substrate.

8. The micro light emitting diode transfer method as claimed in claim 7 , wherein the target area are areas in which substandard micro light emitting diodes that are removed from the target substrate, and the micro light emitting diode transfer method further comprises:
detecting the target substrate before transfer in order to detect the substandard micro light emitting diodes on the target substrate; and
adsorbing and transferring the substandard micro light emitting diodes by an adsorption member.

9. The micro light emitting diode transfer method as claimed in claim 8 , wherein a material of the photosensitive adhesive layer is an ultraviolet light-sensitive adhesive or an infrared light-sensitive adhesive.

10. A micro light emitting diode transfer device, comprising:
a holding member for holding a transfer substrate;
a light source for providing planar light; and
a liquid crystals light valve disposed on a transmission path of the planar light, comprising:
a first substrate;
a second substrate opposite to the first substrate; and
light blocking walls disposed in crisscross manner between the first substrate and the second substrate;
wherein the adjacent light blocking walls, the first substrate, and the second substrate form a plurality of sub light valves, and the plurality of sub light valves are corresponding to micro light emitting diodes on the transfer substrate.

11. The micro light emitting diode transfer device as claimed in claim 10 , further comprising an adsorption member, and
wherein the adsorption member is configured for adsorbing and transferring substandard micro light emitting diodes on a target substrate.

12. The micro light emitting diode transfer device as claimed in claim 10 , wherein a first driving electrode is provided on a side of the first substrate close to the second substrate, a second driving electrode is provided on a side of the second substrate close to the first substrate, and both of the first driving electrode and the second driving electrode are made of transparent conductive materials.

13. The micro light emitting diode transfer device as claimed in claim 12 , wherein a driving method of the second driving electrode is an active matrix driving method or a passive matrix driving method.

14. The micro light emitting diode transfer device as claimed in claim 12 , wherein a first polarizer is provided on a side of the first substrate away from the second substrate, a second polarizer is provided on a side of the second substrate away from the first substrate, and both of the first polarizer and the second polarizer are metal wire grid polarizers.

15. The micro light emitting diode transfer device as claimed in claim 10 , wherein the light source is an ultraviolet light source or an infrared light source.

Assignees

• Shenzhen China Star Optoelectronics Semiconductor Display Tech Co Ltd

Inventors

• Fan Yong

Classifications

• H10P72/7434

  used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title

• H10P72/7428

  used to support diced chips prior to mounting · CPC title

• H10P72/7414

  the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title