Inspection of bonding quality of transparent materials using optical coherence tomography

Patent metadata

Field	Value
Publication number	US-11499814-B2
Application number	US-201915734168-A
Country	US
Kind code	B2
Filing date	Jun 12, 2019
Priority date	Jun 13, 2018
Publication date	Nov 15, 2022
Grant date	Nov 15, 2022

Abstract

An optical coherence tomography (OCT) system ( 63 ) is used to inspect bonding points ( 66 A, 66 B, 66 C) sandwiched between two materials (layers 62, 64 of e.g. displays). The OCT differentiates between a bonding point, e.g. a weld, and air gaps between the two materials. The bonding points are identified as breaks in the air gap between the materials. By extracting various physical characteristics of the bonding points and the gap between the two materials, the present system determines whether the bonding is faulty.

First claim

The invention claimed is:

1. A method for inspecting a bonding of two materials using an optical coherence tomography (OCT) system generating a sample beam of radiation, the two materials being glass and laser bonded together at a bonding point sandwiched between them wherein the laser bond is transparent to the sample beam, wherein there are air gaps between the two materials proximate to the bonding point, the method comprising:
applying the sample beam through a first of the two materials and into at least a portion of the second material to reach and acquire scan data associated with the bonding point and proximate air gaps sandwiched between the two materials; and
selectively designating the bonding of the two materials as defective based on the scanned data.

2. The method of claim 1 , further including:
defining a metrological property of the bonding of the two materials based on the scan data, the metrological property including at least one of a thickness, refractive index, and birefringence of at least a select one of the two materials and any other physical layer therebetween;
wherein the designating of the bonding of the two materials as defective is further based on the defined metrological property.

3. The method of claim 1 , further including:
defining a measure of a width-span of the bonding point at the junction between the two materials based on the scan data;
wherein the designating of the bonding of the two materials as defective is based at least in part on the measure of the width-span.

4. The method of claim 1 , wherein the bonding point is part of a bonding region extending into the two materials, the method further including:
defining an axial offset of the bonding region relative to a junction between the two materials based on the scan data, the designating of the bonding of the two materials as defective being based at least in part on the defined axial offset.

5. The method of claim 4 , wherein the axial offset is determined based on a predefined correlation between axial offset and width-span of the bonding point at the junction between the two materials.

6. The method of claim 1 , wherein the scan data of the bonding point is acquired as part of scanning the sample beam across a region of the junction between the two materials including the bonding point, the method further comprising:
defining an image of the junction between the two materials based on the scanning of the sample beam across the region of the junction, a relative gap size in the junction between the two materials corresponding to a relative intensity in the defined image;
comparing a relative intensity of a first region of the junction adjacent to the bonding point with a second region of the junction distant from the bonding point; and
designating the bonding of the two materials as defective in response to the intensity of the second region being a predetermined percentage greater than the intensity of the first region.

7. The method of claim 1 , wherein the sample beam is further applied through the two materials and laterally scanned across the two materials, the method further comprising:
defining a two-dimensional, cross-sectional image of the two materials based on the lateral scan across the two materials, the cross-sectional image providing a plurality of imaged lines including true boundary lines of the two materials and phantom boundary lines of the two materials, the phantom boundary lines resulting from a complex conjugate image component and being offset from the true boundary lines; and
identifying as the junction between the two materials the imaged line closest to an axial location having a predefined offset from an outer boundary of a selected one of the two materials, the predefined offset being a thickness of the selected one of the two materials.

8. The method of claim 1 , wherein:
the bonding point is part of a bonding region that extends into the two materials, the bonding region having a light dispersion property different from either of the two materials;
a wavelength of the sample beam is selected based on the light dispersion property of the bounding region to differentiate the bounding region from the two materials; and
the sample beam penetrates the bonding region and provides axial information of the bonding region; and
the method further including, defining a three-dimensional image of the bonding region within the two materials.

9. The method of claim 1 , wherein the OCT system is one of a spectral domain point scanning system, a swept source point scanning system, a spectral domain line scanning system, a swept source line scanning system, a full field spectral domain, or a full field swept source system.

10. The method of claim 1 , wherein the OCT system and the two bonded materials are continuously displaced relative to each other along a first lateral dimension as the OCT system applies the sample beam.

11. The method of claim 10 , wherein the OCT system scans the sample beam in first direction traversing the first lateral dimension and in a second direction opposite to the relative continuous displacement between the OCT system and the two bonded materials so as to counter the relative continuous displacement.

12. The method of claim 1 , wherein the OCT system includes at least one of a galvanometer scanner, a MEMS scanner, an electro-optical deflector, and a rotating polygon scanner.

13. The method of claim 1 , wherein the scan data is obtained by use of a speckle-reduced wiggle scan.

14. The method of claim 1 , wherein:
the scan data includes repeated scans of the bonding point; and
the method further including, generating multiple images from the repeated scans of the bonding point, and averaging the multiple images.

15. The method of claim 1 , further including defining an en face image, the designating of the bonding of the two materials as defective being based at least in part on the en face image.

16. The method of claim 1 , wherein the two bonded materials are parts of an electronic image display.

17. The method of claim 1 , wherein the OCT system lacks any scanning components and is one of a spectral domain full field OCT system or a swept source full field OCT system.

18. The method of claim 1 , wherein the OCT system is optimized for the specular reflection of any dielectric interface.

19. The method of claim 1 , wherein:
the two materials are bonded by a welding process;
the OCT system is a PS-OCT system;
the PS-OCT system measures birefringence properties of the two materials and the bonding point before, during, and after the welding process; and
the bonding of the two materials is further designated as defective based on the measured birefringence properties.

20. The method of claim 1 , wherein the OCT system has a light source and introduces known delays to at least two light beams from its light source, the at least two light beams being combined to constitute the OCT beam.

21. The method of claim 1 , further including:
defining a metrological property of the bonding of the two materials using the OCT system and at least one other inspection method, including visual inspection, reflectometers, deflectometers, ellipsometers, or spectroscopic ellipsometers, the metrological property including at least one of a thickness, refractive index, and birefringence of at least a select one of the two materials and any other physical layer there between;
wherein the designating of the bonding of the two materials as defective is

Assignees

• Zeiss Carl Meditec Inc
• Zeiss Carl Ag
• Carl Zeiss Ind Metrology Llc
• Zeiss Carl Meditec Ag

Inventors

• Totzeck Michael
• Bauza Marcin B
• Straub Jochen
• Arain Muzammil
• Everett Matthew J

Classifications

• G01N21/45

  using interferometric methods; using Schlieren methods · CPC title

• G01N21/8422 Primary

  Investigating thin films, e.g. matrix isolation method · CPC title

• G01N21/88

  Investigating the presence of flaws or contamination · CPC title

• G01B9/02091 Primary

  Tomographic interferometers, e.g. based on optical coherence · CPC title

• A61B3/102

  for optical coherence tomography [OCT] · CPC title