Biocompatible electromechanical connection for ceramic substrate electronics for biomedical implant

Patent metadata

Field	Value
Publication number	US-11504453-B2
Application number	US-201916655609-A
Country	US
Kind code	B2
Filing date	Oct 17, 2019
Priority date	Nov 29, 2018
Publication date	Nov 22, 2022
Grant date	Nov 22, 2022

Abstract

A biocompatible electrical connection includes: a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The substrate includes a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule, the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and the second adhesive fills the annular space between the hole and the ferrule.

First claim

What is claimed is:

1. A biocompatible electrical connector, comprising:
a substrate;
a ferrule comprising a concentric flange at a first end of the ferrule;
a first adhesive; and
a second adhesive,
wherein:
the substrate comprises a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule,
the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and
the second adhesive fills the annular space between the hole and the ferrule.

2. The biocompatible electrical connector of claim 1 , wherein the ferrule further comprises a substantially concentric through hole configured to accept a conductive wire lead.

3. The biocompatible electrical connector of claim 2 , wherein an electrical connection between the conductive wire lead and the ferrule is formed by a welded joint between the conductive wire lead and the ferrule around a circumference of the through hole.

4. The biocompatible electrical connector of claim 3 , wherein the welded joint is formed using one of a laser welding process and a resistive welding process.

5. The biocompatible electrical connector of claim 1 , wherein the substrate comprises a ceramic material.

6. The biocompatible electrical connector of claim 1 , wherein the ferrule comprises one of a platinum-iridium (Pt—Ir) material and an implant grade stainless steel.

7. The biocompatible electrical connector of claim 1 , wherein the first adhesive and the second adhesive comprise one of a platinum-gold ink and a ceramic-platinum-gold ink.

8. A method for forming a biocompatible electrical connection, the method comprising:
forming a hole in a substrate;
applying a first adhesive on a first surface of the substrate around a circumference of the hole;
inserting a ferrule comprising a concentric flange at a first end into the hole, wherein a diameter of the hole is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule, and wherein the first adhesive adheres a first surface of the concentric flange to a first surface of the substrate;
filling the annular space between the hole and the ferrule with a second adhesive; and
curing the first adhesive and the second adhesive to form a bond between the ferrule and the substrate.

9. The method of claim 8 , wherein the curing the first adhesive and the second adhesive comprises:
firing the substrate with the first adhesive applied to the substrate and the ferrule inserted; and
firing the substrate again with the annular space between the hole and the ferrule filled with the second adhesive.

10. The method of claim 8 , further comprising:
inserting a conductive wire lead into a substantially concentric through hole in the ferrule; and
forming a welded joint between the conductive wire lead and the ferrule around a circumference of the through hole.

11. The method of claim 10 , wherein the forming a welded joint comprises using one of a laser welding process and a resistive welding process to weld the conductive wire lead and the ferrule.

12. The method of claim 8 , wherein the applying a first adhesive comprises using a screen printing process to apply the first adhesive to the substrate around the circumference of the hole.

13. The method of claim 8 , wherein the filling the annular space comprises using a syringe to inject the first adhesive into the annular space.

14. The method of claim 8 , wherein the substrate comprises a ceramic material.

15. The method of claim 8 , wherein the ferrule comprises one of a platinum-iridium (Pt—Ir) material and an implant grade stainless steel.

16. The method of claim 8 , wherein the first adhesive and the second adhesive comprise one of a platinum-gold ink and a ceramic-platinum-gold ink.

17. A biocompatible device, comprising:
electronic circuitry enclosed in a conductive biocompatible housing; and
a biocompatible antenna disposed external to the conductive biocompatible housing and electrically connected to the electronic circuitry; and
a biocompatible electrical connector configured to electrically connect the biocompatible antenna to the electronic circuitry,
wherein the biocompatible electrical connector comprises:
a ferrule having a concentric flange at a first end of the ferrule;
a first adhesive;
a second adhesive; and
a substrate comprising a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule,
wherein the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and
wherein the second adhesive fills the annular space between the hole and the ferrule.

18. The biocompatible device of claim 17 , wherein the ferrule further comprises a substantially concentric through hole configured to accept a conductive wire lead.

19. The biocompatible device of claim 18 , wherein an electrical connection between the conductive wire lead and the ferrule is formed by a welded joint between the conductive wire lead and the ferrule around a circumference of the through hole.

20. The biocompatible device of claim 19 , wherein the welded joint is formed using one of a laser welding process and a resistive welding process.

Assignees

• Verily Life Sciences Llc

Inventors

• Loo Alexander
• Patron Damiano
• Page Matthew

Classifications

• H05K2201/0959

  Plated through-holes or plated blind vias filled with insulating material · CPC title

• H05K3/321

  by conductive adhesives · CPC title

• H05K2201/10295

  Metallic connector elements partly mounted in a hole of the PCB · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• A61L31/026 Primary

  Ceramic or ceramic-like structures, e.g. glasses · CPC title