Floor panel and method for manufacturing a floor panel

Patent metadata

Field	Value
Publication number	US-11499322-B2
Application number	US-202016751418-A
Country	US
Kind code	B2
Filing date	Jan 24, 2020
Priority date	Oct 3, 2016
Publication date	Nov 15, 2022
Grant date	Nov 15, 2022

Abstract

Floor panel, which includes a substrate and a top layer provided above, and preferably directly above, the substrate, where the top layer includes a décor layer, a thermoplastic wear layer, and a lacquer layer provided above, and preferably directly above, the wear layer, and where the floor panel has an upper surface showing a relief, where the relief has a maximum relief depth which is larger than 100 microns, and where the wear layer and the lacquer layer are embossed in order to form the relief.

First claim

The invention claimed is:

1. A method for manufacturing a floor panel, wherein the floor panel has an upper surface showing a relief with a maximum relief depth which is larger than 100 microns, and wherein the method comprises the following steps:
providing a substrate;
providing a top layer above the substrate, which top layer comprises a decor layer, a thermoplastic wear layer, and a lacquer layer provided above the wear layer; and
embossing together, the wear layer and the lacquer layer in order to form the relief;
wherein above the lacquer layer an additional lacquer layer is provided;
wherein both the lacquer layer and the additional lacquer layer are cured together.

2. The method according to claim 1 , wherein the lacquer layer is provided directly above the wear layer.

3. The method according to claim 1 , wherein the lacquer layer is provided above the wear layer prior to providing this latter with any relief.

4. The method according to claim 1 , wherein the lacquer layer is provided on the wear layer by means of a roller.

5. The method according to claim 4 , wherein the roller is a rubber roller.

6. The method according to claim 1 , wherein the wear layer is connected to a remaining or underlying part of the floor panel.

7. The method according to claim 1 , wherein the floor panel, after the relief is formed, is immersed in a water bath.

8. The method according to claim 1 , wherein the lacquer layer is cured after it is embossed.

9. The method according to claim 1 , wherein the lacquer layer is partially cured or dried prior to being embossed.

10. The method according to claim 1 , wherein the wear layer is connected to a remaining or underlying part of the floor panel, and wherein the lacquer layer is provided above the wear layer and is partially cured or dried prior to connecting this wear layer to the remaining or underlying part of the floor panel.

11. The method according to claim 1 , wherein the additional lacquer layer is situated directly above the embossed lacquer layer.

12. The method according to claim 1 , wherein the additional lacquer layer is provided after the relief is formed.

13. The method according to claim 1 , wherein the additional lacquer layer is not embossed or deformed.

14. The method of claim 1 , wherein the maximum relief depth exceeds 200 microns.

15. The method of claim 1 , wherein the lacquer layer and the additional lacquer layer are performed with the same gloss degree.

16. A method for manufacturing a floor panel, wherein the floor panel has an upper surface showing a relief, and wherein this method comprises at least the following steps:
providing a substrate;
providing a top layer above the substrate, which top layer comprises a decor layer, a thermoplastic wear layer, and a lacquer layer provided above the wear layer;
embossing together, the wear layer and the lacquer layer in order to form the relief; and
providing an additional lacquer layer above the lacquer layer after the relief has been formed;
wherein both the lacquer layer and the additional lacquer layer are cured together.

17. The method according to claim 16 , wherein the maximum relief depth is not larger than 100 microns.

18. The method according to claim 16 , wherein the lacquer layer is partially cured or dried prior to being embossed.

19. A method for manufacturing a floor panel, wherein the floor panel has an upper surface showing a relief, and wherein this method comprises the following steps:
providing a substrate;
providing a top layer above the substrate, which top layer comprises a decor layer, a thermoplastic wear layer, and a lacquer layer provided above the wear layer;
connecting the wear layer to a remaining or underlying part of the floor panel;
providing the lacquer layer above the wear layer prior to connecting the wear layer to the remaining or underlying part of the floor panel; and
embossing together, the wear layer and the lacquer layer in order to form the relief;
wherein above the lacquer layer an additional lacquer layer is provided;
wherein both the lacquer layer and the additional lacquer layer are cured together.

20. The method according to claim 19 , wherein the maximum relief depth is not larger than 100 microns.

21. The method according to claim 19 , wherein the lacquer layer is partially cured or dried prior to being embossed.

Assignees

• Flooring Ind Ltd Sarl

Inventors

• Van Vlassenrode Kristof
• Vanhulle Nick

Classifications

• B32B38/06

  Embossing · CPC title

• B32B2307/414

  Translucent · CPC title

• B32B2255/28

  Multiple coating on one surface · CPC title

• E04F15/105 Primary

  of organic plastics with or without reinforcements or filling materials · CPC title

• B32B27/10

  of paper or cardboard · CPC title