Kinematic mount for active MEMS alignment with multi-degree-of-freedom comprising plural spring-loaded posts

Patent metadata

Field	Value
Publication number	US-11500064-B2
Application number	US-202016881931-A
Country	US
Kind code	B2
Filing date	May 22, 2020
Priority date	May 22, 2020
Publication date	Nov 15, 2022
Grant date	Nov 15, 2022

Abstract

A MEMS board assembly, a LiDAR system including the same, and a method for making the same are disclosed. The exemplary MEMS board assembly includes a MEMS board having a plurality of through holes and a mount having a plurality of threaded holes. The MEMS board assembly further includes a plurality of spring-loaded posts each formed by fitting a spring into a respective post. The plurality of spring-loaded posts are fitted into the plurality of threaded holes of the mount. The MEMS board assembly also includes a plurality of screws fitting the MEMS board to the mount by reaching into the plurality of threaded holes of the mount through the plurality of through holes in the MEMS board and the plurality of spring-loaded posts. The MEMS board touches the plurality of spring-loaded posts at the plurality of through holes in the MEMS board corresponding to the plurality of threaded holes of the mount respectively.

First claim

What is claimed is:

1. A MEMS board assembly, comprising:
a MEMS board having a plurality of through holes;
a mount having a plurality of threaded holes;
a plurality of spring-loaded posts each formed by fitting a spring into a respective post, wherein the plurality of spring-loaded posts are fitted into the plurality of threaded holes of the mount; and
a plurality of screws fitting the MEMS board to the mount by reaching into the plurality of threaded holes of the mount through the plurality of through holes in the MEMS board and the plurality of spring-loaded posts, wherein the MEMS board touches the plurality of spring-loaded posts at the plurality of through holes in the MEMS board corresponding to the plurality of threaded holes of the mount respectively,
wherein the MEMS board and the mount are separated by the spring-loaded posts after the MEMS board is fitted to the mount by the plurality of screws.

2. The MEMS board assembly of claim 1 , further comprising a bracket, wherein the plurality of screws further fits the bracket to the MEMS board by reaching through a plurality of through holes of the bracket before reaching through the plurality of through holes of the MEMS board.

3. The MEMS board assembly of claim 1 , wherein the MEMS board is adjusted to a target position by turning the plurality of screws.

4. The MEMS board assembly of claim 3 , further comprising means for securing the MEMS board at the target position.

5. The MEMS board assembly of claim 4 , wherein the means for securing the MEMS board at the target position includes glue applied in clearances among the plurality of spring-loaded posts, the MEMS board or the mount.

6. The MEMS board assembly of claim 5 , wherein the clearances are in a range of 0.1-0.2 mm.

7. The MEMS board assembly of claim 1 , wherein the mount is rectangular or square, wherein the plurality of spring-loaded posts include four spring-loaded posts each fitted to a corner of the mount respectively.

8. The MEMS board assembly of claim 1 , wherein each of the plurality of spring-loaded posts has a thickness of 2-3 mm.

9. A MEMS board assembly made by a method for aligning a MEMS board with a mount, wherein the method comprises:
fitting a plurality of spring-loaded posts into a plurality of threaded holes of the mount respectively, wherein each spring-loaded post is formed by fitting a spring into a respective post;
fitting the MEMS board to the mount with a plurality of screws reaching into the plurality of threaded holes of the mount through a plurality of through holes in the MEMS board and the plurality of spring-loaded posts; and
adjusting the MEMS board to a target position by turning the plurality of screws,
wherein the MEMS board and the mount are separated by the spring-loaded posts after the MEMS board is adjusted to the target position.

10. The MEMS board assembly of claim 9 , wherein the method further comprises:
fitting a bracket to the MEMS board by applying the plurality of screws through a plurality of through holes of the bracket before applying the plurality of screws through the plurality of through holes of the MEMS board.

11. The MEMS board assembly of claim 9 , wherein the method further comprises:
securing the MEMS board at the target position.

12. The MEMS board assembly of claim 11 , wherein securing the MEEMS board further comprises:
applying glue in clearances among the plurality of spring-loaded posts, the MEMS board or the mount.

13. The MEMS board assembly of claim 12 , wherein the clearances are in range of 0.1-0.2 mm.

14. The MEMS board assembly of claim 9 , wherein the method further comprises:
fitting the plurality of spring-loaded posts into the plurality of threaded holes of the mount.

15. The MEMS board assembly of claim 9 , wherein the method further comprises:
moving the MEMS board until the MEMS board touches the plurality of spring-loaded posts at the plurality of through holes in the MEMS board corresponding to the plurality of threaded holes of the mount, respectively.

16. A LiDAR system, comprising:
a transmitter configured to emit a light beam to scan an object; and
a receiver configured to detect the light beam returned by the object,
wherein at least one of the transmitter or the receiver includes a MEMS board assembly, comprising:
a MEMS board having a plurality of through holes;
a mount having a plurality of threaded holes;
a plurality of spring-loaded posts each formed by fitting a spring into a respective post, wherein the plurality of spring-loaded posts are fitted into the plurality of threaded holes of the mount; and
a plurality of screws fitting the MEMS board to the mount by reaching into the plurality of threaded holes of the mount through the plurality of through holes in the MEMS board and the plurality of spring-loaded posts, wherein the MEMS board touches the plurality of spring-loaded posts at the plurality of through holes in the MEMS board corresponding to the plurality of threaded holes of the mount respectively,
wherein the MEMS board and the mount are separated by the spring-loaded posts after the MEMS board is fitted to the mount by the plurality of screws.

17. The LiDAR system of claim 16 , wherein the MEMS board assembly further comprises glue applied in clearances among the plurality of spring-loaded posts, the MEMS board or the mount, for securing the MEMS board at a target position.

18. The LiDAR system of claim 17 , wherein the clearances are in range of 0.1-0.2 mm.

19. The LiDAR system of claim 16 , wherein the mount is rectangular or square, wherein the plurality of spring-loaded posts include four spring-loaded posts each fitted to a corner of the mount respectively.

20. The LiDAR system of claim 16 , wherein the MEMS board assembly further comprises a bracket, wherein the plurality of screws further fits the bracket to the MEMS board by reaching through a plurality of through holes of the bracket before reaching through the plurality of through holes of the MEMS board.

Assignees

• Beijing Voyager Tech Co Ltd

Inventors

• Pan Anan
• Jiang Henghui

Classifications

• G01S7/4817 Primary

  relating to scanning · CPC title

• G01S17/10

  using transmission of interrupted, pulse-modulated waves (determination of distance by phase measurements G01S17/32) · CPC title

• H05K2201/10265

  Metallic coils or springs, e.g. as part of a connection element · CPC title

• H05K2201/10409

  Screws · CPC title

• G01S17/931

  of land vehicles · CPC title