Method for producing hollow structure and hollow structure

Patent metadata

Field	Value
Publication number	US-11505456-B2
Application number	US-201916723686-A
Country	US
Kind code	B2
Filing date	Dec 20, 2019
Priority date	Jun 30, 2017
Publication date	Nov 22, 2022
Grant date	Nov 22, 2022

Abstract

A method includes a step of forming a sacrificial layer on a first film, a step of forming a second film on the sacrificial layer, a step of forming an etching opening that extends through at least one of the first film and the second film so as to communicate with the sacrificial layer, and a step of forming a hollow portion by etching the sacrificial layer using a gas containing a fluorine-containing gas and hydrogen via the etching opening, wherein a composition ratio of silicon to nitrogen in a first region having a face in contact with the sacrificial layer is larger than a composition ratio of silicon to nitrogen in a second region not including the first region.

First claim

The invention claimed is:

1. A hollow structure comprising:
a first film; and
a second film disposed so as to face the first film with a hollow portion formed therebetween,
wherein at least one of the first film and the second film includes a silicon nitride film, and
in the silicon nitride film, a composition ratio of silicon to nitrogen in a first region having a face in contact with the hollow portion is larger than a composition ratio of silicon to nitrogen in a second region not including the first region.

2. The hollow structure according to claim 1 , wherein the silicon nitride film has a refractive index of 1.90 or more at a wavelength of 633 nm.

3. A capacitive transducer comprising:
a first electrode;
a first film disposed on the first electrode;
a second film disposed so as to face the first film with a hollow portion formed therebetween; and
a second electrode disposed on the second film,
wherein at least one of the first film and the second film includes a silicon nitride film, and
in the silicon nitride film, a composition ratio of silicon to nitrogen in a first region having a face in contact with the hollow portion is larger than a composition ratio of silicon to nitrogen in a second region not including the first region.

4. The capacitive transducer according to claim 3 , wherein the silicon nitride film has a refractive index of 1.90 or more at a wavelength of 633 nm.

5. The hollow structure according to claim 1 , wherein one of the first film and the second film includes a silicon nitride film and the other includes a silicon oxide film.

6. The hollow structure according to claim 1 , wherein the silicon nitride film has a structure in which a ratio of silicon to nitrogen continuously decreases from one main surface at which the silicon nitride film is in contact with the sacrificial layer toward the other main surface.

7. The hollow structure according to claim 1 , wherein the first region has a thickness of 42 nm or more in a direction in which the silicon nitride film is formed.

8. The hollow structure according to claim 1 , wherein in the silicon nitride film, a composition ratio of silicon to nitrogen in a third region having a face opposite to the face in contact with the sacrificial layer is larger than a composition ratio of silicon to nitrogen in the second region.

9. The capacitive transducer according to claim 3 , wherein one of the first film and the second film includes a silicon nitride film and the other includes a silicon oxide film.

10. The capacitive transducer according to claim 3 , wherein the silicon nitride film has a structure in which a ratio of silicon to nitrogen continuously decreases from one main surface at which the silicon nitride film is in contact with the sacrificial layer toward the other main surface.

11. The capacitive transducer according to claim 3 , wherein the first region has a thickness of 42 nm or more in a direction in which the silicon nitride film is formed.

12. The capacitive transducer according to claim 3 , wherein in the silicon nitride film, a composition ratio of silicon to nitrogen in a third region having a face opposite to the face in contact with the sacrificial layer is larger than a composition ratio of silicon to nitrogen in the second region.

Assignees

• Canon Kk

Inventors

• Sumida Takayuki
• Maruyama Ayako
• Akiyama Takahiro
• Setomoto Yutaka

Classifications

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• H04R31/00

  Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title

• B81C1/00531 Primary

  Dry etching · CPC title

• B81C1/00158

  Diaphragms, membranes (manufacture process for semi-permeable inorganic membranes B01D67/0039) · CPC title

• B06B1/0292 Primary

  Electrostatic transducers, e.g. electret-type · CPC title