Polishing method and polishing pad

US11498182B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11498182-B2
Application numberUS-201716074668-A
CountryUS
Kind codeB2
Filing dateFeb 20, 2017
Priority dateFeb 26, 2016
Publication dateNov 15, 2022
Grant dateNov 15, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A disc-shaped polishing pad ( 1 ) is used for a polishing method of the present invention. The polishing pad ( 1 ) has a peripheral surface ( 111 ) on a polishing surface ( 10 ) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface ( 10 ). An angle formed by the peripheral surface ( 111 ) and the polishing surface ( 10 ) is 125° or more and less than 180°. The polishing pad ( 1 ) has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface ( 10 ). The polishing surface ( 10 ) is pressed against the polished surface and the polishing pad ( 1 ) is moved to polish the polished surface.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polishing method comprising: providing a disc-shaped polishing pad, wherein: the polishing pad has a peripheral surface on a polishing surface side in an axial direction of a disc of a tapered surface whose diameter is reduced to the polishing surface; the polishing pad has an angle formed by the peripheral surface on the polishing surface side and the polishing surface of 125° or more and less than 180°; and the polishing pad has a hardness of 40 or more, determined according to Annex 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”; supplying a slurry containing abrasives to a polished surface larger than the polishing surface; and pressing the polishing surface against the polished surface and moving the polishing pad to polish the polished surface, wherein the polished surface is a concave curved surface that is a coated film surface of part of a vehicle, a railway vehicle, an aircraft, a bicycle, or a ship. 2. The polishing method according to claim 1 , wherein the polishing surface has a diameter of 10 mm or more and 200 mm or less. 3. The polishing method according to claim 1 , wherein a support layer softer than the polishing pad is fixed to a surface on a side opposite to the polishing surface of the polishing pad. 4. The polishing method according to claim 1 , wherein the polished surface is a surface made of a synthetic resin. 5. The polishing method according to claim 1 , wherein a support layer softer than the polishing pad is fixed to a surface on a side opposite to the polishing surface of the polishing pad, and the support layer has a thickness of 2.0 mm or more and 50 mm or less. 6. A polishing method comprising: providing a disc-shaped polishing pad, wherein: the polishing pad has a peripheral surface on a polishing surface side in an axial direction of a disc of an arc surface; and the polishing pad has a hardness of 40 or more, determined according to Annex 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”; supplying a slurry containing abrasives to a polished surface larger than the polishing surface; and pressing the polishing surface against the polished surface and moving the polishing pad to polish the polished surface, wherein the polished surface is a concave curved surface that is a coated film surface of part of a vehicle, a railway vehicle, an aircraft, a bicycle, or a ship. 7. The polishing method according to claim 6 , wherein the polishing surface has a diameter of 10 mm or more and 200 mm or less. 8. The polishing method according to claim 6 , wherein a support layer softer than the polishing pad is fixed to a surface on a side opposite to the polishing surface of the polishing pad, and the support layer has a thickness of 2.0 mm or more and 50 mm or less. 9. A polishing method comprising: supplying a slurry containing abrasives to a polished surface; providing a polishing pad in which having a hardness of 40 or more and 80 or less, determined according to Annex 2 of JIS K7312: 1996 “Spring Hardness Test Type C Testing Method”; and pressing a polishing surface of the polishing pad against the polished surface and moving the polishing pad to polish the polished surface, wherein a support layer softer than the polishing pad is fixed to a surface on a side opposite to the polishing surface of the polishing pad, and the support layer has a thickness of 2.0 mm or more and 50 mm or less; and wherein the polished surface is a concave curved surface that is a coated film surface of part of a vehicle, a railway vehicle, an aircraft, a bicycle, or a ship. 10. The polishing method according to claim 9 , wherein the polishing surface has a groove. 11. The polishing method according to claim 10 , wherein the groove has a width of 0.5 mm or more and 5.0 mm or less. 12. The polishing method according to claim 9 , wherein: the polishing surface has a diameter of 10 mm or more and 200 mm or less, and the polishing surface is smaller than the polished surface.

Assignees

Inventors

Classifications

  • acting by the front face · CPC title

  • B24B37/22Primary

    characterised by a multi-layered structure · CPC title

  • B24B37/24Primary

    characterised by the composition or properties of the pad materials · CPC title

  • Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents (polishing tools in general B24D13/00) · CPC title

  • designed for particular workpieces · CPC title

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Frequently asked questions

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What does patent US11498182B2 cover?
A disc-shaped polishing pad ( 1 ) is used for a polishing method of the present invention. The polishing pad ( 1 ) has a peripheral surface ( 111 ) on a polishing surface ( 10 ) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface ( 10 ). An angle formed by the peripheral surface ( 111 ) and the polishing surface ( 10 ) is 125° or more a…
Who is the assignee on this patent?
Fujimi Inc
What technology area does this patent fall under?
Primary CPC classification B24B37/22. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 15 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).