Additive manufacturing by selective liquid cooling

US11504904B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11504904-B2
Application numberUS-202016935913-A
CountryUS
Kind codeB2
Filing dateJul 22, 2020
Priority dateAug 23, 2017
Publication dateNov 22, 2022
Grant dateNov 22, 2022

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of additively manufacturing parts by selectively cooling a liquefied thermoplastic material.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for manufacturing a thermoplastic article, comprising: a) heating a layer of liquid thermoplastic material in a build tray having a base that contains or is in contact with an array of heat exchange elements each of which are configured to independently heat or cool a respective area of the build tray; b) cooling a platen to at or below a solidification temperature of the thermoplastic material and placing the cooled platen on a top surface of the layer of liquid thermoplastic material in the build tray creating a liquid interface between both the array of heat exchange elements and the cooled platen; c) causing the array of heat exchange elements to cool areas of the build tray corresponding to locations where the thermoplastic article is to be formed, causing the liquid thermoplastic material to cool and solidify in selected areas to create a first layer of the thermoplastic article adhered to a bottom surface of the cooled platen; d) causing the array of heat exchange elements to liquefy a bottom portion of said cooled and solidified first layer of thermoplastic material sufficient to allow release of said cooled and solidified first layer of the thermoplastic article from the build tray as the cooled platen is raised; e) refilling the build tray with a new layer of liquid thermoplastic material; f) lowering the cooled platen, together with prior cooled and solidified layers of the thermoplastic article, so that a bottommost surface of the prior cooled and solidified layers of the thermoplastic article is in contact with a top surface of the new layer of liquid thermoplastic material; g) causing the array of heat exchange elements to cool areas of the build tray corresponding to locations where a subsequent layer of the thermoplastic article is to be formed, causing the liquid thermoplastic material to cool and solidify in selected areas to create said subsequent layer of the thermoplastic article, adhered to the bottom surface of the prior cooled and solidified layers of the thermoplastic article adhered to the cooled platen; h) causing the array of heat exchange elements to liquefy a bottom portion of said cooled and solidified subsequent layer of thermoplastic material sufficient to allow release of said cooled and solidified subsequent layer of the thermoplastic article from the build tray as the cooled platen is raised; repeating steps e) through h) as necessary until a complete thermoplastic article is formed.

Assignees

Inventors

Classifications

  • Thermoplastic materials · CPC title

  • Platforms or substrates (support structures intended to be sacrificed after manufacture B29C64/40) · CPC title

  • by matrix printers {(G06K15/028 takes precedence)} · CPC title

  • Processes of additive manufacturing · CPC title

  • Liquid or visquous · CPC title

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11504904B2 cover?
A method of additively manufacturing parts by selectively cooling a liquefied thermoplastic material.
Who is the assignee on this patent?
Evapco Inc
What technology area does this patent fall under?
Primary CPC classification B29C64/124. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 22 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).