Refrigeration systems

Patent metadata

Field	Value
Publication number	US-11498686-B2
Application number	US-201916562868-A
Country	US
Kind code	B2
Filing date	Sep 6, 2019
Priority date	Sep 6, 2019
Publication date	Nov 15, 2022
Grant date	Nov 15, 2022

Abstract

A refrigeration system can include a main flow circuit configured to flow a refrigerant therethrough and a heat input disposed in the main flow circuit and configured to receive heat and transfer the heat to the refrigerant in the main flow circuit to output heated refrigerant flow. The system can include a passive pump disposed in the main flow circuit downstream of the heat input configured to receive the heated refrigerant flow from the heat input and to use the heated refrigerant flow to generate a vacuum at a pump port and a condenser disposed in the main flow circuit downstream of the passive pump for receiving flow from the passive pump. The condenser can be configured to receive heat from the heated refrigerant flow and reject heat to cool the heated refrigerant flow to output partially cooled refrigerant flow. An outlet of the condenser can be upstream of the heat input.

First claim

What is claimed is:

1. A refrigeration system, comprising:
a main flow circuit configured to flow a refrigerant therethrough;
a heat input disposed in the main flow circuit and configured to receive heat and transfer the heat to the refrigerant in the main flow circuit to output heated refrigerant flow;
a passive pump disposed in the main flow circuit downstream of the heat input configured to receive the heated refrigerant flow from the heat input and to use the heated refrigerant flow to generate a vacuum at a pump port,
a condenser disposed in the main flow circuit downstream of the passive pump for receiving flow from the passive pump, the condenser configured to receive heat from the heated refrigerant flow and reject heat to cool the heated refrigerant flow to output partially cooled refrigerant flow, wherein an outlet of the condenser is upstream of the heat input;
a cooling branch having a cooling branch inlet in fluid communication with the main flow circuit and disposed downstream of the condenser, and a cooling branch outlet in fluid communication with the passive pump port to generate flow through the cooling branch with heated refrigerant flow through the passive pump;
one or more cooling modules disposed in the cooling branch downstream of the cooling branch inlet and upstream of the cooling branch outlet, the one or more cooling modules configured to provide cooling to a heat source;
at least one expander disposed in the cooling branch between the cooling branch inlet and the one or more cooling modules, the expander configured to receive the partially cooled refrigerant flow and cause expansion cooling to output cooling flow to the one or more cooling modules, wherein the one or more cooling modules includes a plurality of cooling modules disposed downstream of the at least one expander, wherein the plurality of cooling modules are disposed in parallel with each other such that all cooling modules are connected to the cooling branch inlet directly and all cooling modules are connected to the cooling branch outlet directly, wherein the heat input includes a heat exchanger in thermal communication with a waste heat source of an aircraft system, and wherein the plurality of cooling modules are in thermal communication with one or more aircraft electronics.

2. The system of claim 1 , further comprising a non-passive pump disposed in the main flow circuit downstream of the condenser and configured to add and/or generate flow in one direction within the main flow circuit.

3. The system of claim 2 , wherein the non-passive pump is also downstream of the cooling branch inlet.

4. The system of claim 1 , wherein the plurality of cooling modules include a wafer heat exchanger comprising a flat shape having a tortuous, planar refrigerant flow path defined therein.

5. The system of claim 4 , wherein the wafer heat exchanger includes an adhesive surface configured to stick to the heat source.

6. The system of claim 1 , wherein one or more of the plurality of cooling modules are in thermal communication with one or more respective aircraft electronics circuits to provide cooling to one or more aircraft avionics electrical circuits.

7. An aircraft electronics system, comprising:
one or more avionics electrical circuits; and
a refrigeration system operatively connected to the one or more avionics electrical circuits, comprising:
a main flow circuit configured to flow a refrigerant therethrough;
a heat input disposed in the main flow circuit and configured to receive heat and transfer the heat to the refrigerant in the main flow circuit to output heated refrigerant flow;
a passive pump disposed in the main flow circuit downstream of the heat input configured to receive the heated refrigerant flow from the heat input and to use the heated refrigerant flow to generate a vacuum at a pump port,
a condenser disposed in the main flow circuit downstream of the passive pump for receiving flow from the passive pump, the condenser configured to receive heat from the heated refrigerant flow and reject heat to cool the heated refrigerant flow to output partially cooled refrigerant flow, wherein an outlet of the condenser is upstream of the heat input;
a cooling branch having a cooling branch inlet in fluid communication with the main flow circuit and disposed downstream of the condenser, and a cooling branch outlet in fluid communication with the passive pump port to generate flow through the cooling branch with heated refrigerant flow through the passive pump;
one or more cooling modules disposed in the cooling branch downstream of the cooling branch inlet and upstream of a cooling branch outlet, the one or more cooling modules in thermal communication with the one or more aircraft avionics electrical circuits and configured to provide cooling to the one or more aircraft avionics electrical circuits; and
at least one expander disposed in the cooling branch between the cooling branch inlet and the one or more cooling modules, the expander configured to receive the partially cooled refrigerant flow and cause expansion cooling to output cooling flow to the one or more cooling modules, wherein the one or more cooling modules includes a plurality of cooling modules disposed downstream of the at least one expander, wherein the plurality of cooling modules are disposed in parallel with each other such that all cooling modules are connected to the cooling branch inlet directly and all cooling modules are connected to the cooling branch outlet directly, wherein the heat input includes a heat exchanger in thermal communication with a waste heat source of an aircraft system and wherein the plurality of cooling modules are in thermal communication with one or more aircraft electronics.

8. The system of claim 7 , wherein the refrigeration system further comprises a non-passive pump disposed in the main flow circuit downstream of the condenser and configured to add and/or generate flow in one direction within the main flow circuit.

9. The system of claim 8 , wherein the non-passive pump is also downstream of the cooling branch inlet.

10. The system of claim 7 , wherein the plurality of cooling modules include a wafer heat exchanger comprising a flat shape having a tortuous, planar refrigerant flow path defined therein.

11. The system of claim 10 , wherein the wafer heat exchanger includes an adhesive surface configured to stick to the one or more aircraft avionics electrical circuits.

12. A method, comprising:
cooling a heat source using waste heat from an aircraft system and without using a compressor, wherein using waste heat includes using the waste heat to drive an ejector pump to generate flow through a cooling branch to provide cooling flow to one or more cooling modules in thermal communication with the heat source, wherein the one or more cooling modules includes a plurality of cooling modules are disposed in parallel with each other, wherein the plurality of cooling modules are in thermal communication with one or more aircraft electronics.

Assignees

• Hamilton Sundstrand Corp

Inventors

• Alahyari Abbas A
• Elsherbini Abdelrahman I

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• F25B9/08 Primary

  using ejectors (F25B9/10 takes precedence) · CPC title

• B64D13/06 Primary

  the air being conditioned (pressurising B64D13/02) · CPC title

• Y02A30/274

  using waste energy, e.g. from internal combustion engine · CPC title

• F25B1/08

  using vapour under pressure · CPC title